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公开(公告)号：US20230357558A1
公开(公告)日：2023-11-09
申请号：US18026292
申请日：2021-09-10
Inventor： Yiqun WANG , Hirosuke SAITO , Hiroharu INOUE
CPC classification number: C08L53/00 , C08G65/485 , C08K5/14 , C08K7/18 , C08J5/244 , C08J7/0427 , H05K1/0353 , C08J2353/00 , C08L2203/16 , C08L2203/20
Abstract: A resin composition contains a styrenic block copolymer, a radical polymerizable compound, and at least one free radical compound selected from the group consisting of a compound (A) represented by Formula (1), a compound (B) represented by Formula (2), and a compound (C) having two or more of at least one group selected from groups represented by Formulas (3-1) and (3-2).
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2.发明公开公开(公告)号：US20230331944A1
公开(公告)日：2023-10-19
申请号：US18025141
申请日：2021-09-09
Inventor： Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE , Rihoko WATANABE
IPC: C08J5/24 , C08F257/02 , C08F290/06 , C08K3/36 , H05K1/03
CPC classification number: C08J5/244 , C08F257/02 , C08F290/062 , C08K3/36 , C08J5/249 , H05K1/0346 , H05K1/0366 , C08J2351/06 , C08J2351/08
Abstract: A resin composition contains a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.; and a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less.
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3.发明公开公开(公告)号：US20230323104A1
公开(公告)日：2023-10-12
申请号：US18025150
申请日：2021-09-09
Inventor： Rihoko WATANABE , Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08L53/00 , C08K5/3415 , C08K3/36 , C08L2203/16 , C08J7/0427 , H05K1/0353 , C08J2325/06 , C08J5/246
Abstract: A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.
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公开(公告)号：US20240368323A1
公开(公告)日：2024-11-07
申请号：US18561098
申请日：2022-05-16
Inventor： Hirosuke SAITO , Yasunori NISHIGUCHI , Hiroaki UMEHARA , Hiroharu INOUE
IPC: C08F222/40 , C08F212/34 , C08J5/18 , C08J5/24 , H05K1/03
Abstract: One aspect of the present invention relates to a resin composition containing a maleimide compound (A) having a benzene ring in the molecule and a hydrocarbon-based compound (B) represented by the following Formula (1), in which the maleimide compound (A) contains a maleimide compound (A-1) having a maleimide group equivalent of 400 g/mol or less. In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group or an aliphatic cyclic group, and n represents an integer from 1 to 10.
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公开(公告)号：US20240239974A1
公开(公告)日：2024-07-18
申请号：US18290279
申请日：2022-05-12
Inventor： Hirosuke SAITO , Yiqun WANG , Hiroharu INOUE , Yasunori NISHIGUCHI
IPC: C08J5/18 , C08J5/24 , C08K5/5313 , H05K1/03
CPC classification number: C08J5/18 , C08J5/24 , C08K5/5313 , H05K1/0353
Abstract: A resin composition includes:
a compound (A) represented by the following formula
wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group;
and a thermosetting resin (B) containing at least one selected from among an epoxy resin, a polyphenylene ether resin, a cyanate ester resin, a phenol resin, an active ester resin, a benzoxazine resin, a maleimide resin, an acrylic resin, a methacrylic resin, a vinyl resin, an allyl resin, a propenyl resin, and a hydrocarbon-based resin having an unsaturated double bond.-
Patent Agency Ranking
公开(公告)号：US20170190875A1
公开(公告)日：2017-07-06
申请号：US15468977
申请日：2017-03-24
Inventor： Hiroaki FUJIWARA , Yuki KITAI , Hirosuke SAITO
CPC classification number: C08K5/378 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2305/076 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2457/00 , B32B2457/08 , B32B2581/00 , C08G14/06 , C08G59/686 , C08G59/687 , C08G73/0233 , C08G73/22 , C08J5/24 , C08J2379/02 , C08J2379/04 , C08K5/3445 , C08L61/04 , C08L61/34 , C08L63/00 , C08L79/02 , C08L79/04 , C08L2203/20 , H01L23/145 , H01L23/295 , H01L2924/0002 , H05K1/0326 , H05K1/0346 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0129 , H01L2924/00
Abstract: A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.
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公开(公告)号：US20240270774A1
公开(公告)日：2024-08-15
申请号：US18289953
申请日：2022-05-12
Inventor： Hirosuke SAITO , Hiroshi SUMITOMO
IPC: C07F9/6571 , C08K5/5313
CPC classification number: C07F9/657172 , C08K5/5313
Abstract: An organic compound is represented by the following formula (1).
wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group.-
公开(公告)号：US20210084757A1
公开(公告)日：2021-03-18
申请号：US16629811
申请日：2018-06-22
Inventor： Kosuke TSUDA , Hirosuke SAITO , Hiroaki FUJIWARA
Abstract: A metal-clad laminate includes: an insulating layer; and a metal foil being in contact with at least one surface of the insulating layer. The insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 specific groups per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer. The metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer. The contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness.
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9.发明申请公开(公告)号：US20190300639A1
公开(公告)日：2019-10-03
申请号：US16448191
申请日：2019-06-21
Inventor： Yuki KITAI , Hiroaki FUJIWARA , Hirosuke SAITO
IPC: C08F290/06 , C08L9/00 , C08L71/12 , C08J5/24 , H05K1/03 , B32B15/14 , C08G65/48 , C08F279/02 , B32B5/02 , C08L51/08 , C08K5/03 , C08K5/01
Abstract: A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1.
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10.发明申请POLYPHENYLENE ETHER RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD 审中-公开聚苯乙烯树脂组合物，PREPREG，金属层压板和印刷线路板公开(公告)号：US20160145370A1
公开(公告)日：2016-05-26
申请号：US14898857
申请日：2014-06-13
Inventor： Yuki KITAI , Hiroaki FUJIWARA , Hirosuke SAITO
Abstract: An object of the present invention is to provide a polyphenylene ether resin composition which, while retaining excellent dielectric properties, is also endowed with excellent properties such as heat resistance, adhesion and Tg. The polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) diviny)benzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A) : (B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1) : (B-2), of from 1:100 to 1.5:1.
Abstract translation: 本发明的目的是提供一种聚酰胺树脂组合物，其在保持优异的介电性能的同时，具有优异的耐热性，粘附性和Tg特性。 聚苯醚树脂组合物包括（A）具有碳 - 碳不饱和双键的取代基末端改性的改性聚苯醚和（B）具有碳 - 碳不饱和双键的交联剂。 作为组分（B）的交联剂包含50-100质量％的（B-1）共聚物）苯和（B-2）聚丁二烯。 组分（A）和（B）之间的比例以质量比（A）：（B）表示，为65:35至95:5。 组分（B-1）和（B-2）之间的比例以质量比（B-1）：（B-2）表示为1:100至1.5:1。
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