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公开(公告)号：US20150279804A1
公开(公告)日：2015-10-01
申请号：US14229785
申请日：2014-03-28
IPC分类号： H01L23/00
CPC分类号： H01L24/17 , B23K35/22 , H01L23/49811 , H01L23/5389 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81815 , H01L2224/92125 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1434 , H01L2924/15311 , H01L2924/1533 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400° C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste.
摘要翻译： 实施例描述了用于半导体封装的高纵横比和细间距互连，诸如封装封装结构。 在一个实施例中，互连由无瑕疵焊膏形成。 在一个实施方案中，将无褪色焊膏印刷为未固化状态，然后用液相烧结工艺固化。 在固化之后，在典型的加工温度下，例如低于约400℃的无sl焊膏不会回流。根据实施例，无sl焊焊膏包括Cu颗粒或球体，焊料基质组分，聚合物 输送载体和溶剂。 在一个实施方案中，液相烧结在Cu球周围产生金属间化合物的壳。 在一个实施例中，烧结过程通过无sl焊膏形成导电金属网络。
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公开(公告)号：US20170176496A1
公开(公告)日：2017-06-22
申请号：US14975386
申请日：2015-12-18
CPC分类号： H01R43/24 , G01R1/07378
摘要： Prober space transformer to interface an E-testing apparatus to an unpackaged die. The space transformer may include a substrate and a perforated cover plate disposed on the substrate. The substrate may include conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as a prober interface between an E-testing apparatus and a DUT. The cover plate may be affixed to a surface of the substrate and includes an array of perforations through which the array of conductive pins may pass. The cover plate may be synthetic polymer resin or a polymer-based composite, fabricated, for example by perforating a mold preform.
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公开(公告)号：US20170176518A1
公开(公告)日：2017-06-22
申请号：US14973543
申请日：2015-12-17
CPC分类号： H01R43/20 , G01R1/07378
摘要： Space transformer including a substrate and a perforated plate disposed on the substrate. The substrate includes conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as an interface between an E-testing apparatus and a DUT. The perforated plate may be affixed to a surface of the substrate and includes an array of perforations through which the conductive pins may pass. The perforated plate may provide one or more of lateral pin support and protection to the underlying substrate and/or traces. The perforated plate may include a metal sheet. A polymeric material may be disposed on at least a sidewall of the perforations to electrically isolate the metal sheet from the conductive probe pins.
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