公开(公告)号：US12272773B2

公开(公告)日：2025-04-08

申请号：US18511451

申请日：2023-11-16

Applicant: Nichia Corporation

Inventor： Hiroshi Miyairi ,  Yoshimi Katsumoto ,  Takayuki Igarashi ,  Yoshifumi Hodono ,  Shinya Endo

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes: a substrate; a light emitting element; a wavelength conversion layer; and a wall surrounding the wavelength conversion layer, having an opening portion exposing at least a part of a top surface of the wavelength conversion layer, and containing a light reflective material. The surface of the wall includes a top surface provided at a higher position than the top surface of the wavelength conversion layer, and an inner surface forming the opening portion. The wall includes a first portion surrounding the wavelength conversion layer, and a second portion provided over the first portion and surrounding the first portion. The opening portion is hollow. An angle of a corner portion between the top surface and the inner surface of the wall is in a range of 90 degrees or greater and less than 180 degrees.

公开(公告)号：US11670743B2

公开(公告)日：2023-06-06

申请号：US16987662

申请日：2020-08-07

Applicant: NICHIA CORPORATION

Inventor： Takayuki Igarashi

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/48 ,  H01L27/15

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/005 ,  H01L33/486 ,  H01L2933/0041

Abstract: A light emitting device includes: a substrate; a plurality of light emitting elements mounted on the substrate; a covering member disposed on the substrate between adjacent ones of the light emitting elements such that an upper surface of the covering member is substantially coplanar with upper surfaces of the light emitting elements, wherein the covering member is a molded body containing an inorganic material powder and a binder; and a light transmissive member disposed on or above the plurality of light emitting elements.

公开(公告)号：US11562989B2

公开(公告)日：2023-01-24

申请号：US16580885

申请日：2019-09-24

Applicant: NICHIA CORPORATION

Inventor： Takayuki Igarashi

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/50 ,  F21Y115/10 ,  F21S41/143 ,  F21S41/20 ,  F21S41/153 ,  F21Y105/16 ,  B60Q1/14 ,  F21S45/47

Abstract: A light-emitting device includes: a substrate; a plurality of light-emitting elements mounted to the substrate; and a phosphor layer provided on the plurality of light-emitting elements, the phosphor layer including: a plurality of phosphor particles, and a glass layer covering surfaces of the phosphor particles, wherein the phosphor particles are bonded to each other by the glass layer, and an air layer is formed between the phosphor particles.

公开(公告)号：US11862760B2

公开(公告)日：2024-01-02

申请号：US17154464

申请日：2021-01-21

Applicant: NICHIA CORPORATION

Inventor： Hiroshi Miyairi ,  Yoshimi Katsumoto ,  Takayuki Igarashi ,  Yoshifumi Hodono ,  Shinya Endo

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes: a substrate; a light emitting element; a wavelength conversion layer; and a wall surrounding the wavelength conversion layer, having an opening portion exposing at least a part of a top surface of the wavelength conversion layer, and containing a light reflective material. The surface of the wall includes a top surface provided at a higher position than the top surface of the wavelength conversion layer, and an inner surface forming the opening portion. The wall includes a first portion surrounding the wavelength conversion layer, and a second portion provided over the first portion and surrounding the first portion. The opening portion is hollow. An angle of a corner portion between the top surface and the inner surface of the wall is in a range of 90 degrees or greater and less than 180 degrees.

公开(公告)号：US10176985B2

公开(公告)日：2019-01-08

申请号：US15854517

申请日：2017-12-26

Applicant: NICHIA CORPORATION ,  Mtek-smart Corporation

Inventor： Takayuki Igarashi ,  Masafumi Matsunaga

IPC: H01L33/56 ,  H01L33/50 ,  H01L21/02 ,  H01L33/60 ,  H01L33/54

Abstract: The method includes the steps of: storing slurry containing optical matter particles into a slurry tank; stirring the slurry inside the slurry tank by causing a bubble producing unit arranged below a liquid surface of the slurry to produce bubbles; and spraying the slurry onto a coating target including a light emitting element from a nozzle arranged above the coating target.

公开(公告)号：USD743918S1

公开(公告)日：2015-11-24

申请号：US29496362

申请日：2014-07-11

Applicant: NICHIA CORPORATION

Designer： Takayuki Igarashi ,  Ryo Oishi

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US09172007B2

公开(公告)日：2015-10-27

申请号：US14138899

申请日：2013-12-23

Applicant: NICHIA CORPORATION

Inventor： Takayuki Igarashi ,  Satoshi Shirahama

IPC: H01L21/00 ,  H01L33/50 ,  H01L33/52

CPC classification number: H01L33/50 ,  H01L33/52 ,  H01L2933/0025 ,  H01L2933/0041

Abstract: A method of manufacturing a light emitting device, using a spray coating method, a fluorescent material can be easily adhered on corner portions and side surfaces of an LED chip, a lens-shaped light transmissive resin member surface, an optical lens surface, etc., and a spray coating machine used in the method. The method includes mounting an LED chip on a substrate member, applying a spray coating to a coating object including the LED chip by spraying a powder-containing solution. The applying a spray coating is performed such that a powder-containing solution is sprayed through a solution nozzle arranged above the coating object, as a spray direction of the powder-containing solution indicating a central axis, while using at least one gas nozzle arranged in a surrounding relationship to the central axis, spraying a gas toward the central axis to alter the direction of the spray made of the powder-containing solution.

Abstract translation: 使用喷涂法制造荧光体的发光装置的制造方法可以容易地粘附在LED芯片，透镜状透光树脂构件表面，光学透镜表面等的角部和侧面上。 ，以及该方法中使用的喷涂机。 该方法包括将LED芯片安装在基板部件上，通过喷射含粉末溶液将喷涂施加到包括LED芯片的涂布对象物上。 进行喷雾涂布，使得含粉末溶液通过布置在涂布对象上方的溶液喷嘴喷射，作为指示中心轴的含粉末溶液的喷射方向，同时使用至少一个气体喷嘴，其布置在 与中心轴线的周围关系，向中心轴线喷射气体以改变由含粉末溶液形成的喷雾的方向。

公开(公告)号：US09631797B2

公开(公告)日：2017-04-25

申请号：US14546042

申请日：2014-11-18

Applicant: NICHIA CORPORATION

Inventor： Hiroshi Miyairi ,  Takayuki Igarashi ,  Masato Fujitomo ,  Satoshi Shirahama

IPC: F21V19/00 ,  F21V29/70 ,  F21V29/74 ,  F21V29/505 ,  F21Y101/00

CPC classification number: F21V19/003 ,  F21V19/0055 ,  F21V29/505 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012

Abstract: A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.