公开(公告)号：US20160284943A1

公开(公告)日：2016-09-29

申请号：US15034017

申请日：2014-11-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Andreas Gruendl ,  Tobias Gebuhr ,  Markus Pindl

IPC: H01L33/48 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.

Abstract translation: 光电部件包括具有顶侧的壳体，其中在顶侧布置有正浮雕的锚定结构，覆盖元件布置在顶侧上方并锚定在锚定结构处，并且覆盖元件完全覆盖 顶端。

公开(公告)号：US09276183B2

公开(公告)日：2016-03-01

申请号：US14386239

申请日：2013-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Stefan Gruber

IPC: H01L23/02 ,  H01L33/62 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014

Abstract: In at least one embodiment of the optoelectronic semiconductor component (1), the optoelectronic semiconductor component has a support (2). At least one optoelectronic semiconductor chip (3) with a radiation outlet face (30) is applied onto a support upper face (20). A sacrificial layer (5) is located over the radiation outlet face (30) in the direction away from the support (2). A housing body (6) which has a housing upper face (60) is molded around the semiconductor chip (3) and/or around the sacrificial layer (5) in a lateral direction parallel to the radiation outlet face (30). A sacrificial layer (5) upper face (50) which faces away from the radiation outlet face (30) is free of a housing body (6) material.

Abstract translation: 在光电子半导体部件（1）的至少一个实施例中，光电子半导体部件具有支撑件（2）。 具有辐射出射面（30）的至少一个光电半导体芯片（3）被施加到支撑上表面（20）上。 牺牲层（5）沿远离支撑件（2）的方向位于辐射出口面（30）的上方。 具有壳体上表面（60）的壳体（6）在平行于辐射出口面（30）的横向方向围绕半导体芯片（3）和/或围绕牺牲层（5）模制。 背离辐射出口面（30）的牺牲层（5）上表面（50）没有壳体（6）材料。

公开(公告)号：US20180287018A1

公开(公告)日：2018-10-04

申请号：US15764938

申请日：2016-09-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Goldbach ,  Andreas Gruendl

IPC: H01L33/50

Abstract: An optoelectronic component includes a layer configured to generate an electromagnetic radiation including a first wavelength; a second layer including a conversion material and a scattering material, wherein the conversion material is configured to shift the first wavelength of the electromagnetic radiation to a second wavelength, and the scattering material is configured to scatter the first wavelength to a greater extent than the second wavelength.

公开(公告)号：US09865785B2

公开(公告)日：2018-01-09

申请号：US15039303

申请日：2014-11-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Tobias Gebuhr ,  Markus Pindl

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  G10L2015/223 ,  H01L24/48 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.

公开(公告)号：US09793442B2

公开(公告)日：2017-10-17

申请号：US15034017

申请日：2014-11-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Tobias Gebuhr ,  Markus Pindl

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.

公开(公告)号：US20150041832A1

公开(公告)日：2015-02-12

申请号：US14386239

申请日：2013-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Stefan Gruber

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014

Abstract: In at least one embodiment of the optoelectronic semiconductor component (1), the optoelectronic semiconductor component has a support (2). At least one optoelectronic semiconductor chip (3) with a radiation outlet face (30) is applied onto a support upper face (20). A sacrificial layer (5) is located over the radiation outlet face (30) in the direction away from the support (2). A housing body (6) which has a housing upper face (60) is molded around the semiconductor chip (3) and/or around the sacrificial layer (5) in a lateral direction parallel to the radiation outlet face (30). A sacrificial layer (5) upper face (50) which faces away from the radiation outlet face (30) is free of a housing body (6) material.

Abstract translation: 在光电子半导体部件（1）的至少一个实施例中，光电子半导体部件具有支撑件（2）。 具有辐射出射面（30）的至少一个光电半导体芯片（3）被施加到支撑上表面（20）上。 牺牲层（5）沿远离支撑件（2）的方向位于辐射出口面（30）的上方。 具有壳体上表面（60）的壳体（6）在平行于辐射出口面（30）的横向方向围绕半导体芯片（3）和/或围绕牺牲层（5）模制。 背离辐射出口面（30）的牺牲层（5）上表面（50）没有壳体（6）材料。