公开(公告)号：US20190273191A1

公开(公告)日：2019-09-05

申请号：US16345287

申请日：2017-11-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ivar TANGRING ,  Markus RICHTER

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: A method of producing radiation-emitting semiconductor components includes arranging radiation-emitting semiconductor chips on a conversion layer; thickening the conversion layer next to and between the semiconductor chips by applying a filling compound containing phosphor, wherein the thickened conversion layer adjoins a front side and side faces of the semiconductor chips; forming a reflective layer on the conversion layer and on the semiconductor chips in a region of a rear side of the semiconductor chips, wherein a rear-side surface of the contacts of the semiconductor chips remains uncovered; and severing the reflective layer and the conversion layer to form singulated semiconductor components including a single semiconductor chip, a part of the conversion layer arranged on the front side and on the side faces of the semiconductor chip, and a part of the reflective layer arranged in the region of the rear side on the semiconductor chip and on the conversion layer.

公开(公告)号：US20160079489A1

公开(公告)日：2016-03-17

申请号：US14785620

申请日：2014-04-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Markus RICHTER ,  Alexander BAUMGARTNER ,  Hans-Christoph GALLMEIER ,  Tony ALBRECHT

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/507 ,  H01L33/0095 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method is provided for producing a plurality of radiation-emitting semiconductor chips, having the following steps:providing a plurality of semiconductor bodies (1) which are suitable for emitting electromagnetic radiation from a radiation exit face (3),applying the semiconductor bodies (1) to a carrier (2),applying a first mask layer (4) to regions of the carrier (2) between the semiconductor bodies (1),applying a conversion layer (5) to the entire surface of the semiconductor bodies (1) and the first mask layer (4) using a spray coating method, andremoving the first mask layer (4), such that in each case a conversion layer (5) arises on the radiation exit faces (3) of the semiconductor bodies (1).

Abstract translation: 提供了一种用于制造多个辐射发射半导体芯片的方法，具有以下步骤：提供适于从辐射出射面（3）发射电磁辐射的多个半导体本体（1），施加半导体本体（ 1）到载体（2）上，在半导体体（1）之间的载体（2）的区域上施加第一掩模层（4），在半导体本体（1）的整个表面上施加转换层 ）和第一掩模层（4），并且去除第一掩模层（4），使得在每种情况下，在半导体主体的辐射出射面（3）上出现转换层（5） 1）。