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公开(公告)号：US20150167153A1
公开(公告)日：2015-06-18
申请号：US14413480
申请日：2013-06-24
IPC分类号： C23C14/34
CPC分类号： C23C14/3485 , C23C14/345 , C23C14/3464 , H01J37/3405 , H01J37/3467 , H01J2237/332
摘要： The invention relates to a method for coating substrates by sputtering of target material, the method comprising the following steps:-applying a first sputtering target made of a first material in a coating chamber to a power pulse by which, during a first time interval, a first amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm2 and preferably 500 W/cm2;-applying a second sputtering target made of a second material that is different from the first material in the coating chamber to a power pulse by which, during a second time interval, a second amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm 2 and preferably 500W/cm2, characterized in that the first amount of energy differs from the second amount of energy.
摘要翻译： 本发明涉及通过溅射目标材料涂覆基板的方法，该方法包括以下步骤：将由涂覆室中的第一材料制成的第一溅射靶施加到第一时间间隔内的功率脉冲， 第一量的能量被传送到溅射靶，其中最大功率密度超过50W / cm 2，优选为500W / cm 2;使用与涂层中的第一材料不同的第二材料制成的第二溅射靶 在第二时间间隔内将第二量的能量传递到溅射靶，其中最大功率密度超过50W / cm 2，优选为500W / cm 2，其特征在于，第一量的 能量与第二量的能量不同。
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公开(公告)号：US20140311892A1
公开(公告)日：2014-10-23
申请号：US14362758
申请日：2012-11-23
IPC分类号： C23C14/34
CPC分类号： C23C14/3485 , C23C14/0094 , C23C14/3492 , H01J37/3467 , H01J37/3485
摘要： Reactive sputtering in which, by ion bombardment, material is ejected from the surface of a target and transitions to the gas phase. Negative voltage pulses are applied to the target to establish electric current having a current density greater than 0.5 A/cm2 at the target surface, such that the material transitioning to the gas phase is ionized. Reactive gas flow is established and reacts with the material of the target surface. Voltage pulse duration is such that, during the pulse, the target surface where the current flows is at least partly covered most of the time with a compound composed of reactive gas and target material and, consequently, the target surface is in a first intermediate state, and this covering is smaller at the end of the voltage pulse than at the start and, consequently, the target surface is in a second intermediate state at the end of the voltage pulse.
摘要翻译： 反应溅射，其中通过离子轰击，材料从靶的表面喷射并转变到气相。 向目标施加负电压脉冲，以在目标表面建立电流密度大于0.5A / cm 2的电流，使得转移到气相的材料被电离。 建立反应性气体流动并与目标表面的材料反应。 电压脉冲持续时间使得在脉冲期间，电流流动的目标表面至少部分地被由反应性气体和靶材料组成的化合物大部分地覆盖，因此目标表面处于第一中间状态 并且该覆盖在电压脉冲结束时比在开始时更小，因此，目标表面在电压脉冲结束时处于第二中间状态。
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公开(公告)号：US20140048209A1
公开(公告)日：2014-02-20
申请号：US13963128
申请日：2013-08-09
CPC分类号： H01J37/32 , C23F1/08 , H01J37/32009 , H01J37/32055
摘要： The present invention relates to an ignition device for igniting a high-current discharge of an electrical arc evaporator in a vacuum coating system. Ignition is performed by means of mechanically closing and opening a contact between the cathode and the anode. Contact is established by means of an ignition finger that can move on a forced path. On account of the forced path, the ignition finger can be moved by means of a simple mechanical drive to a park position, which is protected against coating, and said ignition finger can also be used to ignite a second target.
摘要翻译： 点火装置技术领域本发明涉及一种用于点燃真空镀膜系统中电弧蒸发器的高电流放电的点火装置。 通过机械地闭合和打开阴极和阳极之间的接触来进行点火。 通过可在强制路径上移动的点火指示器建立接触。 由于强制路径，点火指可以通过简单的机械驱动移动到停止位置，防止被涂覆，并且所述点火指也可用于点燃第二目标。
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公开(公告)号：US09601316B2
公开(公告)日：2017-03-21
申请号：US13963128
申请日：2013-08-09
CPC分类号： H01J37/32 , C23F1/08 , H01J37/32009 , H01J37/32055
摘要： The present invention relates to an ignition device for igniting a high-current discharge of an electrical arc evaporator in a vacuum coating system. Ignition is performed by means of mechanically closing and opening a contact between the cathode and the anode. Contact is established by means of an ignition finger that can move on a forced path. On account of the forced path, the ignition finger can be moved by means of a simple mechanical drive to a park position, which is protected against coating, and said ignition finger can also be used to ignite a second target.
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公开(公告)号：US20140305792A1
公开(公告)日：2014-10-16
申请号：US14357003
申请日：2012-10-26
IPC分类号： C23C14/35
CPC分类号： C23C14/35 , C23C14/345 , C23C14/3485 , H01J37/3467
摘要： The present invention relates to a method for the vapor deposition of PVD layer systems by means of sputtering on at least one substrate, wherein the layer system comprises at least a first layer, characterized in that, at least in one step of the method, a HiPIMS method is used with a power density of at least 250 W/Cm2, wherein a pulse length with a duration of at least 5 ms is used while a substrate has is applied to the substrate.
