-
1.发明授权Photocurable formulation containing a partially polymerized divinylsiloxane linked bisbenzocyclobutene resin 失效含有部分聚合的二乙烯基硅氧烷连接的双苯并环丁烯树脂的光固化制剂
公开(公告)号：US5882836A
公开(公告)日：1999-03-16
申请号：US465664
申请日：1995-06-05
CPC分类号： G03F7/0757 , C09D4/00
摘要： A photocurable formulation containing a partially polymerized DVS resin formed by heating DVS monomer (1,3-bis(2-bicyclo�4.2.0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyldisiloxane) in a solvent at an initial concentration of DVS monomer in the solvent of from about 12 to about 32 weight percent. This photocurable formulation may be used as an interlayer dielectric to fabricate thin film multichip modules.
摘要翻译： 含有通过加热DVS单体（1,3-双（2-二环[4.2.0]辛-1,3,5-三烯-3-基 - 乙烯基）-1,1,3，...）形成的部分聚合的DVS树脂的光固化制剂， 3-四甲基二硅氧烷）在溶剂中，在溶剂中初始浓度为DVS单体的溶剂为约12至约32重量％。 该光固化剂可用作层间电介质以制造薄膜多芯片组件。
-
2.发明授权Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins 失效部分聚合的二乙烯基硅氧烷连接的双苯并环丁烯树脂和制备所述树脂的方法
公开(公告)号：US5854302A
公开(公告)日：1998-12-29
申请号：US224203
申请日：1994-04-14
CPC分类号： G03F7/0757 , C09D4/00
摘要： A process for forming a partially polymerized DVS resin comprising heating DVS monomer (1,3-bis(2-bicyclo�4.2.0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyldisiloxane) in a solvent at a concentration of DVS monomer in the solvent such that: (a) the DVS resin, when applied and polymerized in a thin layer on a solid substrate does not craze; and (b) the DVS resin, is rendered photocurable by the addition of at least one photosensitive agent in an amount sufficient to convert the mixture to an organic-insoluble solid upon exposing the mixture to photon radiation and the film retention upon development with a solvent is at least 50 percent. The DVS resin may be used as an interlayer dielectric to fabricate thin film multichip modules.
摘要翻译： 一种形成部分聚合的DVS树脂的方法，包括加热DVS单体（1,3-双（2-双环[4.2.0]辛-1,3,5-三烯-3-基乙烯基）-1,1,3,3 - 四甲基二硅氧烷）溶于溶剂中的DVS单体浓度的溶剂中，使得：（a）DVS树脂在固体基材上薄层涂布和聚合时不会发热; 和（b）DVS树脂通过添加至少一种光敏剂使其变得光固化，其量足以将混合物暴露于光子辐射时将混合物转化为有机不溶性固体，并在用溶剂显影时保留膜 至少有50％。 DVS树脂可以用作层间电介质以制造薄膜多芯片模块。
-
公开(公告)号：US5585450A
公开(公告)日：1996-12-17
申请号：US465666
申请日：1995-06-05
IPC分类号： G03F7/008 , C07C247/16 , C07F7/08 , C08F2/46 , C08F30/08 , C08G61/00 , C08G61/06 , C08G61/08 , C08L65/00 , G03F7/027 , G03F7/075 , C08F130/08
CPC分类号： C07F7/0849 , C07C247/16 , C08G61/00 , G03F7/027 , G03F7/0757 , C07C2101/14
摘要： An oligomerized cyclobutarene containing 80 weight percent or more of oligomers of a degree of polymerization of three or more.
摘要翻译： 含有80重量％以上聚合度为3以上的低聚物的低聚环丁烷。
-
公开(公告)号：US06083661A
公开(公告)日：2000-07-04
申请号：US290197
申请日：1994-08-15
IPC分类号： G03F7/008 , C07C247/16 , C07F7/08 , C08F2/46 , C08F30/08 , C08G61/00 , C08G61/06 , C08G61/08 , C08L65/00 , G03F7/027 , G03F7/075 , G03C1/13
CPC分类号： C07F7/0849 , C07C247/16 , C08G61/00 , G03F7/027 , G03F7/0757 , C07C2101/14
摘要： Photodefineable cyclobutarene compositions are disclosed. These polymer compositions are useful in composites, laminates, membranes, films, adhesives, coatings, and electronic applications such as multichip modules and printed circuit boards. An example of such photodefineable cyclobutarene compositions is a mixture of a photosensitive agent such as 2,6-bis(4-azidobenzylidene)-4-methylcyclohexanone and a cyclobutarene such as oligomeric divinyltetramethyldisiloxane bisbenzocyclobutane.
