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1.发明授权Target value processing unit, temperature controller, control process implementing system, process controlling method, target value processing program, and recording medium 失效目标值处理单元，温度控制器，控制处理实施系统，过程控制方法，目标值处理程序和记录介质公开(公告)号：US07218999B2
公开(公告)日：2007-05-15
申请号：US11062756
申请日：2005-02-23
申请人： Nobutomo Matsunaga , Shigeyasu Kawaji , Ikuo Nanno , Masahito Tanaka , Takaaki Yamada , Yosuke Iwai , Takeshi Wakabayashi , Kazuo Tsuboi
发明人： Nobutomo Matsunaga , Shigeyasu Kawaji , Ikuo Nanno , Masahito Tanaka , Takaaki Yamada , Yosuke Iwai , Takeshi Wakabayashi , Kazuo Tsuboi
摘要： A target value processing unit, includes: an input section to which a target value signal showing a target value of a control process is inputted; a target value shaping unit shaping the target value signal inputted to the input section, into a signal form which is proper for a control treatment of a regulator implementing the control process; and an output section outputting to the regulator a shaped target value signal which is shaped by the target value shaping unit. The target value processing unit realizes the high-level control process without improving the regulator.
摘要翻译： 目标值处理单元包括：输入表示控制处理的目标值的目标值信号的输入部; 将输入到所述输入部的目标值信号整形为适用于进行所述控制处理的调节器的控制处理的信号形式的目标值整形部; 以及输出部，向所述调节器输出由所述目标值整形单元成形的成形目标值信号。 目标值处理单元实现高级控制过程而不改进调节器。
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2.发明申请Target value processing unit, temperature controller, control process implementing system, process controlling method, target value processing program, and recording medium 失效目标值处理单元，温度控制器，控制处理实施系统，过程控制方法，目标值处理程序和记录介质公开(公告)号：US20050192681A1
公开(公告)日：2005-09-01
申请号：US11062756
申请日：2005-02-23
申请人： Nobutomo Matsunaga , Shigeyasu Kawaji , Ikuo Nanno , Masahito Tanaka , Takaaki Yamada , Yosuke Iwai , Takeshi Wakabayashi , Kazuo Tsuboi
发明人： Nobutomo Matsunaga , Shigeyasu Kawaji , Ikuo Nanno , Masahito Tanaka , Takaaki Yamada , Yosuke Iwai , Takeshi Wakabayashi , Kazuo Tsuboi
IPC分类号： G05D23/19 , G05B5/01 , G05B11/32 , G05B11/42 , G05B13/02 , G05B19/04 , G05D23/00 , G08C13/00
摘要： A target value processing unit, includes: an input section to which a target value signal showing a target value of a control process is inputted; a target value shaping unit shaping the target value signal inputted to the input section, into a signal form which is proper for a control treatment of a regulator implementing the control process; and an output section outputting to the regulator a shaped target value signal which is shaped by the target value shaping unit. The target value processing unit realizes the high-level control process without improving the regulator.
摘要翻译： 目标值处理单元包括：输入表示控制处理的目标值的目标值信号的输入部; 将输入到所述输入部的目标值信号整形为适用于进行所述控制处理的调节器的控制处理的信号形式的目标值整形部; 以及输出部，向所述调节器输出由所述目标值整形单元成形的成形目标值信号。 目标值处理单元实现高级控制过程而不改进调节器。
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3.发明申请Control method, temperature control method, adjustment method, temperature controller, program, recording medium and heat treatment device 失效控制方法，温度控制方法，调节方法，温度控制器，程序，记录介质和热处理装置公开(公告)号：US20070010403A1
公开(公告)日：2007-01-11
申请号：US11476198
申请日：2006-06-28
IPC分类号： H01L39/24
CPC分类号： G05D23/1917
摘要： When a work is set on a hot plate and a heat treatment is started and the like, an addition waveform of a target temperature is formed based on a previously formed data of an adjustment value, and a temperature is controlled by adding the addition waveform to the target temperature SP, and with the data of the adjustment value, the variation in temperature of the work is prevented using an interference matrix showing a relation between the target temperature SP and the temperature of the work.
摘要翻译： 当在热板上设置工件并开始热处理等时，基于预先形成的调整值的数据形成目标温度的相加波形，并且通过将加法波形相加来控制温度 目标温度SP，并且利用调整值的数据，使用表示目标温度SP与工件温度之间的关系的干涉矩阵来防止工件的温度变化。
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4.发明授权Control method, temperature control method, adjustment method, temperature controller, program, recording medium and heat treatment device 失效控制方法，温度控制方法，调节方法，温度控制器，程序，记录介质和热处理装置公开(公告)号：US07536230B2
公开(公告)日：2009-05-19
申请号：US11476198
申请日：2006-06-28
IPC分类号： G05B13/02
CPC分类号： G05D23/1917
摘要： When a work is set on a hot plate and a heat treatment is started and the like, an addition waveform of a target temperature is formed based on a previously formed data of an adjustment value, and a temperature is controlled by adding the addition waveform to the target temperature SP, and with the data of the adjustment value, the variation in temperature of the work is prevented using an interference matrix showing a relation between the target temperature SP and the temperature of the work.
