-
公开(公告)号：US10076070B2
公开(公告)日：2018-09-11
申请号：US14867241
申请日：2015-09-28
Inventor： Katsuhiko Itoh , Masanori Ikeda , Kenji Okamoto
CPC classification number: H05K13/0465 , H05K3/3421 , H05K3/3478 , H05K13/0817 , H05K2203/041
Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.
-
公开(公告)号：US09629292B2
公开(公告)日：2017-04-18
申请号：US14443451
申请日：2013-11-15
Inventor： Katsuhiko Itoh , Mitsuo Nakamura , Daisuke Nagai , Kenji Okamoto
CPC classification number: H05K13/0465 , B23K3/0638 , B23K37/04 , H05K3/303 , H05K3/341 , H05K13/08 , H05K13/0817 , H05K13/083 , H05K2203/04 , H05K2203/166 , Y02P70/613
Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.
-
Patent Agency Ranking
3.发明申请公开(公告)号：US20150296670A1
公开(公告)日：2015-10-15
申请号：US14443451
申请日：2013-11-15
Inventor： Katsuhiko Itoh , Mitsuo Nakamura , Daisuke Nagai , Kenji Okamoto
CPC classification number: H05K13/0465 , B23K3/0638 , B23K37/04 , H05K3/303 , H05K3/341 , H05K13/08 , H05K13/0817 , H05K13/083 , H05K2203/04 , H05K2203/166 , Y02P70/613
Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.
Abstract translation: 根据在执行部件安装工作时预先设置在以下安装信息中的安装模式，将电子部件安装在基板上。 在安装信息中，第一安装模式中的任何一个，其中电子部件被传送并安装到基于印刷焊料的位置和电极的位置之间的位置偏移量被校正的安装位置和第二安装模式 设置电子部件通过仅考虑电极的位置作为参考而被传送并安装到安装位置的安装模式被设置为用于每个电子部件的性能的安装模式。
-
4.发明授权公开(公告)号：US11102919B2
公开(公告)日：2021-08-24
申请号：US15075223
申请日：2016-03-21
Inventor： Hachiro Nakatsuji , Kenji Okamoto , Yuji Nakamura
Abstract: A management apparatus is connected to a mount substrate manufacturing line including a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than a reflow apparatus in a mount substrate manufacturing line to start production of the mount substrate, based on first data relating to the period of time necessary to complete preparation for the performing of a process by the reflow apparatus.
-
公开(公告)号：US10139810B2
公开(公告)日：2018-11-27
申请号：US15075059
申请日：2016-03-18
Inventor： Yuji Nakamura , Hachiro Nakatsuji , Kenji Okamoto
IPC: G05B19/418 , H05K13/08
Abstract: A management apparatus is connected to a mount substrate manufacturing line including at least a print apparatus, a component mounting apparatus, and a reflow apparatus, through a network. The management apparatus instructs at least one of apparatuses that are at a more upstream side than the reflow apparatus in a mount substrate manufacturing line, to perform at least any one of an operation relating to maintenance, an operation relating to calibration, and an warm-up operation, based on first data relating to a period of time necessary to complete preparation for performing a process by the reflow apparatus.
-
公开(公告)号：US09661793B2
公开(公告)日：2017-05-23
申请号：US14443691
申请日：2013-11-15
Inventor： Katsuhiko Itoh , Mitsuo Nakamura , Daisuke Nagai , Kenji Okamoto
IPC: B23K31/02 , H05K13/00 , H05K13/08 , B23K1/00 , B23K1/20 , B23K31/12 , B23K37/04 , H05K3/34 , B23K1/008 , B23K3/06 , B23K3/08 , H05K13/04 , H05K3/30 , B23K101/42
CPC classification number: H05K13/0015 , B23K1/0016 , B23K1/008 , B23K1/20 , B23K3/0638 , B23K3/087 , B23K31/12 , B23K37/04 , B23K2101/42 , H05K3/303 , H05K3/34 , H05K13/0465 , H05K13/08 , H05K13/0812 , H05K13/0817 , H05K2201/10636 , H05K2203/04 , H05K2203/163 , H05K2203/166 , Y02P70/611
Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.
-
公开(公告)号：US10149419B2
公开(公告)日：2018-12-04
申请号：US14868885
申请日：2015-09-29
Inventor： Katsuhiko Itoh , Masanori Ikeda , Kenji Okamoto
Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.
-
-
-
-
-
-
Search Results
7
records
(took 0.018 seconds)
