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    Ultrashort pulse laser deposition of thin films
    1.
    发明授权
    Ultrashort pulse laser deposition of thin films 失效
    超短脉冲激光沉积薄膜

    公开(公告)号：US06372103B1

    公开(公告)日：2002-04-16

    申请号：US09568617

    申请日：2000-05-10

    申请人： Michael D. Perry ,  Paul S. Banks ,  Brent C. Stuart

    发明人： Michael D. Perry ,  Paul S. Banks ,  Brent C. Stuart

    IPC分类号： C23C1434

    CPC分类号： C23C14/28 ,  B23K26/0624 ,  C23C14/0605

    摘要： Short pulse PLD is a viable technique of producing high quality films with properties very close to that of crystalline diamond. The plasma generated using femtosecond lasers is composed of single atom ions with no clusters producing films with high Sp3/Sp2 ratios. Using a high average power femtosecond laser system, the present invention dramatically increases deposition rates to up to 25 &mgr;m/hr (which exceeds many CVD processes) while growing particulate-free films. In the present invention, deposition rates is a function of laser wavelength, laser fluence, laser spot size, and target/substrate separation. The relevant laser parameters are shown to ensure particulate-free growth, and characterizations of the films grown are made using several diagnostic techniques including electron energy loss spectroscopy (EELS) and Raman spectroscopy.

    摘要翻译： 短脉冲PLD是生产具有非常接近结晶金刚石的性能的高质量薄膜的可行技术。 使用飞秒激光器产生的等离子体由单个原子离子组成，没有产生具有高Sp3 / Sp2比率的膜的簇。 使用高平均功率的飞秒激光系统，当生长无颗粒的膜时，本发明显着地将沉积速率提高到高达25mum / hr（其超过许多CVD工艺）。 在本发明中，沉积速率是激光波长，激光能量密度，激光光斑尺寸和靶/衬底分离的函数。 显示相关的激光参数以确保无颗粒生长，并且使用包括电子能量损失光谱（EELS）和拉曼光谱学的几种诊断技术来制备生长的膜的表征。

    Method of short pulse hole drilling without a resultant pilot hole and backwall damage
    2.
    发明授权
    Method of short pulse hole drilling without a resultant pilot hole and backwall damage 有权
    短脉冲钻孔方法，无导致孔和后壁损坏

    公开(公告)号：US06784400B1

    公开(公告)日：2004-08-31

    申请号：US10377902

    申请日：2003-03-03

    申请人： Paul S. Banks ,  Brent C. Stuart ,  Michael D. Perry

    发明人： Paul S. Banks ,  Brent C. Stuart ,  Michael D. Perry

    IPC分类号： B23K2600

    CPC分类号： B23K26/073 ,  B23K26/0624 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/26 ,  B23K2103/50

    摘要： A method for removing material via a laser so as to reduce the formation of channels comprising the steps of emitting a laser pulse comprising a pulse energy, a pulse duration, and a fluence towards a surface of a drilling material the fluence of a value sufficient to avoid the formation of a channel in the drilling material at the surface to form a hole comprising a side wall and a bottom, shaping a spatial profile of the laser pulse such that the fluence is substantially uniform across the spatial profile; and emitting at least one subsequent laser pulse having a pulse energy, a pulse duration, and a fluence sufficient to avoid the formation of a channel at the bottom of the hole.

