摘要:
An aluminum alloy composite material for brazing has a core member, an Al--Si filler member clad on one surface of the core member and an aluminum alloy cladding member clad on the other side of the core member. The core member is made of an aluminum alloy containing 0.3 to 1.3 wt. % of Si, 0.3 to 1.5 wt. % of Mn, 0.02 to 0.3 wt. % of Ti, and, as required, 0.3 wt. % or less of Cr and 0.2 wt. % or less of Zr, the content of Mg being restricted to 0.2 wt. % or less and the content of the Cu being restricted to 0.2 wt. % or less as an impurity. The cladding member is made of an aluminum alloy containing 0.3 to 3 wt. % of Mg, 5 wt. % or less of Zn, 0.1 to 1.0 wt. % of Si. The thickness of the core member is preferably, 2.5 times or more greater than that of the filler member, falling within a range of 0.1 to 1 mm. With this, it is possible to obtain an aluminum alloy composite material which cannot degraded in brazability and corrosion resistance even when brazed by the brazing method with noncorrosive flux and which has enough high strength to be used for a material of a high-strength heat exchanger, highly improved corrosion resistance and excellent brazability.
摘要:
A core material of an aluminum brazing sheet restricts Mg to less than 0.3 wt % and Fe to not more than 0.2 wt %, and contains more than 0.2 wt % and not more than 1.0 wt % of Cu, 0.3 to 1.3 wt % of Si, 0.3 to 1.5 wt % of Mn and the balance of Al and inevitable impurities. A brazing filler material is formed on one surface of the core material by Al—Si based aluminum alloy. Also, a cladding material is formed on the other surface of the core material, and contains less than 0.2 wt % of Si, 2.0 to 3.5 wt % of Mg, not less than 0.5 wt % and less than 2.0 wt % of Zn and the balance of Al and inevitable impurities. Further, the value (cladding material hardness)/(the core material hardness) that is a ratio of the hardness of the cladding material to the hardness of the core material is not more than 1.5.
摘要:
An inner lead and an outer lead are formed only on an insulating tape. A semiconductor chip and the inner lead are connected by the flip chip method by providing an anisotropic conductive material therebetween. A radiating plate is bonded to the insulating tape with use of an adhesive so that the radiating plate covers all regions where solder balls connected with the outer leads are formed. Unlike the TAB type, the inner lead is not uncovered with the insulating tape, whereby deformation of the inner lead is suppressed as much as possible. With this arrangement, the following effect can be achieved. Namely, in a semiconductor device of the BGA type, heat generated during package manufacture can be efficiently emitted, and hence package defects caused by heat and stress during manufacture can be suppressed. As a result, smaller and thinner packages can be manufactured, while pitch narrowing and multiple-port structure can be achieved.
摘要:
A water-cooled oil cooler includes a laminated body formed by alternately piling up formed plates having cooling water passage openings and oil passage openings in the direction of plate thickness, and fin plates having cooling water passage openings and oil passage openings in the direction of plate thickness. A protrusion is projected from a passage wall of the cooling water passage opening of the fin plate into a cooling water passage. By setting the protrusion baser than the other part of the fin plate, the protrusion is made to serve as a sacrificial corrosion section to prevent the contact section from being precedently corroded.
摘要:
A chemical conversion coating formed on a surface of an aluminum substrate. The coating comprises a composite material formed by a reaction of a nitrate or sulfate of an alkali metal or alkaline earth metal and an organic compound that can form a compound with aluminum or exhibit a weak basicity an an aqueous aluminum treating liquid comprising the nitrate or sulfate of alkali metal or alkaline earth metal and the organic compound, with the aluminum substrate. The coating is corrosion-resistant, bacteria-proof or fungiproof, and the surface is of a heat exchanger, etc.