摘要翻译： 当在热板上设置工件并开始热处理等时，基于预先形成的调整值的数据形成目标温度的相加波形，并且通过将加法波形相加来控制温度 目标温度SP，并且利用调整值的数据，使用表示目标温度SP与工件温度之间的关系的干涉矩阵来防止工件的温度变化。
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公开(公告)号：US06951998B2
公开(公告)日：2005-10-04
申请号：US10257241
申请日：2001-04-13
申请人： Ikuo Nanno , Kousaku Ando , Masahito Tanaka , Seiya Narimatsu , Naotaka Uchiyama , Motohisa Furukawa , Akira Takaishi , Yuuki Kataoka , Tsunetoshi Ooba , Atsushi Mukai , Takeshi Wakabayashi , Hirokazu Kitamura , Nobumasa Nakamizo , Hideki Kobori
发明人： Ikuo Nanno , Kousaku Ando , Masahito Tanaka , Seiya Narimatsu , Naotaka Uchiyama , Motohisa Furukawa , Akira Takaishi , Yuuki Kataoka , Tsunetoshi Ooba , Atsushi Mukai , Takeshi Wakabayashi , Hirokazu Kitamura , Nobumasa Nakamizo , Hideki Kobori
CPC分类号： G05B13/024 , G05B11/32 , G05B11/42 , G05D23/1919 , G05D23/1932 , G05D23/20
摘要： A plurality of individually corresponding heaters and temperature sensors are provided along with a plurality of a PID control means. An average temperature/gradient temperature calculating means calculates the average temperatures of the temperatures measured by the temperature sensors and the gradient temperatures based on the measured temperatures. Each of the PID control means outputs an operation signal so that the average temperatures or gradient temperatures may be made equal to the desired values. A distributing means distributes the operation signal from each of the PID control means to each heater so that control by the PID control means may produce no effect on the control of the other PID control means.
摘要翻译： 多个单独对应的加热器和温度传感器与多个PID控制装置一起提供。 平均温度/梯度温度计算装置根据测量的温度来计算由温度传感器测量的温度和梯度温度的平均温度。 PID控制装置中的每一个输出操作信号，使得平均温度或梯度温度可以等于期望值。 分配装置将来自每个PID控制装置的操作信号分配给每个加热器，使得PID控制装置的控制可以不对其他PID控制装置的控制产生影响。
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公开(公告)号：US08777471B2
公开(公告)日：2014-07-15
申请号：US13381010
申请日：2011-03-23
申请人： Takeshi Wakabayashi , Kazuto Ishida
发明人： Takeshi Wakabayashi , Kazuto Ishida
IPC分类号： F21V7/04
CPC分类号： G09F23/0058 , G02B6/0036 , G02B6/0061 , G02B6/0081 , G02F1/133308 , G02F1/133603 , G02F1/133615 , G09F9/35 , G09F2013/222
摘要： An LCD indicator unit contains an LCD indicator with a display portion that includes set temperature and current temperature display portions, a diffusion sheet disposed on the rear surface side of the LCD indicator, a reflective frame body disposed on the rear surface side of the diffusion sheet, a light guide plate disposed on the rear surface side of the reflective frame body such that an outer peripheral portion thereof is covered with the reflective frame body, and an LCD indicator control substrate-disposed on the rear surface side of the light guide plate, with LEDs serving as light sources for the LCD indicator mounted on a right-side outer peripheral portion on the front surface side of the LCD indicator control substrate. Light emitted from the LEDs is caused to enter a side wall surface portion of the light guide plate to irradiate the display portion of the LCD indicator.
摘要翻译： LCD指示器单元包括具有显示部分的LCD指示器，该显示部分包括设定温度和当前温度显示部分，设置在LCD指示器的后表面侧的漫射片，设置在漫射片的背面侧的反射框架体 导光板，其设置在反射框体的后表面侧，使得其外周部分被反射框体覆盖;以及LCD指示器控制基板，设置在导光板的后表面侧， 其中LED用作LCD指示器的光源，其安装在LCD指示器控制基板的前表面侧的右侧外周部分上。 使从LED发出的光进入导光板的侧壁面，照射LCD显示器的显示部。
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公开(公告)号：US08567262B2
公开(公告)日：2013-10-29
申请号：US13073441
申请日：2011-03-28
IPC分类号： G01L3/02
CPC分类号： B62D6/10 , B62D5/0409 , B62K5/01 , B62K5/08
摘要： An electric power steering apparatus includes a steering shaft for transmitting a steering force of a steering handlebar to a wheel and an upper bearing provided at a location upward from a vehicle body frame so as to rotatably support an upper part of the steering shaft. A lower bearing is provided at a location downward from the vehicle body frame, so as to rotatably support a lower part of the steering shaft. A torque sensor detects a torsional torque applied to the steering shaft. An electric motor imparts a steering force to the steering shaft based on the torsional torque detected by the torque sensor. The electric motor is mounted to the steering shaft between the upper bearing and the lower bearing, while the torque sensor is mounted to the steering shaft at place upward from the upper bearing.