    摘要翻译： 一种用于通过激光去除材料以减少通道形成的方法，包括以下步骤：向钻孔材料的表面发射包括脉冲能量，脉冲持续时间和能量密度的激光脉冲，该能量值足以 避免在表面处的钻井材料中形成通道以形成包括侧壁和底部的孔，使激光脉冲的空间轮廓成形，使得注量在空间轮廓上基本均匀; 并且发射至少一个具有足够的脉冲能量，脉冲持续时间和能量密度的后续激光脉冲，以避免在孔的底部形成通道。

    Method to reduce damage to backing plate
    3.
    发明授权
    Method to reduce damage to backing plate 失效
    减少背板损坏的方法

    公开(公告)号：US06303901B1

    公开(公告)日：2001-10-16

    申请号：US09558144

    申请日：2000-04-21

    申请人： Michael D. Perry ,  Paul S. Banks ,  Brent C. Stuart

    发明人： Michael D. Perry ,  Paul S. Banks ,  Brent C. Stuart

    IPC分类号： B23K2638

    CPC分类号： B23K26/12 ,  B23K26/0624 ,  B23K26/123 ,  B23K26/18 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/04 ,  B23K2103/16 ,  B23K2103/30 ,  B23K2103/32 ,  B23K2103/36 ,  B23K2103/50 ,  C06B21/0033 ,  F42B33/008 ,  G02F2001/392

    摘要： The present invention is a method for penetrating a workpiece using an ultra-short pulse laser beam without causing damage to subsequent surfaces facing the laser. Several embodiments are shown which place holes in fuel injectors without damaging the back surface of the sack in which the fuel is ejected. In one embodiment, pulses from an ultra short pulse laser remove about 10 nm to 1000 nm of material per pulse. In one embodiment, a plasma source is attached to the fuel injector and initiated by common methods such as microwave energy. In another embodiment of the invention, the sack void is filled with a solid. In one other embodiment, a high viscosity liquid is placed within the sack. In general, high-viscosity liquids preferably used in this invention should have a high damage threshold and have a diffusing property.

    摘要翻译： 本发明是一种使用超短脉冲激光束穿透工件的方法，而不会对面对激光器的后续表面造成损害。 示出了在燃料喷射器中放置孔而不损坏其中喷射燃料的袋的背面的几个实施例。 在一个实施例中，来自超短脉冲激光的脉冲每脉冲去除约10nm至1000nm的材料。 在一个实施例中，等离子体源连接到燃料喷射器并通过诸如微波能量的常用方法启动。 在本发明的另一个实施方案中，袋状空隙填充有固体。 在另一个实施方案中，将高粘度液体放置在袋内。 通常，本发明优选使用的高粘度液体应具有高损伤阈值并具有扩散性。

    Laser machining of explosives
    4.
    发明授权
    Laser machining of explosives 失效
    激光加工炸药

    公开(公告)号：US6150630A

    公开(公告)日：2000-11-21

    申请号：US62078

    申请日：1998-04-17

    申请人： Michael D. Perry ,  Brent C. Stuart ,  Paul S. Banks ,  Booth R. Myers ,  Joseph A. Sefcik

    发明人： Michael D. Perry ,  Brent C. Stuart ,  Paul S. Banks ,  Booth R. Myers ,  Joseph A. Sefcik

    IPC分类号： B23K26/00 ,  B23K26/06 ,  B23K26/12 ,  B23K26/18 ,  B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  C06B21/00 ,  F42B33/00 ,  H01S3/00

    CPC分类号： C06B21/0033 ,  B23K26/0624 ,  B23K26/12 ,  B23K26/127 ,  B23K26/18 ,  B23K26/382 ,  B23K26/402 ,  F42B33/008 ,  B23K2203/05 ,  G02F2001/392 ,  H01S3/0057

    摘要： The invention consists of a method for machining (cutting, drilling, sculpting) of explosives (e.g., TNT, TATB, PETN, RDX, etc.). By using pulses of a duration in the range of 5 femtoseconds to 50 picoseconds, extremely precise and rapid machining can be achieved with essentially no heat or shock affected zone. In this method, material is removed by a nonthermal mechanism. A combination of multiphoton and collisional ionization creates a critical density plasma in a time scale much shorter than electron kinetic energy is transferred to the lattice. The resulting plasma is far from thermal equilibrium. The material is in essence converted from its initial solid-state directly into a fully ionized plasma on a time scale too short for thermal equilibrium to be established with the lattice. As a result, there is negligible heat conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond a few microns from the laser machined surface. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces. There is no detonation or deflagration of the explosive in the process and the material which is removed is rendered inert.

