公开(公告)号：US20110080657A1

公开(公告)日：2011-04-07

申请号：US12871877

申请日：2010-08-30

申请人： Toshiaki Takai ,  Eiji Sakamoto ,  Shohei Hata

发明人： Toshiaki Takai ,  Eiji Sakamoto ,  Shohei Hata

IPC分类号： G02B3/08

CPC分类号： G02B6/4206 ,  G02B6/4214 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01327 ,  H01L2924/00

摘要： There is provided means of achieving the improvement of optical coupling efficiency between a surface receiving/emitting element and an optical transmission path with a simple structure and low cost. An optical element and a substrate having an optical waveguide layer and electric wiring are connected with each other through a lens having a Fresnel lens shape. A through via is provided in the lens, and the optical element and the electric wiring in the substrate are electrically connected with each other through the through via. Instead of the lens, a unit in which a lens is mounted inside an optical-element mounting substrate may be used.

摘要翻译： 提供了以简单的结构和低成本实现表面接收/发射元件和光传输路径之间的光耦合效率的提高的方法。 具有光波导层和电布线的光学元件和基板通过具有菲涅尔透镜形状的透镜彼此连接。 在透镜中设置通孔，并且基板中的光学元件和电布线通过贯通孔彼此电连接。 代替透镜，可以使用其中透镜安装在光学元件安装基板内的单元。

公开(公告)号：US07939938B2

公开(公告)日：2011-05-10

申请号：US12028108

申请日：2008-02-08

申请人： Shohei Hata ,  Naoki Matsushima ,  Eiji Sakamoto ,  Ryoji Okada ,  Takanori Aono ,  Atsushi Kazama ,  Toshiki Kida

发明人： Shohei Hata ,  Naoki Matsushima ,  Eiji Sakamoto ,  Ryoji Okada ,  Takanori Aono ,  Atsushi Kazama ,  Toshiki Kida

IPC分类号： H01L23/04

CPC分类号： B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

摘要翻译： 一种封装结构，用于通过在晶片级焊接连接来密封功能器件，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化 施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

公开(公告)号：US08258637B2

公开(公告)日：2012-09-04

申请号：US12964907

申请日：2010-12-10

申请人： Eiji Sakamoto ,  Shohei Hata

发明人： Eiji Sakamoto ,  Shohei Hata

IPC分类号： H01L23/29

CPC分类号： H01L24/29 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/13101 ,  H01L2224/13688 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81815 ,  H01L2224/8189 ,  H01L2224/81905 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8389 ,  H01L2224/83905 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/157 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining reliable bonding in high temperature environment in place of solder including Pb. In the bonding structure for a first member and a second member, solder and glass are used to bond the first member and the second member together and the glass seals the solder. Thereby, electrical conductivity is ensured and the outflow of melting solder in high temperatures can be inhibited to improve the durability.

摘要翻译： 作为能够在高温环境下保持可靠的接合而代替含Pb的焊料的接合材料，可以提供接合区域能够耐受高温环境并且可以高可靠性地保持接合的接合结构。 在第一构件和第二构件的接合结构中，使用焊料和玻璃将第一构件和第二构件结合在一起，并且玻璃密封焊料。 由此，确保导电性，能够抑制高温熔融焊料的流出，提高耐久性。

公开(公告)号：US08003193B2

公开(公告)日：2011-08-23

申请号：US11924924

申请日：2007-10-26

申请人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

发明人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

IPC分类号： B32B3/24 ,  B32B17/06

CPC分类号： G01P15/0802 ,  B81B2201/0271 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0897 ,  H03H9/105 ,  H03H9/1057 ,  H03H9/173 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2462 ,  Y10T428/24826 ,  Y10T428/265

摘要： The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.

摘要翻译： 本发明通过在基于MEMS的功能器件的晶片级封装中改善阳极结的接合部分的气密性来提供低成本MEMS功能器件。 MEMS功能器件包括通过处理主要由Si制成的衬底，形成在功能元件周围形成的用于密封的金属化膜形成的功能元件部分，以及连接到金属化膜的用于通过阳极接合进行密封的玻璃衬底。 形成在用于密封的金属化膜的表面上是以Sn和Ti中的至少一种为主要成分的金属化膜。

公开(公告)号：US08269301B2

公开(公告)日：2012-09-18

申请号：US12295740

申请日：2007-04-04

申请人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima ,  Hideaki Takemori ,  Masatoshi Seki

发明人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima ,  Hideaki Takemori ,  Masatoshi Seki

IPC分类号： H01L31/0203 ,  H01L27/15

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.

