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公开(公告)号:US09871075B2
公开(公告)日:2018-01-16
申请号:US14443989
申请日:2013-11-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Stefan Grötsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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2.
公开(公告)号:US20180097156A1
公开(公告)日:2018-04-05
申请号:US15560140
申请日:2016-03-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Christian Leirer , Alexander Linkov , Matthias Sperl , Matthias Kiessling
CPC classification number: H01L33/58 , H01L33/005 , H01L33/507
Abstract: An optoelectronic lighting device and a method for manufacturing an optoelectronic lighting device are disclosed. In an embodiment the device includes a carrier and a light-emitting diode arranged on the carrier having a light-emitting surface. The device further includes a microlens structure including a plurality of microlenses, wherein the microlens structure is arranged on the light-emitting surface of the diode and a conversion layer arranged on the microlens structure, wherein the light-emitting surface is configured to emit light, wherein the microlens structure images, at least in part, the light, and wherein the conversion layer converts the light.
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公开(公告)号:US09997559B2
公开(公告)日:2018-06-12
申请号:US15825003
申请日:2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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公开(公告)号:US20170317245A1
公开(公告)日:2017-11-02
申请号:US15524036
申请日:2015-10-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Björn Hoxhold , Matthias Kiessling , Matthias Sperl
Abstract: A method of applying a first material to a surface in a plurality of mutually separate coating regions includes: A) providing the surface containing the coating regions; B) producing a first masking layer on the surface by a photolithographic process, wherein the first masking layer includes a plurality of first openings arranged above the coating regions; C) providing a self-supporting second masking layer and then applying the second masking layer to the first masking layer, wherein the second masking layer includes a plurality of second openings arranged above the first openings and having a size less than or equal to a size of the first openings; and D) applying the first material to the surface in the coating regions through the first and second openings in the first and second masking layers.
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5.
公开(公告)号:US11824143B2
公开(公告)日:2023-11-21
申请号:US17285905
申请日:2019-10-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Günter Spath , Daniel Leisen , Simon Jerebic , Matthias Kiessling
CPC classification number: H01L33/502 , H01L33/56 , H01L2933/005 , H01L2933/0041 , H01L2933/0091
Abstract: In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.
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公开(公告)号:US20220077362A1
公开(公告)日:2022-03-10
申请号:US17433060
申请日:2020-02-07
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Peter Nagel , Christopher Wiesmann , Matthias Kiessling
IPC: H01L33/58 , H01L25/075 , H01L33/50
Abstract: In an embodiment a component includes a common carrier, a plurality of component parts, converter layers and internal scattering regions, wherein the component parts are arranged side by side in a lateral direction and vertically between the common carrier and the converter layers, wherein the component has a pass-through region and a radiation exit surface which, in a vertical direction, is spaced apart from the converter layers by the pass-through region, wherein adjacent converter layers are laterally spaced from each other by an intermediate region which, in top view of the carrier, is completely covered by the pass-through region, and wherein the inner scattering regions adjoin the pass-through region and the converter layers and are arranged at least partially in the intermediate region or directly adjoin the intermediate region.
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7.
公开(公告)号:US20210376199A1
公开(公告)日:2021-12-02
申请号:US17285905
申请日:2019-10-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Günter Spath , Daniel Leisen , Simon D. Jerebic , Matthias Kiessling
Abstract: In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.
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公开(公告)号:US20180083063A1
公开(公告)日:2018-03-22
申请号:US15825003
申请日:2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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公开(公告)号:US20150319814A1
公开(公告)日:2015-11-05
申请号:US14443989
申请日:2013-11-21
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: Stefan Grötsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
IPC: H05B33/08
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
Abstract translation: 光电子半导体部件包括具有用于产生辐射或用于接收辐射的活动区域的第一功能区域和适于有助于驱动第一功能区域的第二功能区域。 第一功能区域和第二功能区域集成在相同的载体基板上。
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