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1.发明公开公开(公告)号：US20230331957A1
公开(公告)日：2023-10-19
申请号：US18025114
申请日：2021-09-09
Inventor： Rihoko WATANABE , Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08K5/3415 , C08J5/246 , C08J7/0427 , C08K3/36 , C08L53/00 , H05K1/0373 , C08J2353/00 , C08L2203/20
Abstract: A resin composition contains a maleimide compound (A) having an indane structure in the molecule, and a styrenic polymer being solid at 25° C.
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公开(公告)号：US20240368323A1
公开(公告)日：2024-11-07
申请号：US18561098
申请日：2022-05-16
Inventor： Hirosuke SAITO , Yasunori NISHIGUCHI , Hiroaki UMEHARA , Hiroharu INOUE
IPC: C08F222/40 , C08F212/34 , C08J5/18 , C08J5/24 , H05K1/03
Abstract: One aspect of the present invention relates to a resin composition containing a maleimide compound (A) having a benzene ring in the molecule and a hydrocarbon-based compound (B) represented by the following Formula (1), in which the maleimide compound (A) contains a maleimide compound (A-1) having a maleimide group equivalent of 400 g/mol or less. In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group or an aliphatic cyclic group, and n represents an integer from 1 to 10.
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公开(公告)号：US20150259489A1
公开(公告)日：2015-09-17
申请号：US14640507
申请日：2015-03-06
Inventor： Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08J5/24 , C08J2315/00 , C08J2333/00 , C08J2371/12 , C08J2433/00 , C08J2463/00 , C08J2471/12 , C08L71/12 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/0209 , H05K2201/029 , Y10T428/249921 , Y10T442/2951 , C08L33/06 , C08L33/20 , C08L63/00
Abstract: Provided is a prepreg that is formed by impregnating a fabric base material with a resin composition, then heating and drying. The resin composition includes (A) a polymer which has a specific structure, has no unsaturated bond between carbon atoms, has an epoxy number of from 0.2 to 0.8 eq/kg, and has a weight-average molecular weight of from 200,000 to 1,000,000; (B) a polyarylene-ether copolymer (PAE); and (C) an epoxy resin having two or more epoxy groups on a molecule. The component (B) is compatible with the component (A), and the component (C) is an epoxy resin that is incompatible with the component (A).
Abstract translation: 提供了通过用树脂组合物浸渍织物基材，然后加热和干燥而形成的预浸料。 树脂组合物包含（A）具有特定结构的聚合物，在碳原子之间不具有不饱和键，环氧基数为0.2〜0.8当量/ kg，重均分子量为20万〜100万。 （B）聚亚芳基醚共聚物（PAE）; 和（C）在分子上具有两个以上环氧基的环氧树脂。 组分（B）与组分（A）相容，组分（C）是与组分（A）不相容的环氧树脂。
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4.发明公开公开(公告)号：US20230331944A1
公开(公告)日：2023-10-19
申请号：US18025141
申请日：2021-09-09
Inventor： Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE , Rihoko WATANABE
IPC: C08J5/24 , C08F257/02 , C08F290/06 , C08K3/36 , H05K1/03
CPC classification number: C08J5/244 , C08F257/02 , C08F290/062 , C08K3/36 , C08J5/249 , H05K1/0346 , H05K1/0366 , C08J2351/06 , C08J2351/08
Abstract: A resin composition contains a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.; and a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less.
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5.发明公开公开(公告)号：US20230323104A1
公开(公告)日：2023-10-12
申请号：US18025150
申请日：2021-09-09
Inventor： Rihoko WATANABE , Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08L53/00 , C08K5/3415 , C08K3/36 , C08L2203/16 , C08J7/0427 , H05K1/0353 , C08J2325/06 , C08J5/246
Abstract: A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.
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Patent Agency Ranking
公开(公告)号：US20210061996A1
公开(公告)日：2021-03-04
申请号：US16957232
申请日：2018-10-16
Inventor： Hiroaki UMEHARA , Fumito SUZUKI , Jun YASUMOTO , Hiroharu INOUE
IPC: C08L71/12 , C08K5/00 , C08K5/3492 , C08J5/24
Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
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公开(公告)号：US20220356349A1
公开(公告)日：2022-11-10
申请号：US17762544
申请日：2020-09-14
Inventor： Hiroaki UMEHARA , Masaaki MATSUMOTO , Ryuji TAKAHASHI
Abstract: One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.
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公开(公告)号：US20220243013A1
公开(公告)日：2022-08-04
申请号：US17438207
申请日：2020-03-18
Inventor： Hiroaki UMEHARA , Yiqun WANG , Hiroharu INOUE
Abstract: A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.
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公开(公告)号：US20210032424A1
公开(公告)日：2021-02-04
申请号：US16978599
申请日：2019-03-11
Inventor： Hiroaki UMEHARA , Rihoko WATANABE , Hiroharu INOUE , Yiqun WANG
Abstract: A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
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10.发明申请公开(公告)号：US20200283615A1
公开(公告)日：2020-09-10
申请号：US16880593
申请日：2020-05-21
Inventor： Hiroaki UMEHARA , Hiroharu INOUE
IPC: C08L51/08 , C08J5/24 , B32B15/08 , C08L71/12 , C08L101/12 , C08F222/10 , C08L33/04 , H05K1/03 , C08L71/00 , C08F2/44 , C08G65/48 , C08F290/06 , H05K1/02
Abstract: A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.
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