摘要翻译： 提供了用于安装具有优异的散热性并且可以分批地以晶片状态形成的光学器件的安装座。 包括光学器件安装部件和布线部件的金属化电极形成在以绝缘材料为主要成分的第一基板的表面上，在作为第二基板的玻璃基板中形成通孔，光学元件安装部 第一基板被排列成位于第二基板的通孔内部，并且第一基板和第二基板通过诸如阳极接合的方法接合在一起。

公开(公告)号：US20090219728A1

公开(公告)日：2009-09-03

申请号：US12295740

申请日：2007-04-04

申请人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima ,  Hideaki Takemori ,  Masatoshi Seki

发明人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima ,  Hideaki Takemori ,  Masatoshi Seki

IPC分类号： F21V19/00 ,  B32B38/10

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.

摘要翻译： 提供了用于安装具有优异的散热性并且可以分批地以晶片状态形成的光学器件的安装座。 包括光学器件安装部件和布线部件的金属化电极形成在以绝缘材料为主要成分的第一基板的表面上，在作为第二基板的玻璃基板中形成通孔，光学元件安装部 第一基板被排列成位于第二基板的通孔内部，并且第一基板和第二基板通过诸如阳极接合的方法接合在一起。

公开(公告)号：US20080233349A1

公开(公告)日：2008-09-25

申请号：US11924924

申请日：2007-10-26

申请人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

发明人： Shohei Hata ,  Eiji Sakamoto ,  Naoki Matsushima

IPC分类号： B32B3/24

CPC分类号： G01P15/0802 ,  B81B2201/0271 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0897 ,  H03H9/105 ,  H03H9/1057 ,  H03H9/173 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2462 ,  Y10T428/24826 ,  Y10T428/265

摘要： The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.

摘要翻译： 本发明通过在基于MEMS的功能器件的晶片级封装中改善阳极结的接合部分的气密性来提供低成本MEMS功能器件。 MEMS功能器件包括通过处理主要由Si制成的衬底，形成在功能元件周围形成的用于密封的金属化膜形成的功能元件部分，以及连接到金属化膜的用于通过阳极接合进行密封的玻璃衬底。 形成在用于密封的金属化膜的表面上是以Sn和Ti中的至少一种为主要成分的金属化膜。

公开(公告)号：US20080217752A1

公开(公告)日：2008-09-11

申请号：US12028108

申请日：2008-02-08

申请人： Shohei Hata ,  Naoki Matsushima ,  Eiji Sakamoto ,  Ryoji Okada ,  Takanori Aono ,  Atsushi Kazama ,  Toshiki Kida

发明人： Shohei Hata ,  Naoki Matsushima ,  Eiji Sakamoto ,  Ryoji Okada ,  Takanori Aono ,  Atsushi Kazama ,  Toshiki Kida

IPC分类号： H01L23/02

CPC分类号： B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

摘要翻译： 一种用于通过在晶片级焊接连接来密封功能器件的封装结构，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化 施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

公开(公告)号：US07078706B2

公开(公告)日：2006-07-18

申请号：US10859770

申请日：2004-06-03

申请人： Eiji Sakamoto

发明人： Eiji Sakamoto

IPC分类号： G01F23/00 ,  G21K5/08 ,  G21K5/10

CPC分类号： F16C29/025 ,  F16C32/0603 ,  F16C33/748 ,  F16C2300/62 ,  G03F7/70841 ,  G03F7/70975

摘要： Disclosed is a chamber having a static-pressure bearing disposed therein, the chamber including an inside pressure gauge for detecting an inside pressure of said chamber, and a pressure controller for decreasing the inside pressure of the chamber on the basis of the detection made through the inside pressure gauge. This arrangement effectively prevents unwanted increase of the chamber inside pressure and avoids local breakage of the chamber.

摘要翻译： 公开了一种具有设置在其中的静压力轴承的室，所述室包括用于检测所述室的内部压力的内部压力计，以及用于基于通过所述室的所述检测而降低所述室的内部压力的压力控制器 内压力表。 这种布置有效地防止了室内不希望的增加压力，并避免了室的局部破裂。

公开(公告)号：US5374829A

公开(公告)日：1994-12-20

申请号：US231785

申请日：1994-04-25

申请人： Eiji Sakamoto ,  Ryuichi Ebinuma ,  Shinichi Hara ,  Mitsuji Marumo

发明人： Eiji Sakamoto ,  Ryuichi Ebinuma ,  Shinichi Hara ,  Mitsuji Marumo

IPC分类号： C30B25/12 ,  C30B31/14 ,  H01L21/683 ,  H01J37/20

CPC分类号： C30B31/14 ,  C30B25/12 ,  H01L21/6838 ,  Y10T279/11

摘要： A wafer holding device of the vacuum attraction type includes a structural member having a protrusion for supporting a wafer and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member. The elastic members are distributed on a wafer attraction plane of the structural member.

摘要翻译： 真空吸引型的晶片保持装置包括具有用于支撑晶片的突起的结构构件和由具有比晶片的弹性模量小的结构构件的弹性模量的材料制成的弹性构件。 弹性构件分布在结构构件的晶片吸引面上。