公开(公告)号：US20160362791A1

公开(公告)日：2016-12-15

申请号：US15121524

申请日：2015-02-24

Applicant: OSAKA UNIVERSITY ,  NOF CORPORATION

Inventor： Kazuya Yamamura ,  Yuji Ohkubo ,  Haruka Sato ,  Masaya Hikita

IPC: C23C18/04 ,  H01J37/32 ,  C09D11/52 ,  C09D7/12 ,  C09D151/00 ,  C09J11/06 ,  C09J5/00 ,  C09J151/08 ,  C09J151/00 ,  C09D151/08 ,  C23C18/08 ,  C09J9/02

CPC classification number: C23C18/04 ,  C08J7/045 ,  C08J7/123 ,  C08J2327/18 ,  C08J2345/00 ,  C08J2379/08 ,  C08J2433/14 ,  C09D7/63 ,  C09D11/52 ,  C09D151/003 ,  C09D151/08 ,  C09J5/00 ,  C09J9/02 ,  C09J11/06 ,  C09J151/003 ,  C09J151/08 ,  C09J2427/006 ,  C09J2479/086 ,  C23C18/08 ,  H01J37/32055 ,  H01J2237/3328

Abstract: A method includes:generating a peroxide radical on a dielectric substrate surface by treating the dielectric substrate surface with atmospheric pressure plasma using a rare gas; fixing a functional group forming a coordinate bond with a silver ion, by reacting a grafting agent; and applying a silver-containing composition to the substrate surface, followed by heating and curing the silver-containing composition, to thereby form a silver thin film layer, the silver-containing composition containing a silver compound (A) represented by Formula (1) and an amine compound (B) represented by Formula (2), the silver compound (A) being contained in an amount of 10 to 50% by mass, the amine compound (B) being contained in an amount of 50 to 90% by mass, relative to a total amount of 100% by mass of the silver compound (A) and the amine compound (B).The method enables to form a metal film having high adhesiveness even on the surface of a fluorine resin, which is suitable as a dielectric substrate due to its property of avoidance of delay in signal transmission speed or increase in power consumption, but has extremely low adhesiveness. (R1; a hydrogen atom, —(CY2)a-CH3, or —((CH2)b-O—CHZ)c-CH3; R2: —(CY2)d-CH3 or —((CH2)e-O—CHZ)f-CH3; Y: a hydrogen atom or —(CH2)g-CH3; Z: a hydrogen atom or —(CH2)h-CH3; a: an integer of 0 to 8; b: an integer of 1 to 4; c: an integer of 1 to 3; d: an integer of 1 to 8; e: an integer of 1 to 4; f: an integer of 1 to 3; g: an integer of 1 to 3; h: an integer of 1 or 2)

Abstract translation: （R1;氢原子， - （CY2）a-CH3或 - （（CH2）bO-CHZ）c-CH3; R2： - （CY2）d-CH3或 - （（CH2）eO-CHZ） CH 3; Y：氢原子或 - （CH 2）g -CH 3; Z：氢原子或 - （CH 2）h -CH 3; a：0〜8的整数; b：1〜4的整数; c： 1〜3的整数; d表示1〜8的整数，e表示1〜4的整数，f表示1〜3的整数，g表示1〜3的整数，h表示1以上的整数， 2）

公开(公告)号：US10730253B2

公开(公告)日：2020-08-04

申请号：US15508576

申请日：2015-09-04

Applicant: OSAKA UNIVERSITY

Inventor： Kazuya Yamamura ,  Yuji Ohkubo ,  Kento Ishihara ,  Masafumi Shibahara ,  Asahiro Nagatani ,  Koji Honda

IPC: B29C71/04 ,  B32B27/30 ,  C08J5/12 ,  C08J7/00 ,  C08J7/12 ,  B29C37/00 ,  B29C65/48 ,  B29K27/18

Abstract: An object of the present invention is to provide a process for producing a surface-modified molded article, whereby surface layer strength of a molded article can be enhanced, and a molded article containing an organic polymer compound with low adhesive property, such as a fluororesin, can be bonded to an adherend without the use of an adhesive, and whereby a treatment step or an apparatus in an atmospheric-pressure plasma treatment are not complicated, and to provide a process for producing a composite of the surface-modified molded article and an adherend. The present invention is a process for producing a surface-modified molded article wherein a surface of the molded article containing an organic polymer compound is subjected to an atmospheric pressure plasma treatment to introduce a peroxide radical with adjusting the surface temperature of the molded article to (melting point of the organic polymer compound −120° C. or higher.