摘要翻译： 本发明涉及一种用于通过溅射在至少一个衬底上蒸镀PVD层系统的方法，其中层系统至少包括第一层，其特征在于，在该方法的至少一个步骤中， HiPIMS方法的功率密度至少为250W / Cm2，其中使用具有至少5ms的持续时间的脉冲长度，同时将衬底施加到衬底。
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公开(公告)号：US09906210B2
公开(公告)日：2018-02-27
申请号：US14354698
申请日：2012-10-08
CPC分类号： H03K3/012 , C23C14/3485 , C23C14/352 , C23C14/54 , H01J37/3467
摘要： The present invention relates to a method for providing power pulses for PVD sputter cathodes which comprise a power consumption component and a cathode element, wherein during a power increase interval for a generator the power on the power consumption component is decreased and then the power on the cathode element is decreased, with changeover being effected such that the power draw from the generator providing the power does not have to be interrupted.
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公开(公告)号：US20150060261A1
公开(公告)日：2015-03-05
申请号：US14390828
申请日：2013-03-05
CPC分类号： H01J37/3497 , C09J7/22 , C23C14/34 , C23C14/3407 , C23C14/54 , H01J37/3411 , H01J37/3417 , H01J37/3435 , H01J2237/002
摘要： The invention relates to a target which is embodied as a material source for a depositing method from the gas phase, comprising a front side and a rear side, characterized in that a self-adhesive carbon film is applied to the rear side. Said target can be embodied as a material source for a sputtering method and/or for an arc evaporation method. A particular advantage is that the target is used in a coating source with indirect cooling, the self-adhesive carbon film being in contact with the surface of the membrane which is part of a cooling channel.
摘要翻译： 本发明涉及一种作为来自气相的沉积方法的材料源的靶，其包括前侧和后侧，其特征在于，将自粘碳膜施加到后侧。 所述靶可以实现为用于溅射方法和/或电弧蒸发法的材料源。 特别的优点是靶被用于具有间接冷却的涂料源中，自粘性碳膜与作为冷却通道一部分的膜的表面接触。
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公开(公告)号：US20150001064A1
公开(公告)日：2015-01-01
申请号：US14367414
申请日：2012-12-14
IPC分类号： C23C14/34
摘要： Coating method for arc coating or arc ion plating coating of substrates in a vacuum chamber in which using an arc evaporator solid material that functions as cathode is evaporated, during arc evaporation the motion of the cathode spot on the solid material surface is accelerated using a magnetic field for avoiding ejection of a large amount of macro-particles or droplets from the solid material surface, negative charged particles resulted from the arc evaporation flow from the cathode to an anode, characterized by the motion of the negative charged particles from the cathode to the anode fundamentally doesn't cause an additional increase of the absolute value of the potential difference between cathode and anode allowing a lower increment of the substrate temperature during coating.
摘要翻译： 在电弧蒸发期间，使用用作阴极的电弧蒸发器固体材料的真空室中的基板的电弧涂覆或电弧离子镀覆涂覆方法被蒸发，阴极点在固体材料表面上的运动使用磁 场，用于避免从固体材料表面喷射大量的大颗粒或液滴，由从阴极到阳极的电弧蒸发流产生的负带电粒子，其特征在于负电荷粒子从阴极到 阳极基本上不会导致阴极和阳极之间的电位差的绝对值的额外增加，从而允许涂层期间衬底温度的增加较小。
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公开(公告)号：US20140248100A1
公开(公告)日：2014-09-04
申请号：US14352872
申请日：2012-10-18
CPC分类号： C23C14/35 , B23B2228/105 , B23G5/06 , B23G2200/26 , C23C14/0635 , C23C14/0641 , C23C14/345 , C23C14/3485 , C23C14/3492 , C23C14/352 , C23C14/355 , C23C14/54 , C23C14/548 , C23C16/276 , C23C16/277 , C23C16/278 , C23C16/50 , C23C28/044 , C23C28/046 , C23C28/048 , C23C30/005 , H01J37/3405 , H01J37/3467 , Y10T408/78 , Y10T408/89
摘要： The present invention relates to a method for coating a substrate, preferably a drill, wherein at least one first HiPIMS layer is applied by means of a HiPIMS process. Preferably, at least one second layer is applied to the first HiPIMS layer by means of a coating process that does not contain a HiPIMS process.
摘要翻译： 本发明涉及用于涂覆基材，优选钻头的方法，其中通过HiPIMS方法施加至少一个第一HiPIMS层。 优选地，通过不包含HiPIMS工艺的涂覆工艺，将至少一个第二层施加到第一HiPIMS层。
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公开(公告)号：US10982321B2
公开(公告)日：2021-04-20
申请号：US14367354
申请日：2012-11-23
摘要： The invention relates to a HiPIMS method by means of which homogeneous layers can be deposited over the height of a coating chamber. Two partial cathodes are used for said purpose. According to the invention, the length of the individual power pulse intervals applied to the partial cathodes is chosen individually and thus a required coating thickness profile over the height of the coating chamber is achieved.
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