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公开(公告)号：US20240228847A1
公开(公告)日：2024-07-11
申请号：US18284572
申请日：2022-03-25
Applicant: NITTO DENKO CORPORATION
Inventor： Eriko NAKAO , Shigeki ISHIGURO , Tomokazu TAKAHASHI , Ryohei OBAN , Asuka ENDO , Kayo SHIMOKAWA
IPC: C09J175/14 , B32B27/30 , B32B27/36 , B32B37/06 , B32B37/12 , C08F220/18 , C08G18/62 , C08G18/81 , C08J7/04 , C08J7/043 , C09J7/40
CPC classification number: C09J175/14 , B32B27/308 , B32B27/36 , B32B37/065 , C08F220/1808 , C08G18/6225 , C08G18/8116 , C08J7/0427 , C08J7/043 , C09J7/401 , C09J7/405 , B32B2037/1223 , C08J2375/14 , C09J2427/005 , C09J2467/006 , C09J2475/00
Abstract: The present invention relates to a surface-modifying layer including a polymeric component having a hydroxyl group and an unsaturated hydrocarbon group, in which a molar ratio of the unsaturated hydrocarbon group to the hydroxyl group is 0.01 or more and less than 1, a surface-modifying sheet including the surface-modifying layer and a release sheet, a laminate, a surface-modified member and a coated article, in which the surface-modifying sheet is used, a method for producing a surface-modified member, and a method for producing a coated article.
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公开(公告)号：US20200063004A1
公开(公告)日：2020-02-27
申请号：US16465492
申请日：2017-11-29
Applicant: NITTO DENKO CORPORATION
Inventor： Ryoko ASAI , Kayo SHIMOKAWA , Kensuke TANI , Yoshiko KIRA , Kenichi OKADA
IPC: C09J133/10 , C09J121/00 , C09J135/00 , C09J123/22 , C09J7/20 , C08G18/76
Abstract: The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
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3.发明申请公开(公告)号：US20170306197A1
公开(公告)日：2017-10-26
申请号：US15492415
申请日：2017-04-20
Applicant: NITTO DENKO CORPORATION
Inventor： Kayo SHIMOKAWA , Ryoko ASAI , Taiki SHIMOKURI , Yoshiaki ITO , Tatsuya YAMASAKI
Abstract: A curable resin composition for forming an adhesive layer on at least one surface of a substrate (C), the curable resin composition comprising: a compound (A) represented by formula (1): wherein X represents a functional group containing a reactive group, and R1 and R2 each independently represent a hydrogen atom or an optionally substituted, aliphatic hydrocarbon, aryl, or heterocyclic group; and an adhesion aid compound (B), the curable resin composition satisfying formula (X): −10≦HSP (A)−HSP (B)≦10 and formula (Y): −10≦HSP (C)−HSP (B)≦10, wherein HSP (A) is an HSP value of the compound (A), HSP (B) is an HSP value of the adhesion aid compound (B), and HSP (C) is an HSP value of the substrate (C).
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4.发明公开公开(公告)号：US20240140077A1
公开(公告)日：2024-05-02
申请号：US18278933
申请日：2022-02-16
Applicant: NITTO DENKO CORPORATION
Inventor： Asuka ENDO , Kayo SHIMOKAWA , Ryohei OBAN , Shigeki ISHIGURO
CPC classification number: B32B27/08 , B32B27/18 , B32B27/38 , B32B33/00 , B32B2255/10 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2305/08 , B32B2307/412
Abstract: A surface-modified member in which a surface-modifying layer is laminated over at least a part of a resin member containing a thermosetting resin, the surface-modified member containing: a mixed layer that the resin member and the surface-modifying layer are mixed between the resin member and the surface-modifying layer, in which the mixed layer has a thickness of 250 nm to 10 μm.
