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公开(公告)号：US20190259909A1
公开(公告)日：2019-08-22
申请号：US16279981
申请日：2019-02-19
Applicant: NICHIA CORPORATION
Inventor： Takamasa SUNDA , Hitoshi NAGAI
Abstract: A light emitting element includes: a substrate including a first surface including a first region and a second region; a first semiconductor layered body on the first region of the first surface of the substrate; and a second semiconductor layered body on the second region of the first surface of the substrate. A first angle defined by a first lateral surface of the first semiconductor layered body and the first region is smaller than a second angle defined by a second lateral surface of the first semiconductor layered body and the first region. A fourth angle defined by a second lateral surface of the second semiconductor layered body and the second region is smaller than a third angle defined by a first lateral surface of the second semiconductor layered body and the second region.
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Patent Agency Ranking
公开(公告)号：US20200098568A1
公开(公告)日：2020-03-26
申请号：US16580945
申请日：2019-09-24
Applicant: NICHIA CORPORATION
Inventor： Takamasa SUNDA , Yoshinori FUKUI , Shinya ASAKAWA
IPC: H01L21/288 , H01L23/00 , C25D7/12 , C25D5/02 , C25D3/38
Abstract: A method of manufacturing a semiconductor device includes forming a photoresist defining an opening on an upper surface of a semiconductor wafer; and forming an electrode in the opening using a plating technique, in which the step of forming the electrode includes forming a first plated layer at a first current density such that the first plated layer has a first thickness, and forming a second plated layer on an upper surface of the first plated layer at a second current density higher than the first current density such that the second plated layer has a second thickness greater than the first thickness.
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公开(公告)号：US20210111307A1
公开(公告)日：2021-04-15
申请号：US17129322
申请日：2020-12-21
Applicant: NICHIA CORPORATION
Inventor： Takamasa SUNDA , Hitoshi NAGAI
Abstract: A light emitting element includes: a substrate including a first surface including a first region and a second region; a first semiconductor layered body on the first region, the first semiconductor layered body comprising a first light emitting layer and including: a first lateral surface, and a second lateral surface opposite to the first lateral surface; and a second semiconductor layered body on the second region, the second semiconductor layered body comprising a second light emitting layer and including: a first lateral surface facing the second lateral surface and located on a first semiconductor layered body side of the second semiconductor layered body, and a second lateral surface opposite to the first lateral surface and located on a side opposite the first semiconductor layered body side of the second semiconductor layered body.
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公开(公告)号：US20170186915A1
公开(公告)日：2017-06-29
申请号：US15388507
申请日：2016-12-22
Applicant: NICHIA CORPORATION
Inventor： Keiji EMURA , Yoshiki INOUE , Takamasa SUNDA
CPC classification number: H01L33/405 , H01L27/156 , H01L33/382 , H01L33/44 , H01L33/46 , H01L33/62
Abstract: A light emitting element includes a substrate; a plurality of semiconductor light emitting cells; a plurality of light reflective electrodes; a first insulation layer that continuously covers lateral surfaces of the semiconductor light emitting cells, spaces between the semiconductor light emitting cells, lateral surfaces of the light reflective electrodes, and a portion of upper surfaces of the light reflective electrodes; a plurality of wiring electrodes, and cover the lateral surfaces of the semiconductor light emitting cells and the spaces between the semiconductor light emitting cells via the first insulation layer; and a light reflective metal layer that covers the lateral surfaces of at least two adjacent ones of the semiconductor light emitting cells and the space between said at least two semiconductor light emitting cells, via the first insulation layer.
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公开(公告)号：US20190267527A1
公开(公告)日：2019-08-29
申请号：US16287545
申请日：2019-02-27
Applicant: NICHIA CORPORATION
Inventor： Keiji EMURA , Takao MISAKI , Takamasa SUNDA , Yoshinori FUKUI
Abstract: The light emitting element includes: first and second light emitting cells each including an n-side semiconductor layer, an active layer and a p-side semiconductor layer; a first insulating film covering the first and second light emitting cells, and provided with first p-side and first n-side openings; a wiring electrode connected to the first light emitting cell at the first n-side opening, and connected to the second light emitting cell at the first p-side opening; a first electrode connected to the first light emitting cell; a second electrode connected to the second light emitting cell; a second insulating film provided with a second p-side opening formed above the first electrode, a second n-side opening formed above the second electrode, and a third opening formed above the wiring electrode; a first external connection portion connected to the first electrode; and a second external connection portion connected to the second electrode.
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公开(公告)号：US20180182922A1
公开(公告)日：2018-06-28
申请号：US15853567
申请日：2017-12-22
Applicant: NICHIA CORPORATION
Inventor： Keiji EMURA , Takamasa SUNDA
CPC classification number: H01L33/38 , H01L33/20 , H01L33/36 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/483 , H01L33/486 , H01L33/62 , H01L2933/0066
Abstract: A light-emitting element includes: a semiconductor structure; light-reflecting electrodes; a first insulating film having: one or more first n-side openings and one or more first p-side openings; one or more interconnect electrodes on an upper surface of the first insulating film; a first electrode on the upper surface of the first insulating film; a second electrode on the upper surface of the first insulating film; a second insulating film having: one or more second n-side openings and one or more second p-side openings; a first external connection portion; and a second external connection portion.
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