    摘要翻译： 本发明包括一种用于加工（切割，钻孔，雕刻）爆炸物（例如TNT，TATB，PETN，RDX等）的方法。 通过使用持续时间在5飞秒至50皮秒范围内的脉冲，可以在基本上没有受热或冲击影响的区域实现非常精确和快速的机械加工。 在这种方法中，通过非热机制去除材料。 多光子和碰撞电离的组合在比电子动能转移到晶格更短的时间尺度上产生临界密度等离子体。 所得到的等离子体远离热平衡。 该材料本质上从其初始固态直接转化为完全离子化的等离子体，其时间尺度太短而不能与晶格建立。 结果，除去区域之外的热传导可忽略不计，导致对激光加工表面超过几微米的材料的热应力或冲击可忽略不计。 等离子体的流体动力学膨胀不需要任何辅助技术去除材料并产生极高质量的加工表面。 在该过程中爆炸物没有爆炸或爆燃，被除去的物质变得惰性。

    Aberration-free, all-reflective laser pulse stretcher
    5.
    发明授权
    Aberration-free, all-reflective laser pulse stretcher 失效
    无反射，全反射激光脉冲担架

    公开(公告)号：US5960016A

    公开(公告)日：1999-09-28

    申请号：US869345

    申请日：1997-06-05

    申请人： Michael D. Perry ,  Paul S. Banks ,  Brent C. Stuart ,  Scott N. Fochs

    发明人： Michael D. Perry ,  Paul S. Banks ,  Brent C. Stuart ,  Scott N. Fochs

    IPC分类号： H01S3/00 ,  H01S3/1055

    CPC分类号： H01S3/0057

    摘要： An all-reflective pulse stretcher for laser systems employing chirped-pulse amplification enables on-axis use of the focusing mirror which results in ease of use, significantly decreased sensitivity to alignment and near aberration-free performance. By using a new type of diffraction grating which contains a mirror incorporated into the grating, the stretcher contains only three elements: 1) the grating, 2) a spherical or parabolic focusing mirror, and 3) a flat mirror. Addition of a fourth component, a retro-reflector, enables multiple passes of the same stretcher resulting in stretching ratios beyond the current state of the art in a simple and compact design. The pulse stretcher has been used to stretch pulses from 20 fsec to over 600 psec (a stretching ratio in excess of 30,000).

    摘要翻译： 采用啁啾脉冲放大的激光系统的全反射脉冲展宽器能够实现聚焦镜的轴向使用，从而易于使用，显着降低对准灵敏度和近无像差性能。 通过使用包含结合到光栅中的反射镜的新型衍射光栅，担架仅包含三个元件：1）光栅，2）球面或抛物面聚焦镜，以及3）平面镜。 添加第四组件，后向反射器使得能够在简单且紧凑的设计中多次通过相同的拉伸机，导致拉伸比超过现有技术的拉伸比。 已经使用脉冲拉伸器将脉冲从20fsec拉伸到超过600psec（拉伸比超过30,000）。

    Ultrashort pulse laser machining of metals and alloys
    6.
    发明授权
    Ultrashort pulse laser machining of metals and alloys 失效
    超短脉冲激光加工金属和合金

    公开(公告)号：US06621040B1

    公开(公告)日：2003-09-16

    申请号：US08859020

    申请日：1997-05-20

    申请人： Michael D. Perry ,  Brent C. Stuart

    发明人： Michael D. Perry ,  Brent C. Stuart

    IPC分类号： B23K2636

    CPC分类号： B23K26/0665 ,  A61B18/20 ,  A61B18/26 ,  A61B2018/00636 ,  A61C1/0046 ,  B23K26/032 ,  B23K26/0624 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/18 ,  B23K26/40 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/30 ,  B23K2103/50 ,  C06B21/0033

