公开(公告)号：US20120126711A1

公开(公告)日：2012-05-24

申请号：US13383785

申请日：2010-11-24

申请人： Shinji Suminoe ,  Mitsuru Hineno ,  Masato Onoue

发明人： Shinji Suminoe ,  Mitsuru Hineno ,  Masato Onoue

IPC分类号： H05B37/02

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F2001/133613 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sensor circuit or a display apparatus from which a highly accurate sensor output can be obtained includes a photodiode, a capacitor that is connected to the photodiode via an accumulation node and accumulates charges according to an electric current in the photodiode; a sensor switching element transistor that causes the accumulation node and an output line to be conductive with respect to each other in response to a readout signal and outputs an output signal according to the potential of the accumulation node to the output line; a variable capacitor that is provided between the accumulation node and an input electrode, and whose capacitance varies when a pressure is applied by a touching operation; and a control switching element transistor to which a control signal for switching conduction and non-conduction between the variable capacitor and the accumulation node is input.

摘要翻译： 可以从其获得高精度传感器输出的传感器电路或显示装置包括光电二极管，经由累积节点连接到光电二极管的电容器，并根据光电二极管中的电流累积电荷; 传感器开关元件晶体管，其响应于读出信号使所述累积节点和输出线相对于彼此导电，并且根据所述累积节点的电位将输出信号输出到所述输出线; 设置在所述蓄积节点和输入电极之间的可变电容器，并且当通过触摸操作施加压力时，其电容变化; 以及输入用于切换可变电容器和累积节点之间的导通和非导通的控制信号的控制开关元件晶体管。

公开(公告)号：US07646094B2

公开(公告)日：2010-01-12

申请号：US11699077

申请日：2007-01-29

申请人： Shinji Suminoe

发明人： Shinji Suminoe

IPC分类号： H01L23/02

CPC分类号： H01L23/49811 ,  H01L23/057 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/3025 ,  H05K3/3442 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device (10) includes: a substrate (1), including an electrode pad (1a); an IC chip (4), mounted on the substrate (1); and an externally connecting terminal (7), formed on the electrode pad (1a) and electrically connected with the IC chip (4), the externally connecting terminal (7) including a resin core (7a) made of an elastic material and including a metal layer (7b) formed outside the resin core (7a), thereby providing a semiconductor device having high packaging reliability.

摘要翻译： 半导体器件（10）包括：包括电极焊盘（1a）的衬底（1）; 安装在所述基板（1）上的IC芯片（4）; 以及形成在所述电极焊盘（1a）上并与所述IC芯片（4）电连接的外部连接端子（7），所述外部连接端子（7）包括由弹性材料制成的树脂芯体（7a） 金属层（7b）形成在树脂芯（7a）的外侧，从而提供具有高封装可靠性的半导体器件。

公开(公告)号：US20110205258A1

公开(公告)日：2011-08-25

申请号：US13121715

申请日：2009-07-06

申请人： Shinji Suminoe ,  Kohji Fujiwara

发明人： Shinji Suminoe ,  Kohji Fujiwara

IPC分类号： G09G5/10

CPC分类号： G09G3/3406 ,  G09G2320/041 ,  G09G2320/064 ,  G09G2320/0666 ,  G09G2330/08

摘要： An LED controller (11) judges whether a temperature sensor (21) is normal in accordance with measured temperature data and controls luminance of an LED (32) measured by an abnormal temperature sensor (21) in accordance with alternative temperature data instead of the temperature data measured by the abnormal temperature sensor (21).

摘要翻译： LED控制器（11）根据测量的温度数据判断温度传感器（21）是否正常，并且根据替代的温度数据代替温度数据来控制由异常温度传感器（21）测量的LED（32）的亮度 由异常温度传感器测量的数据（21）。

公开(公告)号：US20100271565A1

公开(公告)日：2010-10-28

申请号：US12599837

申请日：2008-07-02

申请人： Shinji Suminoe ,  Tomohiko Yamamoto ,  Akira Tomiyoshi ,  Naoto Inoue

发明人： Shinji Suminoe ,  Tomohiko Yamamoto ,  Akira Tomiyoshi ,  Naoto Inoue

IPC分类号： G02F1/13357 ,  F21V23/00

CPC分类号： H05B33/0872 ,  G02F1/133603 ,  G09G3/3426 ,  G09G2320/041 ,  H05B33/0821

摘要： An illumination device includes an LED package, an LED driver including an FET, and a thermistor disposed on a substrate. A plurality of such LED packages are disposed on the substrate such that a first area and a second area, each determined by vertices corresponding to LED packages, are defined on the substrate. The thermistor is disposed in the first area, and the FET is disposed in the second area, which is outside of the first area. The thermistor detects a temperature in the first area. Such a configuration allows the thermistor to detect, in accordance with the temperature in the area, the temperature of heat transferred from the LED packages, without being affected by heat generated by the FET. This makes it possible to efficiently make temperature corrections to stabilize color temperature and luminance.

