公开(公告)号：US20160322342A1

公开(公告)日：2016-11-03

申请号：US15108783

申请日：2015-01-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JUNICHI KIMURA ,  MASAHISA NAKAGUCHI ,  FUMITO ITOU ,  NORIMITSU HOZUMI

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/14 ,  H01L23/00 ,  H01L23/50 ,  H01L23/495

CPC classification number: H01L25/18 ,  H01L23/142 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49534 ,  H01L23/49551 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49572 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/37144 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate made of metal, a first metal wiring disposed above the substrate, a first semiconductor element and a second semiconductor element disposed above the first metal wiring, and a second metal wiring disposed above the first semiconductor element and the second semiconductor element. Furthermore, the semiconductor device includes a plurality of projections disposed in at least one of a space between each of the first semiconductor element and the second semiconductor element, and the first metal wiring, and a space between each of the first semiconductor element and the second semiconductor element, and the second metal wiring.

Abstract translation: 半导体器件包括由金属制成的衬底，设置在衬底上的第一金属布线，设置在第一金属布线上方的第一半导体元件和第二半导体元件，以及设置在第一半导体元件和第二半导体之上的第二金属布线 元件。 此外，半导体器件包括设置在第一半导体元件和第二半导体元件中的每一个之间的空间中的至少一个以及第一金属布线中的多个突起，以及第一半导体元件和第二半导体元件 半导体元件和第二金属布线。

公开(公告)号：US20160320244A1

公开(公告)日：2016-11-03

申请号：US15108756

申请日：2015-01-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： JUNICHI KIMURA ,  MASAHISA NAKAGUCHI ,  SHINICHI KOHDA ,  NORIMITSU HOZUMI

IPC: G01K1/14 ,  G01K1/16 ,  H01L23/367 ,  G01K7/22

CPC classification number: G01K1/14 ,  G01K1/16 ,  G01K7/22 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In an electronic device, A heat spreader is adhered to a surface of the substrate on a side opposite to the lower surface of the substrate (hereinafter referred to as “upper surface”) by an adhesive sheet. The heat spreader supports a power transistor cooperatively with the substrate. The power transistor which is an electrical element and the heat spreader are adhered to each other by an adhesive sheet on an adhering surface on a side opposite to an adhering surface where the heat spreader is adhered to the substrate. A bus bar and the power transistor are adhered to each other by an adhesive sheet on an adhering surface on a side opposite to an adhering surface where the power transistor is adhered to the heat spreader. The thermistor is connected to a lead which is a conductive line, and is disposed on an upper surface side of substrate.

Abstract translation: 在电子设备中，散热器通过粘合片粘附在基板的与表面的下表面相对的一侧的表面上（以下称为“上表面”）。 散热器与基板配合支撑功率晶体管。 作为电气元件的功率晶体管和散热器通过粘合片彼此粘附在与散热器粘附到基板的粘附表面相对的一侧的粘附表面上。 汇流条和功率晶体管通过粘合片在与功率晶体管粘附到散热器的粘附表面相反的一侧上的粘合表面上彼此粘合。 热敏电阻连接到作为导线的引线，并且设置在基板的上表面侧。