-
公开(公告)号：US20100220957A1
公开(公告)日：2010-09-02
申请号：US12663711
申请日：2008-06-26
申请人： Nobuyuki Asahi , Makoto Nisimura , Nobuyuki Miyagawa , Hiroyuki Yagyu , Yuichi Uchida , Yutaka Kinugasa , Tadahiro Yamaji , Takuya Matsumoto
发明人： Nobuyuki Asahi , Makoto Nisimura , Nobuyuki Miyagawa , Hiroyuki Yagyu , Yuichi Uchida , Yutaka Kinugasa , Tadahiro Yamaji , Takuya Matsumoto
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , G02B6/4239 , G02B6/43
摘要： An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.
摘要翻译： 光学模块包括发射极侧安装基板，接收器侧安装基板和外部波导基板。 安装基板设置有具有芯部和一对嵌合凹部的波导管。 外部波导基板设置有具有芯部，一对配合突片和搭接部的外部波导。 由于嵌合片安装在各嵌合凹部中，所以安装基板和外部波导基板接合在一起，两芯彼此对准，搭接部分与安装基板重合。
-
公开(公告)号：US08391657B2
公开(公告)日：2013-03-05
申请号：US12663711
申请日：2008-06-26
申请人： Nobuyuki Asahi , Makoto Nisimura , Nobuyuki Miyagawa , Hiroyuki Yagyu , Yuichi Uchida , Yutaka Kinugasa , Tadahiro Yamaji , Takuya Matsumoto
发明人： Nobuyuki Asahi , Makoto Nisimura , Nobuyuki Miyagawa , Hiroyuki Yagyu , Yuichi Uchida , Yutaka Kinugasa , Tadahiro Yamaji , Takuya Matsumoto
CPC分类号： G02B6/423 , G02B6/4239 , G02B6/43
摘要： An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate) and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.
摘要翻译： 光学模块包括发射极侧安装基板，接收器侧安装基板和外部波导基板。 安装基板设置有具有芯部和一对嵌合凹部的波导管。 外部波导基板设置有具有芯部，一对配合突片和搭接部的外部波导。 当安装片安装在相应的装配凹槽中时，安装基板）和外部波导基板接合在一起，两个芯彼此对准，并且搭接部分被定位成与安装基板重叠。
-
公开(公告)号：US09046668B2
公开(公告)日：2015-06-02
申请号：US14124495
申请日：2012-06-14
CPC分类号： G02B6/43 , G02B6/3636 , G02B6/4214 , G02B6/423 , G02B6/4249 , H01L2224/73204 , H01S5/02252 , H01S5/02284
摘要： There is provided an optical module in which leaked light or the like from a plurality of optical elements on the same substrate is made less likely to affect adjacent optical elements, and a cross-talk noise can be thereby significantly reduced. The optical module includes an internal waveguide in a first trench of a substrate, a mirror section, and optical elements. A plurality of the first trenches of the substrate are formed independently of each other and substantially in parallel with each other, and lengths of adjacent first trenches from the end surface of the substrate are made different from each other. The optical elements are mounted on the surface of the substrate so as to oppose the minor sections formed at the tip portions of the first trenches having the different lengths.
摘要翻译： 提供了一种光学模块，其中来自同一基板上的多个光学元件的泄漏光等不太可能影响相邻的光学元件，并且因此可以显着降低串扰噪声。 光学模块包括在衬底的第一沟槽，镜部分和光学元件中的内部波导。 衬底的多个第一沟槽彼此独立地并且基本上彼此平行地形成，并且使来自衬底的端表面的相邻的第一沟槽的长度彼此不同。 光学元件安装在基板的表面上，以与形成在具有不同长度的第一沟槽的末端部分的较小部分相对。
-
4.发明授权Photoelectric converter providing a waveguide along the surface of the mount substrate 有权光电转换器沿着安装基板的表面提供波导公开(公告)号：US08575529B2
公开(公告)日：2013-11-05
申请号：US12376891
申请日：2007-08-08
IPC分类号： G01J1/42
CPC分类号： G02B6/4214 , G02B6/4201 , G02B6/4232 , G02B6/4284 , G02B6/43 , G02B2006/12147 , H01L2224/16225
摘要： To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.
摘要翻译： 提供能够降低器件高度的光电转换器。 光电转换器包括：发光元件或光接收元件; 用于向/从发光元件或光接收元件发送/接收电信号的IC电路; 适于从发光元件发光的一侧安装在一个表面上的安装基板或光接收元件接收光的一侧; 电连接器，其适于设置在所述安装基板的一个表面或另一个表面上，并且从外部连接器被安装和拆卸; 以及适于沿着安装基板的一个表面或另一个表面设置在安装基板上并且光学耦合到发光元件或光接收元件的波导。
-
公开(公告)号：US20100171023A1
公开(公告)日：2010-07-08
申请号：US12376891
申请日：2007-08-08
CPC分类号： G02B6/4214 , G02B6/4201 , G02B6/4232 , G02B6/4284 , G02B6/43 , G02B2006/12147 , H01L2224/16225
摘要： To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.
