摘要:
A silsesquioxane resin is applied over the patterned photo-resist and cured at the pattern surface to produce a cured silsesquioxane resin on the pattern surface. The uncured silsesquioxane resin layer is then removed leaving the cured silsesquioxane resin on the pattern surface. The cured silsesquioxane resin on horizontal surfaces is removed to expose the underlying photo-resist. This photo-resist is removed leaving a pattern of cured silsesquioxane. Optionally, the new pattern can be transferred into the underlying layer(s).
摘要:
A silsesquioxane resin is applied over the patterned photo-resist and cured at the pattern surface to produce a cured silsesquioxane resin on the pattern surface. The uncured silsesquioxane resin layer is then removed leaving the cured silsesquioxane resin on the pattern surface. The cured silsesquioxane resin on horizontal surfaces is removed to expose the underlying photo-resist. This photo-resist is removed leaving a pattern of cured silsesquioxane. Optionally, the new pattern can be transferred into the underlying layer(s).
摘要:
A system and method of minimizing the amount of power that is used by an optoelectronic module is disclosed. The system uses a thermoelectric cooler (TEC) to maintain a case temperature of the module at about 50° C. This allows the TEC to operate in the much more efficient heating mode, thus minimizing the amount of current being used to maintain the module temperature. The method includes the steps of determining a temperature range and operating temperature for an optoelectronic module, such that a maximum current level is not exceeded. In one exemplary embodiment, an operating temperature of about 50° C. with a temperature range of from about −5° C. to about 75° C. allows a maximum current of about 300 mA.
摘要:
A method of forming an antireflective coating on an electronic device comprising (A) applying to an electronic device an ARC composition comprising (i) a silsesquioxane resin having the formula (PhSiO(3-X)/2(OH)x)mHSiO(3-x)/2(OH)x)N(MeSiO(3-x)/2(OH)x)p where Ph is a phenyl group, Me is a methyl group, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, and m+n+p≈1; and (ii) a solvent; and (B) removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.
摘要:
Silsesquioxane resins useful in forming the antireflective coating having the formula (PhSiO(3-x)/2(OH)x)mHSiO(3-x)/2(OH)x)n(MeSiO(3-x)/2(OH)x)p(RSiO(3-x)/2(OH)x)q where Ph is a phenyl group, Me is a methyl group, R is selected from ester groups and polyether groups, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, q has a value of 0.01 to 0.30 and m+n+p+q≈1.
摘要翻译:可用于形成具有式(PhSiO(3-x)/ 2(OH)x)mHSiO(3-x)/ 2(OH)x)n(MeSiO(3-x)/ 2(OH))的抗反射涂层的倍半硅氧烷树脂 )x)p(RSiO(3-x)/ 2(OH)x)q其中Ph是苯基,Me是甲基,R选自酯基和聚醚基团,x的值为0,1 或2; m的值为0.05〜0.95,n为0.05〜0.95,p为0.05〜0.95,q为0.01〜0.30,m + n + p +q≈1。
摘要:
This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin has the formula (PhSiO(3-x)/2(OR′)x)m(HSiO(3-x)/2(OR′)x)n(MeSiO(3-x)/2(OR′)x)o(RSiO(3-x)/2(OR′)η)p where Ph is a phenyl group Me is a methyl group, R is selected from a reactive organic functional group or curable group, R′ is hydride or a hydrocarbon group, x has a value of 0, 1 or 2; m has a value of 0.01 to 0.97, n has a value of 0.01 to 0.97, o has a value of 0.01 to 0.97, p has a value of 0.01 to 0.97, and m+n+o+p=1. The resins are cured when baked at elevated temperatures. Alternatively, the compositions may comprise a free radical initiator or other additives such as thermal or photo acids and bases to improve the cure profile of the resin. In addition, the presence of a hydride group in the silsesquioxane resin is essential for the desired strip-ability as a 193 nm ARC material.
摘要翻译:本发明涉及可用于抗反射涂料的倍半硅氧烷树脂,其中倍半硅氧烷树脂具有式(PhSiO(3-x)/ 2(OR')x)m(HSiO(3-x)/ 2(OR')x)n( MeSiO(3-x)/ 2(OR')x)o(RSiO(3-x)/ 2(OR')eegr)p其中Ph是苯基Me是甲基,R选自反应性 有机官能团或可固化基团,R'是氢化物或烃基,x具有0,1或2的值; m的值为0.01〜0.97,n为0.01〜0.97,o为0.01〜0.97,p为0.01〜0.97,m + n + o + p = 1。 树脂在升高的温度下烘烤时固化。 或者,组合物可以包含自由基引发剂或其它添加剂,例如热或光酸和碱,以改善树脂的固化分布。 此外,在倍半硅氧烷树脂中存在氢化物基团对于作为193nm ARC材料的期望剥离性而言是必需的。
摘要:
A silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin has the formula (PhSiO(3-x)/2(OR′)x)m(HSiO(3-x)/2(OR′)x)n(MeSiO(3-x)/2(OR′)x)o(RSiO(3-x)/2(OR′)x)p and a method of forming an antireflective coating on an electronic device comprising applying to an electronic device an antireflective coating composition comprising the silsesquioxane resin and a solvent, and removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.
摘要:
A method of forming an antireflective coating on an electronic device comprising (A) applying to an electronic device an ARC composition comprising (i) a silsesquioxane resin having the formula (PhSiO(3-X)/2(OH)x)mHSiO(3-x)/2(OH)x)N(MeSiO(3-x)/2(OH)x)p where Ph is a phenyl group, Me is a methyl group, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, and m+n+p≈1; and (ii) a solvent; and (B) removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.
摘要:
This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin is comprised of the units (Ph(CH2)rSiO(3−x)/2(OR′)x)m (HSiO(3−x)/2(OR′)x)n (MeSiO(3−x)/2(OR′)x)o (RSiO(3−x)/2(OR′)x)p (R1SiO(3−x)/2(OR′)x)q where Ph is a phenyl group, Me is a methyl group; R′ is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a hydroxyl producing group; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.95; n has a value of 0.05 to 0.95; o has a value of 0.05 to 0.95; p has a value of 0.05 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q≈1.
摘要翻译:本发明涉及可用于抗反射涂料的倍半硅氧烷树脂,其中倍半硅氧烷树脂由单元(Ph(CH 2)r SiO(3-x)/ 2(OR')x)m(HSiO(3-x)/ 2 '(x')x(x)n(MeSiO(3-x)/ 2(OR')x)o(RSiO(3-x)/ 2 其中Ph是苯基,Me是甲基; R'是氢原子或具有1至4个碳原子的烃基; R选自羟基生成基团; 并且R 1选自取代的苯基,酯基,聚醚基团; 巯基和反应性或可固化的有机官能团; 并且r的值为0,1,2,3或4; x的值为0,1或2; 其中,所述树脂m的值为0〜0.95; n的值为0.05〜0.95; o的值为0.05〜0.95; p的值为0.05〜0.5; q的值为0〜0.5; 和m + n + o + p +q≈1。
摘要:
A method of forming an antireflective coating on an electronic device comprising (A) applying to an electronic device an ARC composition comprising (i) a silsesquioxane resin having the formula (PhSiO(3-x)/2(OHx)m HSiO(3-x)/2(OH)x)n, where Ph is a phenyl group, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95 and m+n≈1; and (ii) a solvent; and (B) removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.