Semiconductor device including vertical MOSFET structure with suppressed
parasitic diode operation
    1.
    发明授权
    Semiconductor device including vertical MOSFET structure with suppressed parasitic diode operation 失效
    半导体器件包括具有抑制的寄生二极管操作的垂直MOSFET结构

    公开(公告)号:US5696396A

    公开(公告)日:1997-12-09

    申请号:US734132

    申请日:1996-10-21

    摘要: A vertical MOSFET, which can control AC current flowing through a device only by the gate voltage, is obtained. On an n.sup.+ silicon layer is formed an n.sup.- silicon layer. Within the n.sup.- silicon layer is formed a p-body region. Within the p-body region is formed an n.sup.+ source region. On top of a substrate are formed a source electrode in contact only with the source region and a base electrode in contact only with the p-body region. The source electrode and the base electrode are connected to each other through a resistance at the outside. On a channel region is formed a gate electrode through a gate oxide film (insulating film). When the above semiconductor device is in the reverse bias conduction, the exciting current is controlled only by the gate voltage by setting the current flowing from a source terminal through the resistance to the base electrode, the p-body region and the n.sup.- silicon layer to be negligibly small as compared with the current flowing from the source terminal through the source electrode to the n.sup.+ source region, the channel region and the n.sup.- silicon layer.

    摘要翻译: 可以获得只能通过栅极电压控制流过器件的交流电流的垂直MOSFET。 在n +硅层上形成n-硅层。 在n-硅层内形成p体区域。 在p体区内形成n +源区。 在基板顶部形成仅与源极区域接触的源极电极和仅与p体区域接触的基极电极。 源电极和基极通过外部的电阻彼此连接。 在沟道区域上通过栅极氧化膜(绝缘膜)形成栅电极。 当上述半导体器件处于反向偏压传导时,通过将从源极端子流过电流的电流设置到基极,p体区域和n-硅层,从而仅通过栅极电压来控制励磁电流 与源极端子通过源极电极流到n +源极区域,沟道区域和n-硅层的电流相比,可以忽略不计。

    Method of manufacturing a vertical semiconductor device
    2.
    发明授权
    Method of manufacturing a vertical semiconductor device 失效
    制造垂直半导体器件的方法

    公开(公告)号:US5780324A

    公开(公告)日:1998-07-14

    申请号:US605637

    申请日:1996-02-22

    摘要: A manufacturing method of a vertical DMOSFET having a concave channel structure, which does not permit the introduction of defects or contaminant into the channel part and which can make the shape of the groove uniform, is disclosed. On a surface of a (100)-oriented n.sup.- -on-n.sup.+ epitaxial wafer is formed an initial groove by chemical dry etching. The grooved surface is then oxidized by LOCOS technique to form a LOCOS oxide film, whereby the concave structure is formed on the epitaxial wafer. The concave width is set to be at least twice the concave depth, and the sidewall angle is set to be approximately 50.degree. to make the sidewall plane (111) of high channel mobility plane. Following this process, p-type and n-type impurities are diffused from the main surface using the LOCOS oxide film as a double diffusion mask to form a body region and a source region.

    摘要翻译: 公开了一种具有凹槽结构的垂直DMOSFET的制造方法,其不允许将缺陷或污染物引入通道部分并且可以使凹槽的形状均匀。 在(100)取向的n-on + n外延晶片的表面上,通过化学干蚀刻形成初始槽。 然后通过LOCOS技术将开槽的表面氧化以形成LOCOS氧化物膜,由此在外延晶片上形成凹形结构。 凹形宽度被设定为凹入深度的至少两倍,并且将侧壁角度设定为大约50°以使高通道迁移面的侧壁平面(111)。 在该过程之后,使用LOCOS氧化物膜作为双扩散掩模,从主表面扩散p型和n型杂质,以形成体区和源区。

    Vertical type semiconductor device provided with an improved
construction to greatly decrease device on-resistance without impairing
breakdown
    3.
    发明授权
    Vertical type semiconductor device provided with an improved construction to greatly decrease device on-resistance without impairing breakdown 失效
    垂直型半导体器件具有改进的结构,以大大降低器件导通电阻而不损害击穿