摘要翻译： 提供能够降低器件高度的光电转换器。 光电转换器包括：发光元件或光接收元件; 用于向/从发光元件或光接收元件发送/接收电信号的IC电路; 适于从发光元件发光的一侧安装在一个表面上的安装基板或光接收元件接收光的一侧; 电连接器，其适于设置在所述安装基板的一个表面或另一个表面上，并且从外部连接器被安装和拆卸; 以及适于沿着安装基板的一个表面或另一个表面设置在安装基板上并且光学耦合到发光元件或光接收元件的波导。
-
6.发明授权Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation 失效通过能量束消融在工件表面形成不均匀凹陷的复杂轮廓的方法公开(公告)号：US06511627B1
公开(公告)日：2003-01-28
申请号：US09539880
申请日：2000-03-31
申请人： Nobuyuki Asahi , Yuichi Uchida , Masao Kubo
发明人： Nobuyuki Asahi , Yuichi Uchida , Masao Kubo
IPC分类号： B23K2600
CPC分类号： B23K26/066 , B23K26/364
摘要： A method of forming a complex profile of uneven depressions in the surface of the ablatable workpiece by laser ablation with the use of a simple optics or a mask of a simple configuration. The method includes the steps of determining the complex profile in accordance with a particular feature to be given to the surface of the workpiece, then dividing the complex profile into more than one simple and regular waveform patterns of different characteristics, and irradiating an energy beam to the surface of the work piece to form the individual regular waveform patterns successively in an superimposed fashion by ablation in the surface of the workpiece. Accordingly, the desired complex profile can be easily obtained at an improved efficiency and at a moderate cost.
摘要翻译： 通过使用简单的光学元件或简单配置的掩模，通过激光烧蚀在可烧蚀工件的表面中形成不均匀凹陷的复杂轮廓的方法。 该方法包括以下步骤：根据要赋予工件表面的特定特征确定复杂轮廓，然后将复杂轮廓分成多于一个不同特征的简单和规则波形图案，并将能量束照射到 工件的表面通过在工件的表面中的消融以叠加的方式连续地形成单独的规则波形图案。 因此，可以以更高的效率和适中的成本容易地获得所需的复合物轮廓。
-
公开(公告)号：US06120725A
公开(公告)日：2000-09-19
申请号：US119745
申请日：1998-07-21
申请人： Nobuyuki Asahi , Yuichi Uchida , Masao Kubo
发明人： Nobuyuki Asahi , Yuichi Uchida , Masao Kubo
CPC分类号： B23K26/066 , B23K26/364
摘要： A method of forming a complex profile of uneven depressions in the surface of the ablatable workpiece by laser ablation with the use of a simple optics or a mask of a simple configuration. The method includes the steps of determining the complex profile in accordance with a particular feature to be given to the surface of the workpiece, then dividing the complex profile into more than one simple and regular waveform patterns of different characteristics, and irradiating an energy beam to the surface of the work piece to form the individual regular waveform patterns successively in an superimposed fashion by ablation in the surface of the workpiece. Accordingly, the desired complex profile can be easily obtained at an improved efficiency and at a moderate cost.
-
公开(公告)号：US06331063B1
公开(公告)日：2001-12-18
申请号：US09199893
申请日：1998-11-25
申请人： Kazuo Kamada , Shoichi Koyama , Nobuyuki Asahi , Toshiyuki Suzuki , Eiji Shiohama , Masaru Sugimoto , Shohei Yamamoto , Jiro Hashizume , Taishi Akiniwa , Takashi Tanaka
发明人： Kazuo Kamada , Shoichi Koyama , Nobuyuki Asahi , Toshiyuki Suzuki , Eiji Shiohama , Masaru Sugimoto , Shohei Yamamoto , Jiro Hashizume , Taishi Akiniwa , Takashi Tanaka
IPC分类号： F21V704
CPC分类号： F21V5/02 , F21Y2105/00 , F21Y2107/00 , F21Y2107/10 , F21Y2107/50 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H05K1/0284 , H05K1/182 , H01L2924/00014 , H01L2924/00
摘要： An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.
摘要翻译： 形成LED灯具，使得多个LED芯片以三维方式设置在矩形板状的MID（模制互连装置）基板上，通过在一个表面纵向和横向设置各个凹槽的底面上安装三个LED芯片 的MID基板，包括至少两种相互不同的发光颜色的LED芯片，期望为红色，蓝色和绿色三种类型。 由此可以根据基板的结构容易地获得任何可选的光分布特性，可以使灯具组件变薄，通过混合各个发光体的发光颜色，能够实现发光灯的白色和日光颜色的微妙色差 LED芯片
-
9.发明授权
公开(公告)号：US5601737A
公开(公告)日：1997-02-11
申请号：US268168
申请日：1994-06-29
申请人： Nobuyuki Asahi , Jun Tatsuta
发明人： Nobuyuki Asahi , Jun Tatsuta
CPC分类号： B23K26/1224 , B08B7/0042 , B23K26/032 , B23K26/064 , B23K26/066 , B23K26/0665 , B23K26/12 , B23K26/123 , B23K26/142 , B23K26/702 , H05K3/22 , H05K3/3489
摘要： A surface treating process with respect to conductor parts on printed circuit board irradiates an energy beam onto the surface of the conductor parts each in a plurality of layers of different, single metal material, with the intensity, dosage and the like optimumly set and under such irradiating conditions that the respective metal material of the conductor parts do not form any mutual alloy, and the surface of the conductor parts on the printed circuit board can be thereby excellently treated as desired.
摘要翻译： 相对于印刷电路板上的导体部分的表面处理工艺将能量束以不同的单一金属材料的多个层将导体部件的表面照射到最佳设置的强度，剂量等上 导体部件的各个金属材料不会形成任何相互合金的照射条件，并且可以根据需要精细地处理印刷电路板上的导体部件的表面。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.036 秒)
