公开(公告)号：US12199134B2

公开(公告)日：2025-01-14

申请号：US17515338

申请日：2021-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Behringer ,  Andreas Biebersdorf ,  Ruth Boss ,  Erwin Lang ,  Tobias Meyer ,  Alexander Pfeuffer ,  Marc Philippens ,  Julia Stolz ,  Tansen Varghese ,  Sebastian Wittmann ,  Siegfried Herrmann ,  Berthold Hahn ,  Bruno Jentzsch ,  Korbinian Perzlmaier ,  Peter Stauss ,  Petrus Sundgren ,  Jens Mueller ,  Kerstin Neveling ,  Frank Singer ,  Christian Mueller

IPC: H01L27/15 ,  H01L33/10 ,  H01L33/58

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US12095015B2

公开(公告)日：2024-09-17

申请号：US17414861

申请日：2019-12-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Andreas Dobner ,  Frank Singer ,  Stefan Groetsch

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/50 ,  H01L2933/0058 ,  H01L2933/0091

Abstract: An optoelectronic light emitting device includes a pixel with a transparent or translucent carrier substrate, on which a semiconductor light emitting arrangement with at least one micro LED is arranged. The micro LED extends over a partial area of the pixel. The main radiation direction of the semiconductor light emitting arrangement is directed onto a backscattering surface element arranged behind the transparent carrier substrate in viewing direction. The semiconductor light emitting arrangement includes a beam shaping element.

公开(公告)号：US11296265B2

公开(公告)日：2022-04-05

申请号：US16606538

申请日：2018-04-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Rudolf Behringer ,  Alexander F. Pfeuffer ,  Andreas Plößl ,  Georg Bogner ,  Berthold Hahn ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  A41D13/01 ,  A62B17/00

Abstract: A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.

公开(公告)号：US11107945B2

公开(公告)日：2021-08-31

申请号：US15820930

申请日：2017-11-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander Linkov ,  Frank Singer ,  Matthias Bruckschloegl ,  Siegfried Herrmann ,  Jürgen Moosburger ,  Thomas Schwarz

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/38 ,  H01L33/62

Abstract: A component includes a light emitting semiconductor chip, wherein the semiconductor chip includes a layer arrangement including a plurality of layers, the p-conducting layer and the n-conducting layer adjoin one another in an active zone, a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the semiconductor chip, a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, the second side being situated opposite the first side of the semiconductor chip, the first side of the semiconductor chip transitions into the second side via an end side, the semiconductor chip is secured by the end side on a substrate, the substrate includes a first and second further electrical contact, and the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.

公开(公告)号：US20200018692A1

公开(公告)日：2020-01-16

申请号：US16323504

申请日：2017-08-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Matthias Sperl

IPC: G01N21/3504

Abstract: A detection assembly and a method for producing a detection assemblies are disclosed. In an embodiment a detection arrangement includes an emitter configured to generate radiation having a peak wavelength in an infrared spectral range, a detector configured to receive the radiation, a mounting surface comprising at least a first contact surface and a second contact surface for external electrical connection of the detection arrangement, a form body adjoining the emitter and the detector at least in places and deflection optics, on which the radiation impinges during operation of the detection arrangement so that an optical path is formed between the emitter and the detector by the deflection optics, wherein the deflection optics include a scattering body into which the radiation enters during the operation through a surface of the scattering body facing the emitter.

公开(公告)号：US10411168B2

公开(公告)日：2019-09-10

申请号：US14779818

申请日：2014-03-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Joachim Reill ,  Frank Singer ,  Norwin von Malm ,  Matthias Sabathil

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/60 ,  H01L23/498

Abstract: An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.

公开(公告)号：US20190157339A1

公开(公告)日：2019-05-23

申请号：US16098283

申请日：2017-05-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Brick ,  Matthias Sabathil ,  Frank Singer ,  Thomas Schwarz

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62

Abstract: An optical assembly and a display device are disclosed. In an embodiment an optical assembly includes a common carrier, a plurality of first chip groups, each first chip group comprising at least two similar luminescence diode chips, a plurality of second chip groups, each second chip group comprising at least two similar luminescence diode chips, wherein the first and second chip groups are arranged planar along a regular grid of first unit cells on a main surface of the common carrier and an optical element arranged downstream of the first and second chip groups with respect to a main radiation direction, wherein the luminescence diode chips of the different chip groups are configured to emit electromagnetic radiation of different wavelength characteristics.

公开(公告)号：US20180151787A1

公开(公告)日：2018-05-31

申请号：US15574602

申请日：2016-05-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Jügen Moosburger ,  Frank Singer

IPC: H01L33/62 ,  H01L33/54 ,  H01L21/683 ,  H01L33/00 ,  H01L25/075 ,  H01L21/66 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L21/6835 ,  H01L22/22 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/32 ,  H01L33/54 ,  H01L33/60 ,  H01L2221/68359 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact by the contacts and the potting material.

公开(公告)号：US09976708B2

公开(公告)日：2018-05-22

申请号：US15113017

申请日：2015-01-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sandra Sobczyk ,  Frank Singer ,  Wolfgang Moench ,  Matthias Sabathil

IPC: F21V9/16 ,  F21K9/64 ,  F21V5/04 ,  F21K9/61 ,  F21V3/02 ,  F21K9/90 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21K9/64 ,  F21K9/61 ,  F21K9/90 ,  F21V3/02 ,  F21V5/043 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: The invention relates to a lighting means (1), comprising: an optical element (3), which has a main extension direction (Z), a radiation inlet surface (3a), and a radiation outlet surface (3b); and at least two light-emitting diodes (2), which each comprise at least one light-emitting diode chip (21) and a radiation passage surface (2a), which extends along a main extension plane (XZ); wherein the at least two lighting-emitting diodes (2) are arranged along the main extension direction (Z) of the optical element (3), the radiation inlet surface (3a) of the optical element (3) faces the radiation passage surfaces (2a) of the at least two light-emitting diodes (2), the optical element (3) is formed as a solid body, the radiation inlet surface (3a) of the optical element (3) is flat or convexly curved, and the radiation outlet surface (3b) of the optical element (3) comprises at least one recess (4) in the optical element (3).

公开(公告)号：US09945526B2

公开(公告)日：2018-04-17

申请号：US14764032

申请日：2014-01-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Frank Singer ,  Thomas Schwarz

IPC: F21S8/10 ,  H01L25/075 ,  F21V29/70 ,  F21V23/00 ,  H01L33/62 ,  H01L33/64

CPC classification number: F21S41/143 ,  F21S41/192 ,  F21S45/47 ,  F21V23/002 ,  F21V29/70 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An optoelectronic lighting module (100) is provided having at least two optoelectronic semiconductor chips (10) with a radiation outlet surface (11) and an electrically non-conductive back side (12) facing away from the radiation outlet surface,—a cooling body (20) with a cooling body top side (21) and a cooling body bottom side (22) facing away from the cooling body top side (21),—two contact strips (30) with a contact top side (31) and a contact bottom side (32) facing away from the contact top side (31), wherein—the optoelectronic semiconductor chips (10) are arranged with the electrically non-conductive back side (12) on the cooling body top side (21),—each optoelectronic semiconductor chip (10) comprises two electric contact points (13) formed in the direction of the radiation outlet surface (11), and—the optoelectronic semiconductor chips (10) are connected in series via the electric contact points (13).