摘要翻译： 公开了可定义的环丁烷组合物。 这些聚合物组合物可用于复合材料，层压材料，膜，膜，粘合剂，涂料和电子应用如多芯片模块和印刷电路板。 这种光可定义的环丁烷组合物的实例是感光剂如2,6-双（4-叠氮亚苄基）-4-甲基环己酮和环丁烷如低聚二乙烯基四甲基二硅氧烷双苯并环丁烷的混合物。
-
5.发明授权Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants 失效硼酸酯，含硼掺杂剂，以及制造含硼掺杂剂的方法公开(公告)号：US08629294B2
公开(公告)日：2014-01-14
申请号：US13217597
申请日：2011-08-25
IPC分类号： C07F5/04
CPC分类号： C07F7/04
摘要： Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants are provided herein. In an embodiment, a borate ester comprises boron and silicon wherein the boron is linked to the silicon by alkyl groups that are bonded via ester bonds with both the boron and the silicon. A method of fabricating a boron-comprising dopant comprises providing a borate and transesterifying the borate using a polyol-substituted silicon monomer.
摘要翻译： 本文提供硼酸酯，含硼掺杂剂和制备含硼掺杂剂的方法。 在一个实施方案中，硼酸酯包括硼和硅，其中硼通过与硼和硅两者通过酯键键合的烷基连接到硅。 制备含硼掺杂剂的方法包括使用多元醇取代的硅单体提供硼酸盐并使硼酸酯酯交换。
-
公开(公告)号：US06878500B2
公开(公告)日：2005-04-12
申请号：US10408044
申请日：2003-04-05
摘要： Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.
摘要翻译： 提供了用于从衬底去除图案化的光致定影材料（例如光刻胶和/或可光成像的电介质材料）的组合物和方法。 这样的组合物和方法在电子设备的制造中是有用的。 还提供了通过从下面的有机膜去除图案化的光可定义材料来重新加工电子器件衬底的方法。
-
公开(公告)号：US06610609B2
公开(公告)日：2003-08-26
申请号：US09847741
申请日：2001-05-02
IPC分类号： H01L21302
CPC分类号： H01L21/0274 , H01L21/0332 , H01L27/14683
摘要： Disclosed are compositions and methods for improving compatibility of imaging layers with dielectric layers. Also disclosed are methods of reducing or eliminating poisoning of photoresists during electronic device manufacture.
摘要翻译： 公开了用于提高成像层与电介质层的相容性的组合物和方法。 还公开了在电子设备制造期间减少或消除光致抗蚀剂中毒的方法。
-
公开(公告)号：US06319835B1
公开(公告)日：2001-11-20
申请号：US09514064
申请日：2000-02-25
IPC分类号： H01L21302
摘要： Disclosed are compositions useful for removing antireflective compositions from a substrate. Also disclosed are methods of removing antireflective compositions from a substrate using such compositions.
摘要翻译： 公开了可用于从基底去除抗反射组合物的组合物。 还公开了使用这种组合物从基材中除去抗反射组合物的方法。
-
公开(公告)号：US06749765B2
公开(公告)日：2004-06-15
申请号：US10108070
申请日：2002-03-27
IPC分类号： H01L2100
CPC分类号： H01L21/02118 , H01L21/31051 , H01L21/312 , H01L21/76808 , H05K3/0076 , H05K3/0094 , H05K3/064 , Y10S428/901 , Y10T428/24322 , Y10T428/24339 , Y10T428/24521 , Y10T428/31942
摘要： Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.
摘要翻译： 公开了用于在电子设备的制造中提供基本平坦化的表面的组合物和方法。 还公开了用于在电子设备的制造中保护孔的组合物和方法。
-
公开(公告)号：US06461717B1
公开(公告)日：2002-10-08
申请号：US09556542
申请日：2000-04-24
IPC分类号： B32B324
CPC分类号： H01L21/02118 , H01L21/31051 , H01L21/312 , H01L21/76808 , H05K3/0076 , H05K3/0094 , H05K3/064 , Y10S428/901 , Y10T428/24322 , Y10T428/24339 , Y10T428/24521 , Y10T428/31942
摘要： Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.029 秒)