摘要翻译： 照明装置包括LED封装，包括FET的LED驱动器和设置在基板上的热敏电阻。 多个这样的LED封装被布置在基板上，使得在基板上限定了由与LED封装相对应的顶点确定的第一区域和第二区域。 热敏电阻设置在第一区域中，并且FET设置在第一区域外的第二区域中。 热敏电阻检测第一个区域的温度。 这种配置允许热敏电阻根据区域中的温度检测从LED封装传递的热量的温度，而不受FET产生的热的影响。 这使得可以有效地进行温度校正来稳定色温和亮度。

公开(公告)号：US20060237848A1

公开(公告)日：2006-10-26

申请号：US11474469

申请日：2006-06-26

申请人： Shinji Suminoe ,  Hiroyuki Nakanishi ,  Toshiya Ishio ,  Yoshihide Iwazaki ,  Katsunobu Mori

发明人： Shinji Suminoe ,  Hiroyuki Nakanishi ,  Toshiya Ishio ,  Yoshihide Iwazaki ,  Katsunobu Mori

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05006 ,  H01L2224/05546 ,  H01L2224/05567 ,  H01L2224/13 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2224/05552 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device, comprising the steps of forming an insulation layer, which has an opening section in an area including an area on an electrode pad, on a top surface of the semiconductor substrate on which the electrode pad is formed; at least forming a first barrier metal layer, which becomes a part of a leading wiring layer, in an inner peripheral surface of the opening section including the top surface of the electrode pad; at least forming a main conductor layer, which becomes a part of the leading wiring layer, in an area surrounded by the first barrier metal layer in the opening section; eliminating an upper portion of the main conductor layer at least to a position at which the first barrier metal layer is exposed, and forming a second barrier metal layer, which becomes a part of the leading wiring layer, so as to cover the whole top surface of the main conductor layer.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：在形成有电极焊盘的半导体衬底的顶表面上形成绝缘层，该绝缘层在包括电极焊盘的区域的区域中具有开口部分; 至少在包括所述电极焊盘的顶面的所述开口部的内周面中形成成为前导布线层的一部分的第一阻挡金属层; 至少在由开口部分中的第一阻挡金属层包围的区域中形成成为引导布线层的一部分的主导体层; 消除主导体层的上部至少到第一阻挡金属层露出的位置，形成作为引导布线层的一部分的第二阻挡金属层，以覆盖整个顶表面 的主导体层。

公开(公告)号：US20060071330A1

公开(公告)日：2006-04-06

申请号：US11240802

申请日：2005-10-03

申请人： Shinji Suminoe ,  Hiroyuki Nakanishi ,  Yoko Komeda

发明人： Shinji Suminoe ,  Hiroyuki Nakanishi ,  Yoko Komeda

IPC分类号： H01L23/34

CPC分类号： H01L23/49822 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16145 ,  H01L2224/16265 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor package which is multifunctional, thin, and high in mounting reliability includes an insulating film; a first electronic component formed on one of the main surfaces of the insulating film; a second electronic component formed outwardly on the other of the main surfaces opposite to the one of the main surfaces; an external output terminal formed outwardly on the other of the main surfaces; and internal wiring formed in the insulating film so as to provide electrical continuity between the external output terminal and each of the first electronic component and the second electronic component. The insulating film is composed of a first insulating film and a second insulating film opposite to each other; the internal wiring is interposed between the first insulating film and the second insulating film, and the protruding end of the external output terminal is outside beyond the protruding end of the second electronic component.

摘要翻译： 多功能，薄型和高安装可靠性的半导体封装包括绝缘膜; 形成在绝缘膜的一个主表面上的第一电子部件; 在与所述一个主表面相对的另一个主表面上向外形成的第二电子部件; 在另一个主表面上向外形成的外部输出端子; 以及形成在所述绝缘膜中的内部布线，以便在所述外部输出端子与所述第一电子部件和所述第二电子部件中的每一个之间提供电连续性。 绝缘膜由相互相对的第一绝缘膜和第二绝缘膜构成; 内部布线插入在第一绝缘膜和第二绝缘膜之间，并且外部输出端子的突出端超出第二电子部件的突出端。

公开(公告)号：US09158151B2

公开(公告)日：2015-10-13

申请号：US13502693

申请日：2010-11-09

申请人： Nobuo Ogata ,  Mitsuru Hineno ,  Shinji Suminoe

发明人： Nobuo Ogata ,  Mitsuru Hineno ,  Shinji Suminoe

IPC分类号： G02F1/1335

CPC分类号： F21K9/50 ,  F21K9/60 ,  F21V5/04 ,  F21V17/101 ,  F21V23/001 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F1/133606 ,  G02F1/133611 ,  G02F2202/28 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A surface light-emitting unit of the present invention is an LED module (30) for emitting light from an LED chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1)is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release.

