公开(公告)号：US09871075B2

公开(公告)日：2018-01-16

申请号：US14443989

申请日：2013-11-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Grötsch ,  Matthias Kiessling ,  Michael Wittmann ,  Stefan Gruber

IPC: H05B33/08 ,  H01L27/15

CPC classification number: H01L27/15 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/083

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

公开(公告)号：US09276183B2

公开(公告)日：2016-03-01

申请号：US14386239

申请日：2013-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Stefan Gruber

IPC: H01L23/02 ,  H01L33/62 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014

Abstract: In at least one embodiment of the optoelectronic semiconductor component (1), the optoelectronic semiconductor component has a support (2). At least one optoelectronic semiconductor chip (3) with a radiation outlet face (30) is applied onto a support upper face (20). A sacrificial layer (5) is located over the radiation outlet face (30) in the direction away from the support (2). A housing body (6) which has a housing upper face (60) is molded around the semiconductor chip (3) and/or around the sacrificial layer (5) in a lateral direction parallel to the radiation outlet face (30). A sacrificial layer (5) upper face (50) which faces away from the radiation outlet face (30) is free of a housing body (6) material.

Abstract translation: 在光电子半导体部件（1）的至少一个实施例中，光电子半导体部件具有支撑件（2）。 具有辐射出射面（30）的至少一个光电半导体芯片（3）被施加到支撑上表面（20）上。 牺牲层（5）沿远离支撑件（2）的方向位于辐射出口面（30）的上方。 具有壳体上表面（60）的壳体（6）在平行于辐射出口面（30）的横向方向围绕半导体芯片（3）和/或围绕牺牲层（5）模制。 背离辐射出口面（30）的牺牲层（5）上表面（50）没有壳体（6）材料。

公开(公告)号：US20180083063A1

公开(公告)日：2018-03-22

申请号：US15825003

申请日：2017-11-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Groetsch ,  Matthias Kiessling ,  Michael Wittmann ,  Stefan Gruber

IPC: H01L27/15 ,  H05B33/08

CPC classification number: H01L27/15 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/083

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

公开(公告)号：US20150319814A1

公开(公告)日：2015-11-05

申请号：US14443989

申请日：2013-11-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Grötsch ,  Matthias Kiessling ,  Michael Wittmann ,  Stefan Gruber

IPC: H05B33/08

CPC classification number: H01L27/15 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/083

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

Abstract translation: 光电子半导体部件包括具有用于产生辐射或用于接收辐射的活动区域的第一功能区域和适于有助于驱动第一功能区域的第二功能区域。 第一功能区域和第二功能区域集成在相同的载体基板上。

公开(公告)号：US20150041832A1

公开(公告)日：2015-02-12

申请号：US14386239

申请日：2013-03-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Stefan Gruber

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014

Abstract: In at least one embodiment of the optoelectronic semiconductor component (1), the optoelectronic semiconductor component has a support (2). At least one optoelectronic semiconductor chip (3) with a radiation outlet face (30) is applied onto a support upper face (20). A sacrificial layer (5) is located over the radiation outlet face (30) in the direction away from the support (2). A housing body (6) which has a housing upper face (60) is molded around the semiconductor chip (3) and/or around the sacrificial layer (5) in a lateral direction parallel to the radiation outlet face (30). A sacrificial layer (5) upper face (50) which faces away from the radiation outlet face (30) is free of a housing body (6) material.

Abstract translation: 在光电子半导体部件（1）的至少一个实施例中，光电子半导体部件具有支撑件（2）。 具有辐射出射面（30）的至少一个光电半导体芯片（3）被施加到支撑上表面（20）上。 牺牲层（5）沿远离支撑件（2）的方向位于辐射出口面（30）的上方。 具有壳体上表面（60）的壳体（6）在平行于辐射出口面（30）的横向方向围绕半导体芯片（3）和/或围绕牺牲层（5）模制。 背离辐射出口面（30）的牺牲层（5）上表面（50）没有壳体（6）材料。

公开(公告)号：US09997559B2

公开(公告)日：2018-06-12

申请号：US15825003

申请日：2017-11-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Groetsch ,  Matthias Kiessling ,  Michael Wittmann ,  Stefan Gruber

IPC: H05B33/08 ,  H01L27/15

CPC classification number: H01L27/15 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/083

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

公开(公告)号：US09922907B2

公开(公告)日：2018-03-20

申请号：US15327009

申请日：2015-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  MIchael Zitzlsperger ,  Christian Ziereis ,  Stefan Gruber

IPC: H01L23/495 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/02 ,  H01L33/48

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49113

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.

公开(公告)号：US20170179353A1

公开(公告)日：2017-06-22

申请号：US15327009

申请日：2015-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Michael Zitzlsperger ,  Christian Ziereis ,  Stefan Gruber

IPC: H01L33/62 ,  H01L33/48 ,  H01L27/02 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49113

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.