公开(公告)号：US09631797B2

公开(公告)日：2017-04-25

申请号：US14546042

申请日：2014-11-18

Applicant: NICHIA CORPORATION

Inventor： Hiroshi Miyairi ,  Takayuki Igarashi ,  Masato Fujitomo ,  Satoshi Shirahama

IPC: F21V19/00 ,  F21V29/70 ,  F21V29/74 ,  F21V29/505 ,  F21Y101/00

CPC classification number: F21V19/003 ,  F21V19/0055 ,  F21V29/505 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.

公开(公告)号：US09905740B2

公开(公告)日：2018-02-27

申请号：US14975860

申请日：2015-12-21

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shirahama

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H05K3/34

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2933/0033 ,  H05K3/3431 ,  H05K2201/10106 ,  H05K2201/10234 ,  Y02P70/613

Abstract: A light emitting device includes a light emitting element, a light-reflecting substrate, and an electrically conductive member. The light emitting element includes a first surface and an electrode provided on the first surface. The light-reflecting substrate has a first main surface facing the first surface of the light emitting element and has a second main surface opposite to the first main surface. The light-reflecting substrate defines a hole at a position corresponding to the electrode. The hole penetrates through the light-reflecting substrate from the first main surface to the second main surface. The electrically conductive member includes a substantially spherical core arranged in the hole and bonded with the electrode, and a coating portion provided in a space between the substantially spherical core and a lateral surface of the hole.

公开(公告)号：US09466770B2

公开(公告)日：2016-10-11

申请号：US15041897

申请日：2016-02-11

Applicant: Nichia Corporation

Inventor： Takashi Sato ,  Satoshi Shirahama

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/502 ,  C09K11/02 ,  C09K11/7774 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05B33/04 ,  H05B33/10 ,  H01L2924/00014

Abstract: A method for manufacturing a light emitting device having a light emitting element and a resin layer containing fluorescent material particles and a filler which reflects light comprises a fluorescent material precipitation process for precipitating the fluorescent material particles in advance of the filler. A light emitting device comprises a base body; a light emitting element mounted on an upper surface of the base body via a mounting portion; and a sealing resin for sealing the light emitting element. The sealing resin comprises: a fluorescent material-containing first layer for covering the light emitting element on and above the mounting portion, a fluorescent material-containing second layer formed on an upper surface of the base body around the mounting portion, and a filler-containing layer formed on the fluorescent material-containing second layer around the mounting portion.

Abstract translation: 一种具有发光元件的发光器件和含有荧光材料颗粒的树脂层和反射光的填料的制造方法包括在填料之前使荧光材料颗粒沉淀的荧光材料沉淀工艺。 发光装置包括基体; 经由安装部安装在基体的上表面的发光元件; 以及用于密封发光元件的密封树脂。 密封树脂包括：用于覆盖安装部分上方和上方的发光元件的含荧光材料的第一层，围绕安装部分形成在基体的上表面上的含荧光材料的第二层， 围绕安装部分形成在含荧光材料的第二层上。

公开(公告)号：US09295132B2

公开(公告)日：2016-03-22

申请号：US13779070

申请日：2013-02-27

Applicant: Nichia Corporation

Inventor： Takashi Sato ,  Satoshi Shirahama

IPC: H01L33/50 ,  H01L33/54 ,  H05B33/10 ,  H01L33/60 ,  H05B33/04 ,  C09K11/02 ,  H01L33/48

CPC classification number: H01L33/502 ,  C09K11/02 ,  C09K11/7774 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05B33/04 ,  H05B33/10 ,  H01L2924/00014

Abstract: A method for manufacturing a light emitting device having a light emitting element and a resin layer containing fluorescent material particles and a filler which reflects light comprises a fluorescent material precipitation process for precipitating the fluorescent material particles in advance of the filler. A light emitting device comprises a base body; a light emitting element mounted on an upper surface of the base body via a mounting portion; and a sealing resin for sealing the light emitting element. The sealing resin comprises: a fluorescent material-containing first layer for covering the light emitting element on and above the mounting portion, a fluorescent material-containing second layer formed on an upper surface of the base body around the mounting portion, and a filler-containing layer formed on the fluorescent material-containing second layer around the mounting portion.

