公开(公告)号：US08358172B2

公开(公告)日：2013-01-22

申请号：US13023912

申请日：2011-02-09

申请人： Norio Chujo ,  Tsuneo Kawamata ,  Toshiaki Takai

发明人： Norio Chujo ,  Tsuneo Kawamata ,  Toshiaki Takai

IPC分类号： H03F3/45 ,  H03F3/191

CPC分类号： H03F3/45183 ,  H03F3/211 ,  H03F2203/45366 ,  H03F2203/45466 ,  H03F2203/45702 ,  H03F2203/45731

摘要： A peaking circuit for adjusting peaking of a high-frequency signal, comprises: a first inductor; a second inductor which is electromagnetically coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts electric current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the electromagnetically coupled first and second inductors is changed by the adjustment of the electric current passing through the second inductor, according to the input signal inputted via the signal input section, with the use of the transistor, thereby adjusting the peaking of signal waveform of electric current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.

摘要翻译： 一种用于调整高频信号峰值的峰值电路，包括：第一电感器; 与第一电感器电磁耦合的第二电感器; 信号输入部，其接收输入信号; 晶体管，其根据经由所述信号输入部输入的输入信号调整通过所述第二电感器的电流; 以及信号输出部，其输出由第一电感器调整了峰值的信号。 根据通过信号输入部输入的输入信号，通过使用晶体管，通过调节通过第二电感器的电流来改变电磁耦合的第一和第二电感器的相互电感，由此调整信号的峰值 从信号输出部输出通过第一电感器的电流波形和进行峰值调整的信号。

公开(公告)号：US20110241778A1

公开(公告)日：2011-10-06

申请号：US13023912

申请日：2011-02-09

申请人： Norio CHUJO ,  Tsuneo Kawamata ,  Toshiaki Takai

发明人： Norio CHUJO ,  Tsuneo Kawamata ,  Toshiaki Takai

IPC分类号： H03F3/45 ,  H05B37/02 ,  H03L5/00

CPC分类号： H03F3/45183 ,  H03F3/211 ,  H03F2203/45366 ,  H03F2203/45466 ,  H03F2203/45702 ,  H03F2203/45731

摘要： A peaking circuit for adjusting peaking of a high-frequency signal, comprises: a first inductor; a second inductor which is electromagnetically coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts electric current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the electromagnetically coupled first and second inductors is changed by the adjustment of the electric current passing through the second inductor, according to the input signal inputted via the signal input section, with the use of the transistor, thereby adjusting the peaking of signal waveform of electric current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.

摘要翻译： 一种用于调整高频信号峰值的峰值电路，包括：第一电感器; 与第一电感器电磁耦合的第二电感器; 信号输入部，其接收输入信号; 晶体管，其根据经由所述信号输入部输入的输入信号调整通过所述第二电感器的电流; 以及信号输出部，其输出由第一电感器调整了峰值的信号。 根据通过信号输入部输入的输入信号，通过使用晶体管，通过调节通过第二电感器的电流来改变电磁耦合的第一和第二电感器的相互电感，由此调整信号的峰值 从信号输出部输出通过第一电感器的电流波形和进行峰值调整的信号。

公开(公告)号：US20140023315A1

公开(公告)日：2014-01-23

申请号：US13989966

申请日：2011-11-18

申请人： Toshiaki Takai ,  Norio Chujo ,  Saori Hamamura

发明人： Toshiaki Takai ,  Norio Chujo ,  Saori Hamamura

IPC分类号： G02B6/42

CPC分类号： G02B6/42 ,  G02B6/4253 ,  G02B6/4255

摘要： An optical module achieving optical coupling at a low cost and by a simple and convenient process is intended to be provided. For attaining the purpose, a transparent member sealing an optical device and an optical transmission channel are connected as an optical coupling structure. Specifically, optical coupling is achieved in an optical module having an optical device, a first substrate having the optical device mounted thereon, and a second substrate or a transparent resin provided over the first substrate so as to hermetically seal the optical device by connecting an optical transmission channel over the second substrate or the transparent resin at a portion in which light from the optical device is transmitted.

