摘要:
There is provided an adhesive sheet comprising an adhesive base sheet, an adhesive layer, and a release sheet laminated in sequence from the adhesive base sheet. The release sheet comprises a release agent layer and a release base material laminated in sequence from the adhesive layer. A release force between the release sheet and the adhesive layer is decreased by an external stimulus.
摘要:
An adhesive sheet having high adhesion and removability, low metal corrosion, small outgas generation, and particularly suitable for adherence to an electronic part, which sheet includes an adhesive layer provided for at least one surface of a substrate sheet, in which a pressure-sensitive adhesive forming the adhesive layer includes a resin composition mainly formed of an acrylic copolymer obtained by blending a carboxyl group-free acrylic copolymer obtained by copolymerizing the following components (A) to (C) with (D) an isocyanate-based cross-linking agent: (A) 76.999 to 94.999% by mass of an alkyl(meth)acrylate; (B) 5.0 to 23.0% by mass of an ethylenically unsaturated group-containing morpholine-based compound; and (C) 0.001 to 1.5% by mass of a functional group-containing unsaturated monomer; and a ratio M2/M1 of the mole number (M2) of isocyanate groups in the component (D) to the mole number (M1) of functional groups in the component (C) is 1.5 to 15.0.
摘要:
A double-faced pressure-sensitive adhesive sheet used for electronic components is provided. The double-faced pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer; a first release sheet including at least a first release agent layer attached to one surface of the pressure-sensitive adhesive layer; and a second release sheet including at least a second release agent layer attached to the other surface of the pressure-sensitive adhesive layer. The first release agent layer is mainly constituted of an olefin-based resin and the second release agent layer is mainly constituted of a diene-based polymer material. When an peeling force of the first release sheet with respect to the pressure-sensitive adhesive layer is defined as “X” [mN/20 mm] and an peeling force of the second release sheet with respect to the pressure-sensitive adhesive layer is defined as “Y” [mN/20 mm], the following relation is satisfied: Y−X≧50. The pressure-sensitive adhesive layer, the first release agent layer and the second release layer contain substantially no silicone compound and substantially no halogen compound.
摘要:
A pressure-sensitive adhesive article 100 includes a release sheet 1 constituted from a releasing agent layer 11 and a base material 12, and a pressure-sensitive adhesive sheet 2 constituted from a pressure-sensitive adhesive layer 21 and a pressure-sensitive adhesive sheet base 22. Such a pressure-sensitive adhesive article 100 has a structure in which the pressure-sensitive adhesive sheet 2 is laminated on the release sheet 1 so that the pressure-sensitive adhesive layer 21 is in contact with the releasing agent layer 11. The releasing agent layer 11 is composed of a material containing substantially no silicone compound. The releasing agent layer 11 is mainly composed of an elastomer and has a Young's modulus of 1.5 GPa or less. Preferred examples of the elastomer include polybutadiene rubber (especially, 1,4-polybutadiene rubber), polyisoprene rubber, and ethylene propylene rubber. The release sheet 1 has excellent releasability and has little adverse effect on electric components and the like.
摘要:
The pressure sensitive adhesive sheet of the present invention is characterized by a pressure sensitive adhesive sheet in which a pressure sensitive adhesive layer is formed on at least one surface of a base material and in which a surface of the above pressure sensitive adhesive layer at a side opposite to the base material is brought into contact with a release agent layer, wherein the pressure sensitive adhesive layer and the release agent layer do not substantially contain a silicone-based compound, and the pressure sensitive adhesive layer contains an antioxidant. It has a good releasing performance from the release agent layer and is excellent in a releasing stability after ageing.
摘要:
A pressure-sensitive adhesive article 100 includes a release sheet 1 constituted from a releasing agent layer 11 and a base material 12, and a pressure-sensitive adhesive sheet 2 constituted from a pressure-sensitive adhesive layer 21 and a pressure-sensitive adhesive sheet base 22. Such a pressure-sensitive adhesive article 100 has a structure in which the pressure-sensitive adhesive sheet 2 is laminated on the release sheet 1 so that the pressure-sensitive adhesive layer 21 is in contact with the releasing agent layer 11. The releasing agent layer 11 is composed of a material containing substantially no silicone compound. The releasing agent layer 11 is mainly composed of an elastomer and has a Young's modulus of 1.5 GPa or less. Preferred examples of the elastomer include polybutadiene rubber (especially, 1,4-polybutadiene rubber), polyisoprene rubber, and ethylene propylene rubber. The release sheet 1 has excellent releasability and has little adverse effect on electric components and the like.
摘要:
Disclosed is a process for preparing 2-halogeno-3-hydroxy-3-phenylpropionic acid ester compounds represented by the formula (I): ##STR1## wherein Ring A is a phenyl group which may be substituted, R.sup.1 is an ester residue, and X is a halogen atom, which comprises permitting an enzyme having the ability of stereoselectively reducing oxo group to hydroxy group to act on 2-halogeno-3-oxo-3-phenylpropionic acid ester compounds represented by the formula (II): ##STR2## wherein Ring A, R.sup.1 and X have the same meanings as defined above.
摘要:
Provided is a release sheet which is non-silicone-based and has a good releasability from a layer of a pressure sensitive adhesive and which has a stable antistatic property without being influenced by the air environment and is free of bleeding out of ionic substances derived from an antistatic agent. The release sheet is prepared by providing an undercoat layer containing a polyurethane-based resin and 0.1 to 45% by mass of a lithium salt-based antistatic agent and a layer of a rubber-based release agent formed by coating and drying a liquid containing a release agent in order on a substrate.
摘要:
Provided are a double-sided pressure-sensitive adhesive sheet which is free from an adverse affect on an electronic part or the like and is excellent in releasing performance and a production method thereof. The double-sided pressure-sensitive adhesive sheet includes: a pressure-sensitive adhesive layer; a first release sheet having a first release agent layer adhered to one surface of the pressure-sensitive adhesive layer; and a second release sheet having a second release agent layer adhered to another surface of the pressure-sensitive adhesive layer, in which: the first release agent layer and the second release agent layer are each formed by using a diene-based polymeric compound; when, at ordinary temperatures, a release force of the first release sheet to the pressure-sensitive adhesive layer is represented by X and a release force of the second release sheet to the pressure-sensitive adhesive layer is represented by Y, a relationship of Y−X≧50 is satisfied and Y represents 2,000 or less, where units of X and Y are each mN/20 mm; and the pressure-sensitive adhesive layer, the first release agent layer, and the second release agent layer are each substantially free of a silicone compound, and the production method for the double-sided pressure-sensitive adhesive sheet includes: forming a coating film by coating a top of the second release sheet with a material for forming the pressure-sensitive adhesive layer, the material containing a pressure-sensitive adhesive; forming the pressure-sensitive adhesive layer by drying the coating film; and adhering the first release sheet to a surface of an opposite side of the formed pressure-sensitive adhesive layer to which the second release sheet is adhered.
摘要:
In a method for manufacturing an LDD-structured MOS transistor and a bipolar transistor, a gate insulating layer is formed on a MOS transistor region and a bipolar transistor region. Then, a gate electrode is formed on the MOS transistor region. Then, an insulating layer is formed on the entire surface, and as etched back by a reactive ion etching process to form a sidewall spacer. The MOS transistor region and the bipolar transistor region are etched by a wet etching process using the gate electrode and its sidewall spacer as a mask.