Patent search ap:("NIPPON ELECTRIC CO") AND inv:"IKEDA KOICHI" Page 1

1.

发明授权
Oxide coating for semiconductor surfaces 失效
Title translation: 用于半导体表面的氧化物涂层

公开(公告)号：US3462298A

公开(公告)日：1969-08-19

申请号：US3462298D

申请日：1965-09-08

Applicant: NIPPON ELECTRIC CO

Inventor： IKEDA KOICHI , MINAGAWA KATSUJI , NAKAGAWA TORU

IPC: C23C14/08 , H01L23/31 , H01B1/08 , C23C13/02

CPC classification number: C23C14/086 , C23C14/083 , H01L23/3157 , H01L2924/0002 , H01L2924/00

2.

发明授权
Hermetically sealed body of ceramic,metal and glass and method therefor 失效
Title translation: 陶瓷，金属和玻璃及其方法的密封体

公开(公告)号：US3468752A

公开(公告)日：1969-09-23

申请号：US3468752D

申请日：1965-10-12

Applicant: NIPPON ELECTRIC CO

Inventor： YAMAMOTO HIROSHI , IKEDA KOICHI , MINAGAWA KATSUJI

IPC: C03C27/00 , C04B35/16 , C04B37/00 , C04B37/02 , H01J5/20 , B32B17/06

CPC classification number: C04B35/16 , C03C27/00 , C04B37/00 , C04B37/025 , C04B2237/10 , C04B2237/34 , C04B2237/405 , C04B2237/765 , C04B2237/80 , H01J5/20 , H01J2893/0037 , Y10T428/131

3.

发明授权
Vitreous material for use in semiconductor devices 失效
Title translation: 用于半导体器件的绝缘材料

公开(公告)号：US3442993A

公开(公告)日：1969-05-06

申请号：US3442993D

申请日：1963-12-06

Applicant: NIPPON ELECTRIC CO

Inventor： YAMAMOTO HIROSHI , IKEDA KOICHI

IPC: C03C3/072 , H01L23/29 , C01B33/26 , C01G21/02

CPC classification number: H01L23/291 , C03C3/072 , H01L24/01 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , Y10S65/11 , H01L2924/00014

4.

发明授权
Low melting point devitrified glass and method 失效
Title translation: 低熔点偏光玻璃和方法

公开(公告)号：US3425817A

公开(公告)日：1969-02-04

申请号：US3425817D

申请日：1965-09-13

Applicant: NIPPON ELECTRIC CO

Inventor： IKEDA KOICHI , MINAGAWA KATSUJI

IPC: C03C10/00 , C03B31/00 , C03C3/22

CPC classification number: C03C10/0054

5.

发明授权
Low melting glass 失效
Title translation: 低熔融玻璃

公开(公告)号：US3420683A

公开(公告)日：1969-01-07

申请号：US3420683D

申请日：1963-12-11

Applicant: NIPPON ELECTRIC CO

Inventor： IKEDA KOICHI , TSUJI SHIGERU , ANAZAWA SHINZO , KOYAMA TSUKASA

IPC: C03C3/072 , C03C3/14 , C03C3/145 , C03C3/253 , C03C3/12 , C03C5/00

CPC classification number: C03C3/142 , C03C3/072 , C03C3/145 , C03C3/253

6.

发明授权
Low expansion material 失效
Title translation: 低膨胀材料

公开(公告)号：US3533965A

公开(公告)日：1970-10-13

申请号：US3533965D

申请日：1967-09-11

Applicant: NIPPON ELECTRIC CO

Inventor： IKEDA KOICHI , MINAGAWA KATSUJI , YAMAMOTO NOBORU

IPC: C08K3/32 , H01B1/22 , H01B1/24 , H01B3/00 , H01L23/16 , H01L23/24 , H01L23/29 , H01L23/31 , H01B1/06

CPC classification number: H01L23/3135 , C08K3/32 , H01B1/22 , H01B1/24 , H01B3/004 , H01B3/006 , H01L23/16 , H01L23/24 , H01L23/293 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/09701 , H01L2924/181 , C08L63/00 , H01L2924/00 , H01L2224/45015 , H01L2924/207

7.

发明授权
Face-bonded semiconductor device utilizing solder surface tension balling effect 失效
Title translation: 表面贴合半导体器件利用焊接表面张力效果

公开(公告)号：US3517279A

公开(公告)日：1970-06-23

申请号：US3517279D

申请日：1967-09-18

Applicant: NIPPON ELECTRIC CO

Inventor： IKEDA KOICHI , MINAGAWA KATSUJI , TANAKA SHIGEZO

IPC: H01L21/60 , H01L23/057 , H01L23/498 , H01L5/02

CPC classification number: H01L24/81 , H01L23/057 , H01L23/49844 , H01L23/49861 , H01L2224/13111 , H01L2224/26175 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , Y10T29/49105 , Y10T29/49144

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