摘要翻译： 旨在提供以低成本实现光耦合并且通过简单和方便的过程的光学模块。 为了实现这一目的，将光学装置和光传输通道密封的透明构件连接为光耦合结构。 具体地说，在具有光学装置的光学模块，安装有光学装置的第一基板和设置在第一基板上的第二基板或透明树脂的光学模块中实现光耦合，以通过连接光学装置来密封光学装置 透射通道在第二基板或透明树脂上，在其中透射来自光学装置的光的部分。

公开(公告)号：US07948059B2

公开(公告)日：2011-05-24

申请号：US11647128

申请日：2006-12-29

申请人： Yoshio Ozeki ,  Toshiaki Takai ,  Makoto Ohta ,  Takahiro Umeyama

发明人： Yoshio Ozeki ,  Toshiaki Takai ,  Makoto Ohta ,  Takahiro Umeyama

IPC分类号： H01L23/544

CPC分类号： H01L21/481 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

摘要： In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” μm, a thickness of the ceramic substrate is set to “b” μm, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” μm, a relationship of a≧269×c/b+151 is established.

摘要翻译： 在包括陶瓷基板，表面安装部件和密封树脂并且通过分割成片而获得的半导体器件中，陶瓷基板由多片基板构成，该多片基板设置有分隔槽，用于在前表面和后表面上分割成片 提前，将多个表面安装部件安装在多片基板上并由密封树脂共同密封，并且基板沿着分隔槽分开。 此外，当从陶瓷基板的前表面的端部到表面安装部件的端部的最短距离设定为“a”μm时，将陶瓷基板的厚度设定为“b”μm， 将陶瓷基板的表面和背面上的分隔槽的深度设定为“c”，建立a≥269×c / b + 151的关系。

公开(公告)号：US20070273022A1

公开(公告)日：2007-11-29

申请号：US11647128

申请日：2006-12-29

申请人： Yoshio Ozeki ,  Toshiaki Takai ,  Makoto Ohta ,  Takahiro Umeyama

发明人： Yoshio Ozeki ,  Toshiaki Takai ,  Makoto Ohta ,  Takahiro Umeyama

IPC分类号： H01L23/12

CPC分类号： H01L21/481 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

摘要： In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” μm, a thickness of the ceramic substrate is set to “b” μm, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” μm, a relationship of a≧269×c/b+151 is established.

摘要翻译： 在包括陶瓷基板，表面安装部件和密封树脂并且通过分割成片而获得的半导体器件中，陶瓷基板由多片基板构成，该多片基板设置有分隔槽，用于在前表面和后表面上分割成片 提前，将多个表面安装部件安装在多片基板上并由密封树脂共同密封，并且基板沿着分隔槽分开。 此外，当从陶瓷基板的前表面的端部到表面安装部件的端部的最短距离设定为“a”mum时，陶瓷基板的厚度设定为“b”mum， 陶瓷基板的表面和背面上的分隔槽的深度设定为“c”，建立a> = 269×c / b + 151的关系。

公开(公告)号：US20060006403A1

公开(公告)日：2006-01-12

申请号：US11135408

申请日：2005-05-24

申请人： Naoki Matsushima ,  Kenji Yoshimoto ,  Hiroyasu Sasaki ,  Masanobu Okayasu ,  Toshiaki Takai

发明人： Naoki Matsushima ,  Kenji Yoshimoto ,  Hiroyasu Sasaki ,  Masanobu Okayasu ,  Toshiaki Takai

IPC分类号： H01L29/22

CPC分类号： G02B6/4201 ,  G02B6/4215 ,  G02B6/4271 ,  G02B6/4272 ,  G02B6/4274 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided an optical module in which electrical wirings in a module package are simplified without increasing a manufacturing cost. A light emitting element is mounted on a substrate having electrical wirings therein. In the substrate, electrodes connected to the electrical wirings are formed at a side where the light emitting element is mounted. The light emitting element and the electrodes of one ends of the wirings are wire-bonded to each other and one ends of leads and the electrodes the other ends of the wirings are wire-bonded to each other.

摘要翻译： 提供了一种光模块，其中模块封装中的电线被简化，而不增加制造成本。 发光元件安装在其中具有电线的基板上。 在基板中，连接电气布线的电极形成在安装有发光元件的一侧。 发光元件和布线的一端的电极彼此线接合，引线的一端和电极的布线的另一端彼此线接合。

公开(公告)号：US08380075B2

公开(公告)日：2013-02-19

申请号：US12624470

申请日：2009-11-24

申请人： Yukio Sakigawa ,  Toshiaki Takai ,  Shohei Hata

发明人： Yukio Sakigawa ,  Toshiaki Takai ,  Shohei Hata

IPC分类号： H04B10/00

CPC分类号： G02B6/4215 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4253 ,  G02B6/4257 ,  G02B6/4259 ,  H04B10/40

摘要： There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.