摘要翻译： 本发明的面发光单元是用于经由光通量的光束控制部（22）从发光元件部（1）的LED芯片（6）发光的LED模块（30） 控制部分（2），所述光束控制部分（22）由固定在所述发光元件部分（1）固定的基板（4）的固定表面上的多个柱状部分（21）固定 。 这提供了用于放热的发光元件部分（1）和光束控制部分（22）之间的适当间隙。

公开(公告)号：US08297784B2

公开(公告)日：2012-10-30

申请号：US12835492

申请日：2010-07-13

申请人： Toshiya Ishio ,  Mitsuru Hineno ,  Nobuo Ogata ,  Shinji Suminoe

发明人： Toshiya Ishio ,  Mitsuru Hineno ,  Nobuo Ogata ,  Shinji Suminoe

IPC分类号： F21V1/00

CPC分类号： G02B19/0014 ,  G02B19/0061 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface-emission unit to prevent irregularity in brightness from being generated is provided. The surface-emission unit is composed of light-emission element parts each having a light-emission element, aligned and arranged on a substrate two-dimensionally, and optical lenses each arranged on the substrate with respect to each light-emission element part, to diffuse light from the light-emission element, and a support part to fix the optical lens onto the substrate is arranged so as not overlap a line connecting the light-emission element part corresponding to the optical lens fixed by the support part, to another light-emission element part adjacent to the light-emission element part.

摘要翻译： 提供了防止产生亮度不均的表面发射单元。 表面发射单元由二维排列并排列在基板上的发光元件和相对于每个发光元件部分配置在基板上的光学透镜的发光元件部分组成， 将发光元件的漫射光和将光学透镜固定在基板上的支撑部被配置为不与将与由支撑部固定的光学透镜对应的发光元件部连接到另一个光 - 发光元件部分。

公开(公告)号：US20120206673A1

公开(公告)日：2012-08-16

申请号：US13502693

申请日：2010-11-09

申请人： Nobuo Ogata ,  Mitsuru Hineno ,  Shinji Suminoe

发明人： Nobuo Ogata ,  Mitsuru Hineno ,  Shinji Suminoe

IPC分类号： G02F1/13357 ,  F21V7/00 ,  F21V9/16 ,  F21V11/00

CPC分类号： F21K9/50 ,  F21K9/60 ,  F21V5/04 ,  F21V17/101 ,  F21V23/001 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F1/133606 ,  G02F1/133611 ,  G02F2202/28 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A surface light-emitting unit of the present invention is an LED module (30) for emitting light from an LED chip (6) of a light-emitting element part (1) via a light flux control section (22) of a light flux control part (2), the light flux control section (22) being fixed by a plurality of columnar sections (21) above a fixing surface of a substrate (4) on which fixing surface the light-emitting element part (1)is fixed. This provides an appropriate gap between the light-emitting element part (1) and the light flux control section (22) for heat release.

摘要翻译： 本发明的面发光单元是用于经由光通量的光束控制部（22）从发光元件部（1）的LED芯片（6）发光的LED模块（30） 控制部分（2），所述光束控制部分（22）由固定在所述发光元件部分（1）固定的基板（4）的固定表面上的多个柱状部分（21）固定 。 这提供了用于放热的发光元件部分（1）和光束控制部分（22）之间的适当间隙。

公开(公告)号：US20110110046A1

公开(公告)日：2011-05-12

申请号：US13002806

申请日：2009-05-07

申请人： Kohji Itoh ,  Shinji Suminoe ,  Masato Onoue ,  Daisuke Takeda

发明人： Kohji Itoh ,  Shinji Suminoe ,  Masato Onoue ,  Daisuke Takeda

IPC分类号： H05K7/20

CPC分类号： H05K7/20963 ,  G02F1/133308 ,  G02F2001/133628 ,  G02F2203/60

摘要： Disclosed is a reinforcement frame (38) fixed to an outer package (37) of a heated component unit in a display (69), wherein a first heat dissipation fin is included in the reinforcement frame (38). With such an arrangement, even when heat generated when a component unit (such as a backlight unit in a liquid crystal display) is driven, e.g. driving heat of various elements included in the component unit, is transmitted to the outer package (37) of the component unit, the driving heat is further transmitted to the reinforcement frame (38) which is in contact with the outer package (37) and dissipated by means of the first heat dissipation fin. Consequently, the various elements in the component unit are not impaired by driving heat.

摘要翻译： 公开了一种固定在显示器（69）中的加热部件单元的外包装（37）上的加强框架（38），其中第一散热片包括在加强框架（38）中。 通过这样的布置，即使当驱动组件单元（诸如液晶显示器中的背光单元）时产生的热量，例如， 包括在部件单元中的各种元件的驱动热量传递到部件单元的外包装（37），驱动热量进一步传递到与外包装（37）接触的加强框架（38）和 通过第一散热片消散。 因此，组件单元中的各种元件不受驱动热的影响。