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    Bare die integration with printed components on flexible substrate without laser cut
    1.
    发明授权
    Bare die integration with printed components on flexible substrate without laser cut 有权

    公开(公告)号：US10165677B2

    公开(公告)日：2018-12-25

    申请号：US14965039

    申请日：2015-12-10

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Ping Mei ,  Tse Nga Ng ,  Brent S. Krusor ,  Gregory L. Whiting ,  Steven E. Ready ,  Janos Veres

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/14 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

    Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

    Digital 3D fabrication using multi-layered mold
    5.
    发明授权
    Digital 3D fabrication using multi-layered mold 有权
    数字3D制作采用多层模具

    公开(公告)号：US09156194B2

    公开(公告)日：2015-10-13

    申请号：US13831358

    申请日：2013-03-14

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Tse Nga Ng ,  JengPing Lu ,  Eugene M. Chow ,  Timothy David Stowe ,  Janos Veres ,  Philipp H. Schmaelzle

    IPC: B29C33/38 ,  B29C67/00 ,  B29C33/44 ,  B29C33/00

    CPC classification number: B29C33/3835 ,  B29C33/005 ,  B29C33/3842 ,  B29C33/448 ,  B29C64/00 ,  B29C64/106 ,  B29C67/0051 ,  B29C67/0055 ,  B29C2033/385

    Abstract: A replica 3D structure is fabricated inside a multi-layered mold by patterning each mold layer to define a void/opening that matches a corresponding cross section of the structure's peripheral surface, and filling the patterned opening of each layer with a structural material (i.e., before depositing a subsequent layer of mold material). The mold material (e.g., photoresist or another dissolvable sacrificial material) is blanket deposited (e.g., by slot-die, spray coating) and then patterned using a laser or a printed mask. Each layer of modeling material (e.g., polymer, ceramic or metal, or a combination thereof) is electro-plated or otherwise deposited on the previously formed modeling material layer. High vertical resolution is achieved by utilizing relatively thin mold layers. The mold layer deposition, patterning and modeling material deposition is repeated until the replica 3D structure is entirely formed inside the multi-layered mold, and then the mold is dissolved or otherwise removed.

    Abstract translation: 复制3D结构通过图案化每个模具层以形成与结构的周边表面的相应横截面相匹配的空隙/开口，并且用结构材料填充每个层的图案化开口（即， 在沉积后续的模具材料层之前）。 模具材料（例如，光致抗蚀剂或另一种可溶解的牺牲材料）被覆盖沉积（例如，通过狭缝模头，喷涂），然后使用激光或印刷掩模进行图案化。 每层建模材料（例如，聚合物，陶瓷或金属或其组合）被电镀或以其他方式沉积在先前形成的建模材料层上。 通过使用相对薄的模具层实现高垂直分辨率。 重复模层沉积，图案化和建模材料沉积，直到复制3D结构完全形成在多层模具内，然后模具被溶解或以其他方式去除。

    ELECTROACTIVE POLYMER STRUCTURES PRINTED WITH VARYING COMPOSITIONS OF IONS
    6.
    发明申请
    ELECTROACTIVE POLYMER STRUCTURES PRINTED WITH VARYING COMPOSITIONS OF IONS 有权
    电离聚合物结构印有不断变化的离子组成

    公开(公告)号：US20150048714A1

    公开(公告)日：2015-02-19

    申请号：US13966060

    申请日：2013-08-13

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Tse Nga Ng ,  Kye-Si Kwon

    IPC: H02N11/00 ,  B81B3/00 ,  B81C1/00

    CPC classification number: H01L41/0933 ,  H01L41/0926 ,  H01L41/0946 ,  H01L41/0953 ,  H01L41/193 ,  Y10T29/49117

    Abstract: An electroactive polymer structure includes a first flexible electrode, a second flexible electrode, and a polymer dielectric layer with ionic liquid on top of the first electrode including at least two regions. Each region of the polymer dielectric layer includes a different ionic liquid concentration. The polymer dielectric layer is in between the first flexible electrode and the second flexible electrode.

    Abstract translation: 电活性聚合物结构包括第一柔性电极，第二柔性电极和在第一电极的顶部上具有至少两个区域的离子液体的聚合物电介质层。 聚合物介电层的每个区域包括不同的离子液体浓度。 聚合物介电层位于第一柔性电极和第二柔性电极之间。

    BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE WITHOUT LASER CUT
    8.
    发明申请
    BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE WITHOUT LASER CUT 审中-公开

    公开(公告)号：US20190124757A1

    公开(公告)日：2019-04-25

    申请号：US16190324

    申请日：2018-11-14

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Tse Nga Ng ,  Ping Mei ,  Brent S. Krusor ,  Gregory L. Whiting ,  Steven E. Ready ,  Janos Veres

    IPC: H05K1/02 ,  H01L23/00 ,  H01L21/56 ,  H05K3/14 ,  H05K1/03 ,  H05K1/18

    Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

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