    摘要： The invention consists of a method for high precision machining (cutting, drilling, sculpting) of metals and alloys. By using pulses of a duration in the range of 10 femtoseconds to 100 picoseconds, extremely precise machining can be achieved with essentially no heat or shock affected zone. Because the pulses are so short, there is negligible thermal conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond approximately 0.1-1 micron (dependent upon the particular material) from the laser machined surface. Due to the short duration, the high intensity (>1012 W/cm2) associated with the interaction converts the material directly from the solid-state into an ionized plasma. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces with negligible redeposition either within the kerf or on the surface. Since there is negligible heating beyond the depth of material removed, the composition of the remaining material is unaffected by the laser machining process. This enables high precision machining of alloys and even pure metals with no change in grain structure.

    摘要翻译： 本发明包括金属和合金的高精度加工（切割，钻孔，雕刻）的方法。 通过使用持续时间在10飞秒至100皮秒范围内的脉冲，可以在基本上没有受热或冲击影响的区域实现非常精确的加工。 由于脉冲非常短，所以除去区域之外的热传导可忽略不计，导致材料的热应力可忽略不计或超过激光加工表面的大约0.1-1微米（取决于具体材料）的冲击。 由于持续时间短，与相互作用相关的高强度（> 1012W / cm2）将材料直接从固态转变为电离等离子体。 等离子体的流体动力学膨胀消除了任何辅助技术去除材料和产生极高质量的加工表面的需要，在切口或表面上可忽略不计的再沉积。 由于除了去除材料的深度之外的加热可以忽略不计，剩余材料的组成不受激光加工过程的影响。 这使得能够在不改变晶粒结构的情况下对合金甚至纯金属进行高精度加工。

    Composition analysis by scanning femtosecond laser ultraprobing (CASFLU).
    9.
    发明授权
    Composition analysis by scanning femtosecond laser ultraprobing (CASFLU). 有权
    扫描飞秒激光超扫描（CASFLU）的成分分析。

    公开(公告)号：US06414320B1

    公开(公告)日：2002-07-02

    申请号：US09563122

    申请日：2000-05-02

    申请人： Muriel Y. Ishikawa ,  Lowell L. Wood ,  E. Michael Campbell ,  Brent C. Stuart ,  Michael D. Perry

    发明人： Muriel Y. Ishikawa ,  Lowell L. Wood ,  E. Michael Campbell ,  Brent C. Stuart ,  Michael D. Perry

    IPC分类号： B23K2600

    CPC分类号： G01N21/718 ,  B23K26/0624

    摘要： The composition analysis by scanning femtosecond ultraprobing (CASFLU) technology scans a focused train of extremely short-duration, very intense laser pulses across a sample. The partially-ionized plasma ablated by each pulse is spectrometrically analyzed in real time, determining the ablated material's composition. The steering of the scanned beam thus is computer directed to either continue ablative material-removal at the same site or to successively remove nearby material for the same type of composition analysis. This invention has utility in high-speed chemical-elemental, molecular-fragment and isotopic analyses of the microstructure composition of complex objects, e.g., the oxygen isotopic compositions of large populations of single osteons in bone.

    摘要翻译： 通过扫描飞秒超扫描（CASFLU）技术的成分分析扫描了一个聚焦的训练样本中极短的持续时间，非常强的激光脉冲。 通过每个脉冲烧蚀的部分电离的等离子体实时进行光谱分析，确定烧蚀材料的组成。 因此，扫描光束的转向是计算机指导的，以便在相同的部位继续消融材料去除，或连续地去除附近的材料以进行相同类型的组成分析。 本发明在复杂物体的微观结构组成的高速化学元素，分子片段和同位素分析中具有实用价值，例如骨中大量单个骨骼的氧同位素组成。