METHOD AND APPARATUS FOR PROCESSING SIGNALS OF SEMICONDUCTOR DETECTOR
    1.
    发明申请
    METHOD AND APPARATUS FOR PROCESSING SIGNALS OF SEMICONDUCTOR DETECTOR 有权
    用于处理半导体检测器信号的方法和装置

    公开(公告)号:US20160018537A1

    公开(公告)日:2016-01-21

    申请号:US14800635

    申请日:2015-07-15

    IPC分类号: G01T1/24 H04N5/32

    CPC分类号: G01T1/247 G01T1/241 H04N5/32

    摘要: The present invention provides a method and apparatus for processing signals of a semiconductor detector, including: acquiring a relationship of a time difference between anode and cathode signals of the semiconductor detector with an anode signal amplitude; obtaining an optimal data screening interval according to the relationship of the time difference between anode and cathode signals of the semiconductor detector with the anode signal amplitude, wherein the optimal data screening interval is an interval where the time difference between the anode and cathode signals is greater than 50 ns; and screening and processing the collected data according to the optimal data screening interval when the semiconductor detector collects data. The present invention better overcomes the inherent crystal defects of the detector, reduces the effect of background noise, increases the energy resolution of the cadmium zinc telluride detector under room temperature, and improves the peak-to-compton ratio.

    摘要翻译: 本发明提供了一种用于处理半导体检测器的信号的方法和装置,包括:用阳极信号振幅获取半导体检测器的阳极和阴极信号之间的时间差的关系; 根据半导体检测器的阳极和阴极信号的时间差与阳极信号幅度的关系获得最佳数据筛选间隔,其中最佳数据筛选间隔是阳极和阴极信号之间的时间差较大的间隔 超过50 ns; 并且当半导体检测器收集数据时,根据最佳数据筛选间隔筛选和处理收集的数据。 本发明更好地克服了检测器的固有晶体缺陷,降低了背景噪声的影响,提高了碲化锌碲化镉检测器在室温下的能量分辨率,提高了峰 - 峰比。

    PHOTODIODE DEVICE, PHOTODIODE DETECTOR AND METHODS OF FABRICATING THE SAME

    公开(公告)号:US20190334045A1

    公开(公告)日:2019-10-31

    申请号:US16343983

    申请日:2017-09-12

    摘要: According to an embodiment, a method of fabricating a photodiode device may include: growing an epitaxial layer on a first surface of a substrate, wherein the epitaxial layer is first type lightly doped; forming, in the substrate, a first type heavily doped region in contact with the first type lightly doped epitaxial layer; thinning the substrate from a second surface of the substrate opposite to the first surface to expose the first type heavily doped region; patterning the first type heavily doped region from the second surface side of the substrate to form a trench therein, that penetrates through the first type heavily doped region and extends into the epitaxial layer, to serve as a first electrode region of the photodiode device; and forming a second type heavily doped region at bottom of the trench, to serve as a second electrode region of the photodiode device.

    AERIAL CDZNTE INSPECTION SYSTEM AND INSPECTION METHOD

    公开(公告)号:US20180284302A1

    公开(公告)日:2018-10-04

    申请号:US15740813

    申请日:2016-08-23

    摘要: The present invention relates to the field of radiation detection, and provides a CdZnTe aerial inspection system and an inspection method. The inspection system comprises a CdZnTe spectrometer (10) and an aircraft (20). The aircraft (20) flies and carries the CdZnTe spectrometer (10) to realize a function of aerial inspection, thereby improving operating efficiency of nuclear radiation monitoring. The CdZnTe spectrometer (10) has high energy resolution, a small volume, a light weight, and desirable portability. By combining the CdZnTe spectrometer (10) and the aircraft (20), the present invention enables high measurement precision, a long operation duration, and an aerial access to a site of a nuclear accident to perform operations and inspect the site, thus reducing radiation exposure received by a person entering the site, and providing support for rescue operation.

    PHOTODIODE DEVICE AND PHOTODIODE DETECTOR
    4.
    发明申请

    公开(公告)号:US20190326458A1

    公开(公告)日:2019-10-24

    申请号:US16467623

    申请日:2017-08-08

    摘要: A photodiode device and a photodiode detector are provided. According to an embodiment, the photodiode device may include a first type lightly doped semiconductor base including a first surface and a second surfaces opposite to each other, a first electrode region being first type heavily doped and disposed on the first surface of the semiconductor base, a second electrode region being second type heavily doped and disposed on the second surface of the semiconductor base, wherein the first surface is a light incident surface.