    公开(公告)号:US5504360A

    公开(公告)日:1996-04-02

    申请号:US293421

    申请日:1994-08-22

    摘要: A vertical type semiconductor device is provided with an improved construction which greatly decreases the on-resistance without impairing the breakdown voltage thereof. In the fundamental DMOS cells that control a current to constitute the vertical semiconductor device, through-hole cells are arranged along the sides of a cell having a channel. The through-hole cell includes a through-hole extending from the surface of an n.sup.- -type drift region toward an n.sup.+ -type drain region, and also includes an n.sup.+ -type through-hole region that is formed by diffusing impurities from the inner wall of the through-hole which is continuous with the n.sup.+ -type drain region. A breakdown voltage of the element is maintained by the n.sup.- -type drift region between a p-type well region and the n.sup.+ -type through-hole region or the n.sup.+ -type drain region. Given the unique arrangement of the through-hole cells, the JFET resistance component becomes negligibly small between the DMOS cells neighboring along the sides of the cells despite the fact that the cells are finely formed, and a small on-resistance is exhibited.

    摘要翻译: 垂直型半导体器件具有改进的结构,其大大降低导通电阻而不损害其击穿电压。 在控制电流以构成垂直半导体器件的基本DMOS单元中,沿着具有沟道的单元的侧面布置有通孔单元。 通孔单元包括从n型漂移区域的表面向n +型漏极区域延伸的通孔,还包括通过从内部扩散杂质形成的n +型通孔区域 与n +型漏极区连续的通孔的壁。 元件的击穿电压由p型阱区域和n +型通孔区域或n +型漏极区域之间的n型漂移区域维持。 鉴于通孔单元的独特布置,尽管细胞形成细小,但是出现小的导通电阻,但是JFET电阻分量在沿着单元侧面相邻的DMOS单元之间变得可以忽略不计。

    SOLID STATE IMAGING DEVICE AND METHOD FOR DRIVING THE SAME
    6.
    发明申请
    SOLID STATE IMAGING DEVICE AND METHOD FOR DRIVING THE SAME 审中-公开
    固态成像装置及其驱动方法

    公开(公告)号:US20100309356A1

    公开(公告)日:2010-12-09

    申请号:US12864674

    申请日:2009-01-27

    IPC分类号: H04N5/335

    摘要: A solid state imaging device according to an aspect of the present invention includes: a pixel array (21) including pixel units arranged in rows and columns; a vertical shift register (26) which selects one of the rows of the pixel array (21); a column amplifier unit (22) including column amplifiers each of which is provided for a corresponding one of the columns and amplifies a column signal provided from the pixel unit included in the selected row; and a limiting circuit which limits an output voltage of the column amplifier to no more than a predetermined voltage that can be changed, wherein the limiting circuit changes the predetermined voltage according to switching between a normal mode and a high-sensitivity mode.

    摘要翻译: 根据本发明的一个方面的固态成像装置包括:像素阵列(21),包括以行和列排列的像素单元; 选择像素阵列(21)的行之一的垂直移位寄存器(26); 列列放大器单元(22),其包括列放大器,每个列放大器用于对应的一列,并放大从包括在所选行中的像素单元提供的列信号; 以及将列放大器的输出电压限制在不大于可以改变的预定电压的限制电路,其中限制电路根据正常模式和高灵敏度模式之间的切换来改变预定电压。

    Image processor
    7.
    发明授权
    Image processor 失效
    图像处理器

    公开(公告)号:US07646891B2

    公开(公告)日:2010-01-12

    申请号:US10529202

    申请日:2002-12-26

    摘要: There is provided an image processor and a method thereof for high-speed compensation for taken-image blurs produced by camera shakes or the like. In the first instance, a motion-detecting area is selected for each of two images taken by an image sensor. When projective data is calculated by means of computing in a predetermined direction pixels of the motion-detecting areas, the motion vector between the two images can be acquired based on the projective data. The image correlativity between the two images is then calculated in the direction that the motion vector designates; and the amount of pixel displacement between the two images is calculated based on the correlativity values acquired by the calculation. Moreover, the area that has been produced by displacing an image output area in a camera-shake compensation area designated in the second frame, by the pixel-displacement amount calculated by a displacement calculator is cut away from the camera-shake compensation area, and is outputted as an image for the image output area of the second frame.