摘要翻译： 电动助力转向装置包括用于将转向手柄的转向力传递到车轮的转向轴和设置在从车身框架向上的位置处的上轴承，以便可旋转地支撑转向轴的上部。 下部轴承设置在从车身框架向下的位置处，以便可旋转地支撑转向轴的下部。 转矩传感器检测施加到转向轴的扭转转矩。 电动机基于由扭矩传感器检测到的扭转扭矩向转向轴施加转向力。 电动机安装在上轴承和下轴承之间的转向轴上，而转矩传感器从上轴承向上安装到转向轴上。
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8.发明授权Semiconductor device having low dielectric constant film and manufacturing method thereof 失效具有低介电常数薄膜的半导体器件及其制造方法公开(公告)号：US08154133B2
公开(公告)日：2012-04-10
申请号：US12412576
申请日：2009-03-27
申请人： Taisuke Koroku , Takeshi Wakabayashi , Osamu Okada , Osamu Kuwabara , Junji Shiota , Nobumitsu Fujii
发明人： Taisuke Koroku , Takeshi Wakabayashi , Osamu Okada , Osamu Kuwabara , Junji Shiota , Nobumitsu Fujii
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/6835 , H01L23/3135 , H01L24/11 , H01L24/12 , H01L24/27 , H01L2221/6834 , H01L2221/68372 , H01L2221/68377 , H01L2224/03 , H01L2224/0401 , H01L2224/11 , H01L2224/16 , H01L2224/274 , H01L2224/94 , H01L2924/01019 , H01L2924/01029 , H01L2924/10157 , H01L2924/10158 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/3512 , H01L2924/00
摘要： A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.
摘要翻译： 在半导体基板的上表面的除了该表面的周边部分之外的区域中设置由低介电常数膜和布线组成的低介电常数膜/布线层叠结构。 低介电常数薄膜/布线层叠结构的周边侧表面被密封膜覆盖。 这提供了低介电常数膜不容易脱落的结构。 在这种情况下，在硅基板的下表面上设置下保护膜，以保护该下表面免受裂纹。
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公开(公告)号：US20110239787A1
公开(公告)日：2011-10-06
申请号：US13073556
申请日：2011-03-28
IPC分类号： G01L3/10
CPC分类号： B62D6/10 , B62D5/0409 , B62K5/01 , B62K5/027 , B62K5/08
摘要： A bending load acting on a steering shaft only with a magnetostrictive torque sensor, without separately providing a sensor for detecting the bending moment. A storage unit stores, as an initial characteristic curve formed from initial detection values, a characteristic curve formed from detection values of each of a first detection coil and a second detection coil when only twisting torque is applied to a steering shaft. A bending load detector provided in an ECU detects a bending load amount acting on the steering shaft based on a difference between each detection value of the first and second detection coils and the initial detection value on the initial characteristic curve corresponding to the detection value.
摘要翻译： 仅通过磁致伸缩扭矩传感器作用在转向轴上的弯曲载荷，而不单独提供用于检测弯矩的传感器。 作为由初始检测值形成的初始特性曲线的存储单元，当仅向转向轴施加扭矩时，存储由第一检测线圈和第二检测线圈的检测值形成的特性曲线。 设置在ECU中的弯曲载荷检测器基于第一和第二检测线圈的每个检测值与对应于检测值的初始特性曲线的初始检测值之间的差异检测作用在转向轴上的弯曲载荷量。
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10.发明申请SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权半导体器件的制造方法及其半导体器件的制造方法及其制造方法公开(公告)号：US20110001238A1
公开(公告)日：2011-01-06
申请号：US12828492
申请日：2010-07-01
IPC分类号： H01L23/48 , H01L23/485 , H01L21/768 , H01L21/60
CPC分类号： H01L24/49 , H01L21/561 , H01L21/6835 , H01L23/28 , H01L23/3114 , H01L23/3128 , H01L23/49838 , H01L23/50 , H01L23/525 , H01L23/5389 , H01L24/09 , H01L24/14 , H01L24/19 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/04042 , H01L2224/04105 , H01L2224/05599 , H01L2224/12105 , H01L2224/20 , H01L2224/274 , H01L2224/2919 , H01L2224/48151 , H01L2224/48491 , H01L2224/49 , H01L2224/73267 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/85399 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/19043 , H01L2224/82 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/214
摘要： A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
摘要翻译： 半导体构造包括半导体衬底和设置在半导体衬底上的连接焊盘。 一些连接焊盘连接到公共布线，并且剩余的连接焊盘中的至少一个连接到布线。 该构造还包括设置成连接到公共布线的第一柱状电极和设置成连接到布线的连接焊盘部分的第二柱状电极。
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