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公开(公告)号：US20220186093A1
公开(公告)日：2022-06-16
申请号：US17684126
申请日：2022-03-01
Applicant: NITTO DENKO CORPORATION
Inventor： Ryoko ASAI , Kayo SHIMOKAWA , Kensuke TANI , Yoshiko KIRA , Kenichi OKADA
IPC: C09J153/02 , C09J7/32 , C09J11/06 , C09J7/20 , C09J7/00 , C09J11/08 , C09J201/00 , C09J133/00 , C09J121/00 , C08G18/76 , C09J123/22 , C09J133/10 , C09J135/00
Abstract: The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
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Patent Agency Ranking
公开(公告)号：US20240217219A1
公开(公告)日：2024-07-04
申请号：US18283899
申请日：2022-03-14
Applicant: NITTO DENKO CORPORATION
Inventor： Ryohei OBAN , Kayo SHIMOKAWA , Asuka ENDO , Shigeki ISHIGURO , Eriko NAKAO
CPC classification number: B32B27/08 , B32B27/38 , B32B37/06 , B32B37/10 , B32B37/26 , B32B2037/268 , B32B2255/10 , B32B2305/076 , B32B2307/7376 , B32B2363/00
Abstract: The present invention relates to a surface-modifying sheet including a release sheet and a surface-modifying layer, in which the surface-modifying layer contains a polymeric component and an oligomer component, the oligomer component has a weight average molecular weight (Mw) of 100 to 7,000, a HSP distance (Ra) between the oligomer component and a bisphenol A type glycidyl ether is 7.5 or more, and the oligomer component is contained in an amount of 0.1 to 30 parts by mass with respect to 100 parts by mass of the polymeric component, and relates to a laminate, a surface-modified member and a coated article using the surface-modifying sheet, a method for producing the surface-modified member, and a method for producing the coated article.
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公开(公告)号：US20220134727A1
公开(公告)日：2022-05-05
申请号：US17600003
申请日：2020-03-12
Applicant: NITTO DENKO CORPORATION
Inventor： Kayo SHIMOKAWA , Yosuke MAKIHATA , Asuka ENDO , Eriko NAKAO , Kenichi OKADA , Ryohei OBAN , Shigeki ISHIGURO
Abstract: The present invention relates to a method for manufacturing a laminate, including a laminating step of laminating a side of a thermal transfer layer of a thermal transfer sheet having a release sheet and the thermal transfer layer on at least a part of a surface of a resin member by heat bonding, in which the release sheet has a thermal expansion coefficient β of −15%≤β≤+7.5% at a molding temperature Tβ° C. in the laminating step.
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公开(公告)号：US20210238373A1
公开(公告)日：2021-08-05
申请号：US17050566
申请日：2019-04-24
Applicant: NITTO DENKO CORPORATION
Inventor： Eriko NAKAO , Asuka ENDO , Kenichi OKADA , Yosuke MAKIHATA , Kayo SHIMOKAWA
Abstract: The present invention relates to a surface-modifying sheet including a release sheet and a surface-modifying layer, the surface-modifying layer having an average thickness of 0.1 μm to 50 μm, and the difference between the maximum value and the minimum value of the thickness of the surface-modifying layer being less than twice the average thickness; and a surface-modified member, a coated article and a method for producing a coated article, using the surface-modifying sheet.
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公开(公告)号：US20240026100A1
公开(公告)日：2024-01-25
申请号：US18274936
申请日：2022-01-21
Applicant: NITTO DENKO CORPORATION
Inventor： Ryohei OBAN , Kayo SHIMOKAWA , Asuka ENDO , Shigeki ISHIGURO
CPC classification number: C08J5/18 , C08J7/08 , C08J2363/00
Abstract: A surface-modifying sheet contains a release sheet and a surface-modifying layer, the surface-modifying layer has a 160° C. storage modulus of 5.0×103 to 1.0×107 Pa, and the surface-modifying layer has a surface tension of 38 mN/m or higher.
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公开(公告)号：US20220371314A1
公开(公告)日：2022-11-24
申请号：US17771167
申请日：2020-10-19
Applicant: NITTO DENKO CORPORATION
Inventor： Shigeki ISHIGURO , Asuka ENDO , Kayo SHIMOKAWA , Yosuke MAKIHATA , Ryohei OBAN , Kenichi OKADA
Abstract: The present invention relates to a method for manufacturing a laminate, including: a laminating step of laminating a side of a thermal transfer layer of a thermal transfer sheet having a release sheet and the thermal transfer layer on at least a part of a surface of a resin member by heat bonding, in which the release sheet has no yield points, and has an elongation at break of 100% to 600% in a stress-strain curve measured by a tensile test at a molding temperature Tβ° C. in the laminating step.
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