公开(公告)号：US20150279805A1

公开(公告)日：2015-10-01

申请号：US14229788

申请日：2014-03-28

申请人： Omkar G. KARHADE ,  Nitin A. DESHPANDE, JR. ,  Aditya Sundoctor VAIDYA ,  Nachiket R. RARAVIKAR ,  Eric J. LI

发明人： Omkar G. KARHADE ,  Nitin A. DESHPANDE, JR. ,  Aditya Sundoctor VAIDYA ,  Nachiket R. RARAVIKAR ,  Eric J. LI

IPC分类号： H01L23/00

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L21/76879 ,  H01L21/76883 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/92 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L21/56 ,  H01L2224/81 ,  H01L2224/45099 ,  H01L2924/00012

摘要： Embodiments describe a semiconductor package that includes a substrate, a die bonded to the substrate, and a solder paste overmold layer formed over a top surface of the die. In an embodiment, the solder paste comprises a high-melting point metal, a solder matrix, intermetallic compounds and a polymer. The overmold layer has a high elastic modulus, a coefficient of thermal expansion similar to the substrate, and reduces the warpage of the package. In an embodiment, interconnects of a semiconductor package are formed with a no-slump solder paste that includes vents. Vents may be formed through a conductive network formed by the high-melting point metal, solder matrix and intermetallic compounds. In an embodiment, vents provide a path through the interconnect that allows for moisture outgassing. In an embodiment, a mold layer may be mechanically anchored to the interconnects by the vents, thereby providing improved mechanical continuity to the mold layer.

摘要翻译： 实施例描述了一种半导体封装，其包括衬底，结合到衬底的管芯，以及形成在管芯的顶表面上的焊膏二次模制层。 在一个实施例中，焊膏包括高熔点金属，焊料基质，金属间化合物和聚合物。 包覆成型层具有高的弹性模量，类似于基材的热膨胀系数，并且减少了包装的翘曲。 在一个实施例中，半导体封装的互连形成有包括通风口的无洼焊膏。 通孔可以通过由高熔点金属，焊料基质和金属间化合物形成的导电网形成。 在一个实施例中，通风口提供允许湿气除气的互连路径。 在一个实施例中，模具层可以通过通风口机械地锚固到互连，从而提供对模具层的改进的机械连续性。

公开(公告)号：US20150279804A1

公开(公告)日：2015-10-01

申请号：US14229785

申请日：2014-03-28

申请人： Nachiket R. RARAVIKAR ,  James C.j Matayabas ,  Akshay Mathkar

发明人： Nachiket R. RARAVIKAR ,  James C.j Matayabas ,  Akshay Mathkar

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  B23K35/22 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400° C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste.

摘要翻译： 实施例描述了用于半导体封装的高纵横比和细间距互连，诸如封装封装结构。 在一个实施例中，互连由无瑕疵焊膏形成。 在一个实施方案中，将无褪色焊膏印刷为未固化状态，然后用液相烧结工艺固化。 在固化之后，在典型的加工温度下，例如低于约400℃的无sl焊膏不会回流。根据实施例，无sl焊焊膏包括Cu颗粒或球体，焊料基质组分，聚合物 输送载体和溶剂。 在一个实施方案中，液相烧结在Cu球周围产生金属间化合物的壳。 在一个实施例中，烧结过程通过无sl焊膏形成导电金属网络。