公开(公告)号：US11776791B2

公开(公告)日：2023-10-03

申请号：US16886543

申请日：2020-05-28

Applicant: PSK INC.

Inventor： Jong Chan Lee ,  Geon Jong Kim ,  Kwang Sung Yoo ,  Seok June Yun

IPC: H01J37/32 ,  H01L21/687 ,  H05H1/46

CPC classification number: H01J37/32385 ,  H01J37/32449 ,  H01J37/32541 ,  H01L21/687 ,  H05H1/46

Abstract: A substrate processing apparatus are provided. The substrate processing apparatus allows a supply flow rate per unit time for process gas supplied to the central area of a substrate to be greater than a supply flow rate per unit time for process gas supplied to an edge area of the substrate, when processing the edge area of the substrate supported by the chuck.

公开(公告)号：US11295933B2

公开(公告)日：2022-04-05

申请号：US16886479

申请日：2020-05-28

Applicant: PSK INC.

Inventor： Geon Jong Kim ,  Tae Hwan Youn ,  Jong Chan Lee

IPC: H01J37/32 ,  C23C16/458 ,  H01L21/687 ,  H01L21/67

Abstract: An apparatus for processing a substrate is provided. The apparatus for processing the substrate includes a housing having a process space, a gas supply unit to supply gas into the process space, a support unit including a chuck to support the substrate in the process space and a lower electrode to surround the chuck when viewed from a top, a temperature adjusting plate provided in the housing, a dielectric plate unit coupled to the temperature adjusting plate, and having a dielectric plate disposed in opposite to the substrate supported by the support unit in the process space, and an upper electrode unit coupled to the temperature adjusting plate, and having an upper electrode disposed in opposition to the lower electrode. The dielectric plate unit includes a first base disposed between the dielectric plate and the temperature adjusting plate.

公开(公告)号：US12062525B2

公开(公告)日：2024-08-13

申请号：US17679900

申请日：2022-02-24

Applicant: PSK INC.

Inventor： Jong Chan Lee ,  Ju Young Park ,  Jun Young Cho ,  Hyeon Gyeong Shin

IPC: H01J37/32 ,  H01L21/687

CPC classification number: H01J37/32715 ,  H01J37/32568 ,  H01J37/32816 ,  H01L21/68742 ,  H01J2237/0206 ,  H01J2237/20235 ,  H01J2237/334

Abstract: A substrate treating apparatus includes a housing, treating space and support unit to support a substrate, dielectric plate, gas supply unit, and plasma source to generate a plasma and including a top edge electrode above the edge region supported by the support unit and bottom edge electrode below the edge region supported by the support unit, which includes a support plate having an inner space and vacuum hole that communicates with the inner space and sucking the substrate on the top surface. A lift pin assembly can transfer the substrate between an outside transfer unit and the support plate. A decompression unit can apply negative pressure to the inner space. The lift pin assembly includes a base plate and through hole penetrating the base plate to provide negative pressure in a region under the base plate to a region over the base plate. Lift pins protrude from the base plate and support a bottom substrate surface. A driver can lift/lower the base plate within the inner space.

公开(公告)号：US20230145538A1

公开(公告)日：2023-05-11

申请号：US17679900

申请日：2022-02-24

Applicant: PSK INC.

Inventor： Jong Chan Lee ,  Ju Young Park ,  Jun Young Cho ,  Hyeon Gyeong Shin

IPC: H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32568 ,  H01J37/32816 ,  H01J2237/20235 ,  H01J2237/334 ,  H01J2237/0206

Abstract: A substrate treating apparatus includes a housing, treating space and support unit to support a substrate, dielectric plate, gas supply unit, and plasma source to generate a plasma and including a top edge electrode above the edge region supported by the support unit and bottom edge electrode below the edge region supported by the support unit, which includes a support plate having an inner space and vacuum hole that communicates with the inner space and sucking the substrate on the top surface. A lift pin assembly can transfer the substrate between an outside transfer unit and the support plate. A decompression unit can apply negative pressure to the inner space. The lift pin assembly includes a base plate and through hole penetrating the base plate to provide negative pressure in a region under the base plate to a region over the base plate. Lift pins protrude from the base plate and support a bottom substrate surface. A driver can lift/lower the base plate within the inner space.

公开(公告)号：US11302558B2

公开(公告)日：2022-04-12

申请号：US17000726

申请日：2020-08-24

Applicant: PSK INC.

Inventor： Jong Chan Lee ,  Min Ho Choi ,  You Jin Choi ,  Da In Kim

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/687

Abstract: An apparatus for processing a substrate includes a housing having a processing space therein, a transfer robot that loads the substrate into the processing space or unloads the substrate from the processing space, a support unit including a chuck that supports the substrate in the processing space and a lift pin that moves the substrate in an up-down direction, a dielectric plate having a lower surface disposed to face an upper surface of the chuck, and a gap measurement unit that measures a gap between the dielectric plate and the substrate supported by the lift pin or a gap between the dielectric plate and the chuck.