摘要:
Methods of purifying H2Se by removing H2S and/or H2O are disclosed. The amount of H2S in the H2Se-containing gas is reduced below 10 ppmv by passing the H2Se-containing gas through an AW-500 molecular sieve. H2S and H2O are removed by passing H2Se through a 4 A molecular sieve and subsequently passing H2Se through an AW-500 molecular sieve.
摘要:
Methods of storing a precursor which decreases the precursor decomposition rate. A vessel is provided, where the vessel has an outer surface made of a first material, and an inner surface made of a second material. The first and second materials are different. A tantalum containing precursor is placed inside the vessel, and the vessel is heated to a temperature between 60° C. and 150° C. At least part of the precursor is withdrawn from the vessel.
摘要:
Methods of storing a precursor which decreases the precursor decomposition rate. A vessel is provided, where the vessel has an outer surface made of a first material, and an inner surface made of a second material. The first and second materials are different. A tantalum containing precursor is placed inside the vessel, and the vessel is heated to a temperature between 60° C. and 150° C. At least part of the precursor is withdrawn from the vessel.
摘要:
The present invention provides methods for checking and calibrating one or more concentration sensors in an open or closed system. More specifically, in one embodiment of the present invention, the disclosed method allows for the checking and calibration of one or more concentration sensors in which removal of the liquid from the system is required. In two additional embodiments, the disclosed methods allow for the checking and calibration of one or more concentration sensors without having to remove the liquid from the closed system thereby minimizing contamination of the system while at the same time greatly reducing or eliminating contact of the user with the liquid.
摘要:
Disclosed are compounds for plasma ashing photoresist layers on a substrate and methods of using the same. The plasma ashing compounds induce limited to no damage to the underlying layer, such as the low-k film layer.
摘要:
The present invention provides methods for checking and calibrating one or more concentration sensors in an open or closed system. More specifically, in one embodiment of the present invention, the disclosed method allows for the checking and calibration of one or more concentration sensors in which removal of the liquid from the system is required. In two additional embodiments, the disclosed methods allow for the checking and calibration of one or more concentration sensors without having to remove the liquid from the closed system thereby minimizing contamination of the system while at the same time greatly reducing or eliminating contact of the user with the liquid.
摘要:
Methods and compositions for depositing rare earth metal-containing layers are described herein. In general, the disclosed methods deposit the precursor compounds comprising rare earth-containing compounds using vapor deposition methods such as chemical vapor deposition or atomic layer deposition. In certain embodiments, the disclosed precursor compounds include a cyclopentadienyl ligand having at least one aliphatic group as a substituent.
摘要:
Etching gases are disclosed for plasma etching channel holes, gate trenches, staircase contacts, capacitor holes, contact holes, etc., in Si-containing layers on a substrate and plasma etching methods of using the same. The etching gases are trans-1,1,1,4,4,4-hexafluoro-2-butene; cis-1,1,1,4,4,4-hexafluoro-2-butene; hexafluoroisobutene; hexafluorocyclobutane (trans-1,1,2,2,3,4); pentafluorocyclobutane (1,1,2,2,3-); tetrafluorocyclobutane (1,1,2,2-); or hexafluorocyclobutane (cis-1,1,2,2,3,4). The etching gases may provide improved selectivity between the Si-containing layers and mask material, less damage to channel region, a straight vertical profile, and reduced bowing in pattern high aspect ratio structures.