    摘要翻译: 提供了一种用于高速补偿由相机抖动等产生的拍摄图像模糊的图像处理器及其方法。 在第一种情况下,对由图像传感器拍摄的两幅图像中的每一幅图像选择运动检测区域。 当通过在预定方向上计算运动检测区域的像素来计算投影数据时,可以基于投影数据获取两个图像之间的运动矢量。 然后在运动矢量指定的方向上计算两个图像之间的图像相关性; 并且基于通过计算获得的相关性值来计算两个图像之间的像素位移量。 此外,通过将在第二帧中指定的相机抖动补偿区域中的图像输出区域移位由位移计算器计算出的像素位移量而产生的区域被切掉相机抖动补偿区域,并且 作为第二帧的图像输出区域的图像输出。

    SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS AND DRIVING METHOD FOR THE SAME
    8.
    发明申请
    SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS AND DRIVING METHOD FOR THE SAME 有权
    固态成像装置,成像装置及其驱动方法

    公开(公告)号:US20090040346A1

    公开(公告)日:2009-02-12

    申请号:US12089289

    申请日:2006-08-28

    IPC分类号: H04N5/335 H04N5/225

    CPC分类号: H04N5/3765 H04N5/3456

    摘要: A solid-state imaging device includes first-group pixels 41, second-group pixels 42 skipped during thinning drive, and a scanning section 13. The scanning section 13 drives each of the first-group pixels 41 to perform read operation of outputting the output signal and initializing the amount of the signal charge accumulated in the photoelectric conversion element to a first level, and also drives each of the second-group pixels 42 to perform discharge operation of initializing the amount of the signal charge accumulated in the photoelectric conversion element to a second level that is higher than the first level and lower than a saturation signal level of the photoelectric conversion element 12.

    摘要翻译: 固态成像装置包括第一组像素41,稀疏驱动期间跳过的第二组像素42以及扫描部13.扫描部13驱动第一组像素41中的每一个以执行输出输出的读取操作 将累积在光电转换元件中的信号电荷的量信号并初始化为第一电平,并且驱动每个第二组像素42执行将在光电转换元件中累积的信号电荷的量初始化的放电操作,以 高于第一电平并低于光电转换元件12的饱和信号电平的第二电平。

    Semiconductor strain sensor
    10.
    发明授权
    Semiconductor strain sensor 失效
    半导体应变传感器

    公开(公告)号:US5329271A

    公开(公告)日:1994-07-12

    申请号:US878429

    申请日:1992-05-04

    CPC分类号: G01L1/18 G01P15/123

    摘要: A semiconductor strain sensor includes a silicon substrate, a strain resistive element and electrodes. The silicon substrate has a deformable portion which is deformed when stress is applied to it. The strain resistive element is formed on the deformable portion and has an at least a first layer and a second layer which form a heterojunction between them. The first layer is doped with impurities so that a two-dimensional carrier gas layer is formed in the second layer near the heterojunction. The two-dimensional carrier gas layer has carriers originating from the impurities. The electrodes electrically contact the two dimensional carrier gas layer. Change of resistance of the strain resistive element in accordance with the stress is detected through the electrodes.

    摘要翻译: 半导体应变传感器包括硅衬底,应变电阻元件和电极。 硅衬底具有可变形部分,当其施加应力时,可变形部分变形。 应变电阻元件形成在可变形部分上,并且具有在它们之间形成异质结的至少第一层和第二层。 第一层掺杂杂质,使得在异质结附近的第二层中形成二维载气层。 二维载气层具有源自杂质的载体。 电极与二维载气层电接触。 通过电极检测应变电阻元件根据应力的电阻变化。