公开(公告)号：US10418529B2

公开(公告)日：2019-09-17

申请号：US15104434

申请日：2014-12-15

Applicant: OSRAM Opto Semiconductors GmbH ,  OSRAM GmbH

Inventor： Britta Göötz ,  Frank Singer ,  Roland Hüttinger

IPC: H01L33/50

Abstract: A conversion element includes a platelet including an inorganic glass, and first converter particles having a shell and a core, wherein the shell includes an inorganic material and the core includes a nitride or oxynitride luminescent material and the first converter particles are arranged on and/or in the platelet.

公开(公告)号：US20160300820A1

公开(公告)日：2016-10-13

申请号：US15100559

申请日：2015-01-13

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Matthias Sabathil ,  Frank Singer ,  Roland Hüttinger

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L33/56

CPC classification number: H01L25/0753 ,  F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/502 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2224/83

Abstract: A method for producing optoelectronic semiconductor components and an optoelectronic semiconductor component are disclosed. In an embodiment the method includes: A) creating a blank by pultrusion from a glass melt, B) shaping the blank into a billet-shaped optical element with a longitudinal axis, the optical element having a mounting side and a light outlet side, C) producing conductor tracks on the mounting side, D) mounting a plurality of optoelectronic semiconductor chips on the mounting side of the optical element and connecting them to the conductor tracks and E) separating the optical element into the optoelectronic semiconductor components, wherein each optoelectronic semiconductor component comprises at least two of the semiconductor chips, and wherein at least steps A) to D) are performed in the stated sequence.

Abstract translation: 公开了一种用于制造光电子半导体部件和光电半导体部件的方法。 在一个实施方案中，该方法包括：A）通过拉挤成型从玻璃熔体产生坯料，B）将坯料成型为具有纵向轴线的坯形光学元件，所述光学元件具有安装侧和光出口侧，C ）在安装侧产生导体轨道，D）将多个光电子半导体芯片安装在光学元件的安装侧并将它们连接到导体轨道，以及E）将光学元件分离成光电子半导体部件，其中每个光电子半导体 组件包括至少两个半导体芯片，并且其中至少步骤A）至D）以所述顺序执行。

公开(公告)号：US09691741B2

公开(公告)日：2017-06-27

申请号：US15100559

申请日：2015-01-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Frank Singer ,  Roland Hüttinger

IPC: H01L25/075 ,  H01L33/00 ,  F21K9/90 ,  H01L33/58 ,  H01L33/50 ,  H01L33/56 ,  H01L23/00 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: H01L25/0753 ,  F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/502 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2224/83

Abstract: A method for producing optoelectronic semiconductor components and an optoelectronic semiconductor component are disclosed. In an embodiment the method includes: A) creating a blank by pultrusion from a glass melt, B) shaping the blank into a billet-shaped optical element with a longitudinal axis, the optical element having a mounting side and a light outlet side, C) producing conductor tracks on the mounting side, D) mounting a plurality of optoelectronic semiconductor chips on the mounting side of the optical element and connecting them to the conductor tracks and E) separating the optical element into the optoelectronic semiconductor components, wherein each optoelectronic semiconductor component comprises at least two of the semiconductor chips, and wherein at least steps A) to D) are performed in the stated sequence.

公开(公告)号：US20160315231A1

公开(公告)日：2016-10-27

申请号：US15104434

申请日：2014-12-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  OSRAM GMBH

Inventor： Britta Göötz ,  Frank Singer ,  Roland Hüttinger

IPC: H01L33/50

CPC classification number: H01L33/504 ,  H01L33/505 ,  H01L2933/0041

Abstract: A conversion element includes a platelet including an inorganic glass, and first converter particles having a shell and a core, wherein the shell includes an inorganic material and the core includes a nitride or oxynitride luminescent material and the first converter particles are arranged on and/or in the platelet.

Abstract translation: 转换元件包括含有无机玻璃的片晶和具有壳和芯的第一转化器颗粒，其中所述壳包括无机材料，并且所述芯包括氮化物或氧氮化物发光材料，并且所述第一转化器颗粒被布置在和/或 在血小板中