公开(公告)号：US11383488B2

公开(公告)日：2022-07-12

申请号：US17059721

申请日：2019-05-30

Applicant: OSAKA UNIVERSITY

Inventor： Yuji Ohkubo ,  Kazuya Yamamura

IPC: B32B7/04 ,  B32B25/08 ,  B32B25/20 ,  B32B27/30

Abstract: A joined body of a resin body containing a fluorine-based resin and a rubber body containing a vulcanized silicone rubber. It is preferable that the vulcanized silicone rubber contains a dimethylsiloxane unit. It is found that, by performing predetermined plasma treatment on the surface of a rubber body containing a vulcanized silicone rubber, the rubber body adheres to a resin body containing a fluorine-based resin.

公开(公告)号：US11795317B2

公开(公告)日：2023-10-24

申请号：US17988988

申请日：2022-11-17

Applicant: OSAKA UNIVERSITY ,  KABUSHIKI KAISHA TOSHIBA

Inventor： Yuji Ohkubo ,  Kazuya Yamamura ,  Erika Miyake ,  Izuru Komatsu

IPC: C08L27/18 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/32 ,  B32B33/00

CPC classification number: C08L27/18 ,  B32B27/08 ,  B32B27/20 ,  B32B27/283 ,  B32B27/322 ,  B32B33/00 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2264/1021 ,  B32B2305/30 ,  B32B2307/70 ,  B32B2310/14 ,  B32B2327/18 ,  B32B2383/00

Abstract: Provided is a laminated body that has high adhesiveness between a resin body containing a fluorine-based resin and a silicone gel and that can be attached to and detached from an adherend for use. A laminated body comprising: a resin body; and a gel body, wherein the resin body comprises a fluorine-based resin, and the gel body comprises a silicone gel and lipophilic silica particles.

公开(公告)号：US12163028B2

公开(公告)日：2024-12-10

申请号：US17050172

申请日：2019-04-26

Applicant: BRIDGESTONE CORPORATION ,  OSAKA UNIVERSITY

Inventor： Hiroyuki Fudemoto ,  Atsushi Fukushima ,  Masahiro Homma ,  Yuji Ohkubo ,  Kazuya Yamamura

IPC: C08L9/06 ,  B60C1/00 ,  B60C15/04

Abstract: A resin-rubber composite includes: a resin member that has a treated surface, to which a surface treatment by means of a plasma treatment has been applied; and a rubber member that is disposed in contact with the treated surface of the resin member and includes a rubber, a filler having a silanol group, and a silane coupling agent, with a filler content of from 30 phr to 100 phr with respect to 100 phr of the rubber, and a silane coupling agent content of from 2 parts by mass to 15 parts by mass with respect to 100 parts by mass of the filler.

公开(公告)号：US20240371677A1

公开(公告)日：2024-11-07

申请号：US18775291

申请日：2024-07-17

Applicant: DENSO CORPORATION ,  OSAKA UNIVERSITY

Inventor： Kantaro HORI ,  Bahman Soltani ,  Kazufumi AOKI ,  Naoki Maruno ,  Yuya KATO ,  Kazuya Yamamura ,  Xu Yang

IPC: H01L21/683

Abstract: A chuck apparatus is configured to hold a wafer during planarization of the wafer with the aid of anodizing. The chuck apparatus includes a chuck cover, a suction portion, and an energizing portion. The suction portion includes a suction surface that suctions the wafer. The energizing portion is provided in the suction portion so as to come into contact and energize the wafer suctioned by the suction portion. The chuck cover covers the suction portion and the energizing portion in an insulating manner while exposing the suction surface.

公开(公告)号：US20220380927A1

公开(公告)日：2022-12-01

申请号：US17750465

申请日：2022-05-23

Applicant: DENSO CORPORATION ,  OSAKA UNIVERSITY

Inventor： Kazufumi Aoki ,  Naoki Maruno ,  Bahman Soltani ,  Yuya Kato ,  Kazuya Yamamura ,  Xu Yang

IPC: C25D11/32 ,  B24B29/00 ,  C25D21/12

Abstract: A surface processing method for a SiC substrate includes the following processes or steps: anodizing a workpiece surface of the SiC substrate by passing a current having a current density of 15 mA/cm2 or more through the SiC substrate as an anode in the presence of an electrolyte; disposing a grinding wheel layer of a surface processing pad to the workpiece surface and selectively removing, with the grinding wheel layer, an oxide formed on the workpiece surface through anodization; and performing, simultaneously or sequentially, the anodization of the workpiece surface and the selective removal of the oxide formed on the workpiece surface with the grinding wheel layer.