摘要翻译： 提供了一种小型化和低成本的光模块，其用作通过一根光纤传输多种波长的光的波分复用光传输和单核双向光传输的终端，以及制造光模块的方法。 准备了安装有多个光学元件的基底，以及在基板的两个表面上形成有波长选择滤光器和反射镜的光复用器和解复用器。 这两个部件被包装成包装，使得光学元件安装表面和滤光器表面基本上彼此平行，并且光学元件布置成发射或接收与基部倾斜的光。 利用这种配置，由于光学复用器和解复用器可以平行于X-Y平面安装，所以可以通过使用车床来容易地加工封装，从而能够降低成本。

公开(公告)号：US07991251B2

公开(公告)日：2011-08-02

申请号：US12494890

申请日：2009-06-30

申请人： Shohei Hata ,  Naoki Matsushima ,  Toshiaki Takai ,  Yukio Sakigawa ,  Satoshi Arai

发明人： Shohei Hata ,  Naoki Matsushima ,  Toshiaki Takai ,  Yukio Sakigawa ,  Satoshi Arai

IPC分类号： G02B6/28 ,  G02B6/30

CPC分类号： G02B6/29365 ,  G02B6/29367 ,  G02B6/4204 ,  G02B6/4246 ,  Y10T156/1052 ,  Y10T156/1089

摘要： A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

摘要翻译： 过滤元件包括具有一对平行表面的第一玻璃基板和布置在一个平行表面上的带通滤波器，一对单晶基板（Si晶片），每个单晶基板包括形成有具有倾斜的凹陷的主表面 相对于占据凹部的开口的至少一半的主表面的表面，以及具有光学元件的第二玻璃基板。 单晶衬底对的主表面被接合到玻璃衬底的一对表面上。 凹陷面向玻璃基板并围绕带通滤光片。 通过这种构造，可以通过晶片级处理以高精度和低成本大量生产过滤元件。

公开(公告)号：US20110080657A1

公开(公告)日：2011-04-07

申请号：US12871877

申请日：2010-08-30

申请人： Toshiaki Takai ,  Eiji Sakamoto ,  Shohei Hata

发明人： Toshiaki Takai ,  Eiji Sakamoto ,  Shohei Hata

IPC分类号： G02B3/08

CPC分类号： G02B6/4206 ,  G02B6/4214 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01327 ,  H01L2924/00

摘要： There is provided means of achieving the improvement of optical coupling efficiency between a surface receiving/emitting element and an optical transmission path with a simple structure and low cost. An optical element and a substrate having an optical waveguide layer and electric wiring are connected with each other through a lens having a Fresnel lens shape. A through via is provided in the lens, and the optical element and the electric wiring in the substrate are electrically connected with each other through the through via. Instead of the lens, a unit in which a lens is mounted inside an optical-element mounting substrate may be used.

摘要翻译： 提供了以简单的结构和低成本实现表面接收/发射元件和光传输路径之间的光耦合效率的提高的方法。 具有光波导层和电布线的光学元件和基板通过具有菲涅尔透镜形状的透镜彼此连接。 在透镜中设置通孔，并且基板中的光学元件和电布线通过贯通孔彼此电连接。 代替透镜，可以使用其中透镜安装在光学元件安装基板内的单元。

公开(公告)号：US20110243512A1

公开(公告)日：2011-10-06

申请号：US13126898

申请日：2009-06-11

申请人： Toshiaki Takai ,  Yukio Sakigawa ,  Shohei Hata

发明人： Toshiaki Takai ,  Yukio Sakigawa ,  Shohei Hata

IPC分类号： G02B6/36

CPC分类号： G02B6/4246 ,  G02B6/29367 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02228 ,  H01S5/02284 ,  H01S5/02296 ,  H01S2301/176

摘要： An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.

摘要翻译： 提供一种简单结构的光模块，其可以抑制由于漏光引起的光串扰，而不会导致发光元件的特性劣化和可靠性降低，从而获得适当的光接收灵敏度。 在其中多个发光元件11和光接收元件12安装在光学元件安装基板1上的光学模块中，用于吸收发光波长的光的光吸收树脂6， 发光元件11布置成覆盖发光元件11的侧表面，并且在光吸收树脂6和光学元件安装之间布置有包括不与光吸收树脂6粘合的材料的非粘合层7 基板1。