公开(公告)号：US09281457B2

公开(公告)日：2016-03-08

申请号：US13910245

申请日：2013-06-05

Applicant: Nichia Corporation

Inventor： Satoshi Shirahama

IPC: H01L21/44 ,  H01L21/00 ,  H01L33/52 ,  H01L23/495 ,  H01L23/00 ,  H01L33/62

CPC classification number: H01L33/52 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L33/62 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49429 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/4554

Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.

公开(公告)号：US12051771B2

公开(公告)日：2024-07-30

申请号：US17512328

申请日：2021-10-27

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shirahama

IPC: H01L33/60 ,  H01L27/15

CPC classification number: H01L33/60 ,  H01L27/156 ,  H01L2933/0058

Abstract: A light emitting device includes a substrate, a reflective resin layer, and a light emitting element. The reflective resin layer is disposed on the substrate and contains a first reflective material and a first resin. The reflective resin layer including first flat part having a first thickness, a second flat part having a second thickness smaller than the first thickness, and a protruded part having a third thickness larger than the first thickness. The light emitting element is disposed on the second flat part of the reflective resin layer, with a portion of a lateral face of the protruded part of the reflective resin layer being in contact with a portion of a lateral face of the light emitting element.

公开(公告)号：US09172007B2

公开(公告)日：2015-10-27

申请号：US14138899

申请日：2013-12-23

Applicant: NICHIA CORPORATION

Inventor： Takayuki Igarashi ,  Satoshi Shirahama

IPC: H01L21/00 ,  H01L33/50 ,  H01L33/52

CPC classification number: H01L33/50 ,  H01L33/52 ,  H01L2933/0025 ,  H01L2933/0041

Abstract: A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an LED chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an LED chip on a substrate member, applying a spray coating to a coating object including the LED chip by spraying a powder-containing solution. The applying a spray coating is performed such that a powder-containing solution is sprayed through a solution nozzle arranged above the coating object, as a spray direction of the powder-containing solution indicating a central axis, while using at least one gas nozzle arranged in a surrounding relationship to the central axis, spraying a gas toward the central axis to alter the direction of the spray made of the powder-containing solution.

Abstract translation: 使用喷涂法制造荧光体的发光装置的制造方法可以容易地粘附在LED芯片，透镜状透光树脂构件表面，光学透镜表面等的角部和侧面上。 ，以及该方法中使用的喷涂机。 该方法包括将LED芯片安装在基板部件上，通过喷射含粉末溶液将喷涂施加到包括LED芯片的涂布对象物上。 进行喷雾涂布，使得含粉末溶液通过布置在涂布对象上方的溶液喷嘴喷射，作为指示中心轴的含粉末溶液的喷射方向，同时使用至少一个气体喷嘴，其布置在 与中心轴线的周围关系，向中心轴线喷射气体以改变由含粉末溶液形成的喷雾的方向。

公开(公告)号：US20130169149A1

公开(公告)日：2013-07-04

申请号：US13779070

申请日：2013-02-27

Applicant: Nichia Corporation

Inventor： Takashi Sato ,  Satoshi Shirahama

IPC: H05B33/10 ,  H05B33/04

CPC classification number: H01L33/502 ,  C09K11/02 ,  C09K11/7774 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05B33/04 ,  H05B33/10 ,  H01L2924/00014

Abstract: A method for manufacturing a light emitting device having a light emitting element and a resin layer containing fluorescent material particles and a filler which reflects light comprises a fluorescent material precipitation process for precipitating the fluorescent material particles in advance of the filler. A light emitting device comprises a base body; a light emitting element mounted on an upper surface of the base body via a mounting portion; and a sealing resin for sealing the light emitting element. The sealing resin comprises: a fluorescent material-containing first layer for covering the light emitting element on and above the mounting portion, a fluorescent material-containing second layer formed on an upper surface of the base body around the mounting portion, and a filler-containing layer formed on the fluorescent material-containing second layer around the mounting portion.

Abstract translation: 一种具有发光元件的发光器件和含有荧光材料颗粒的树脂层和反射光的填料的制造方法包括在填料之前使荧光材料颗粒沉淀的荧光材料沉淀工艺。 发光装置包括基体; 经由安装部安装在基体的上表面的发光元件; 以及用于密封发光元件的密封树脂。 密封树脂包括：用于覆盖安装部分上方和上方的发光元件的含荧光材料的第一层，围绕安装部分形成在基体的上表面上的含荧光材料的第二层， 围绕安装部分形成在含荧光材料的第二层上。