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1.发明授权
公开(公告)号：US5835128A
公开(公告)日：1998-11-10
申请号：US757881
申请日：1996-11-27
摘要： A system for redistributing a television signal to a multiplicity of receiver units within a multiple dwelling unit (MDU) includes a main receiving antenna which receives a broadband television signal and a translation device that translates the broadband television signal into a different carrier frequency band. One or more broadcasting antennas, located at advantageous sites within the MDU, transmit the translated television signal along one or more walls of the MDU to be received by antennas associated with one or more individual receiver units. Each receiver unit demodulates the received television signal and provides a user-specified channel to a television set for display.
摘要翻译： 用于将电视信号重新分配到多个住宅单元（MDU）内的多个接收机单元的系统包括接收宽带电视信号的主接收天线和将宽带电视信号转换为不同载波频带的翻译设备。 位于MDU内的有利位置的一个或多个广播天线沿着与一个或多个单独的接收机单元相关联的天线接收的MDU的一个或多个墙壁传送翻译的电视信号。 每个接收机单元解调所接收的电视信号，并将用户指定的频道提供给用于显示的电视机。
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2.发明授权Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements 失效微波/毫米波电路结构，具有分立的倒装芯片安装元件
公开(公告)号：US5757074A
公开(公告)日：1998-05-26
申请号：US681688
申请日：1996-07-29
CPC分类号： H01L25/162 , H01L23/66 , H01L24/81 , H01Q23/00 , H05K3/3452 , H01L2223/6677 , H01L2224/13111 , H01L2224/16 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/1305 , H01L2924/13064 , H01L2924/14 , H01L2924/1423 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0237 , H05K2201/0175 , H05K2203/0315
摘要： A microwave/millimeter wave circuit structure supports discrete circuit elements by flip-chip mounting to an interconnection network on a low cost non-ceramic and non-semiconductor dielectric substrate, preferably Duroid. The necessary precise alignment of the circuit elements with contact pads on the substrate network required for the high operating frequencies is facilitated by oxidizing the interconnection network, but providing the contact pads from a non-oxidizable material to establish a preferential solder bump wetting for the pads. Alternately, the contact bumps on the flip-chips can be precisely positioned through corresponding openings in a passivation layer over the interconnection network. For thin circuit substrates that are too soft for successful flip-chip mounting, stiffening substrates are laminated to the circuit substrates. In a self-contained antenna application in which two of the circuit substrates are laminated together, with an antenna on one side and circuitry on the other side, a metallic ground plane between the substrates also serves a stiffening function.
摘要翻译： 微波/毫米波电路结构通过倒装芯片安装到低成本非陶瓷和非半导体电介质基底（优选为Duroid）上的互连网络来支持分立电路元件。 通过氧化互连网络来提供电路元件与高工作频率所需的基板网络上的接触焊盘的必要精确对准，但是提供来自不可氧化材料的接触焊盘以建立用于焊盘的优先焊料凸块润湿 。 或者，倒装芯片上的接触凸块可以通过互连网络上的钝化层中的相应开口精确定位。 对于对于成功倒装芯片安装来说太软的薄电路基板，加固基板被层压到电路基板上。 在其中两个电路基板层叠在一起的独立天线应用中，一侧的天线和另一侧的电路，在基板之间的金属接地平面也起增强作用。
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公开(公告)号：US5528209A
公开(公告)日：1996-06-18
申请号：US430067
申请日：1995-04-27
申请人： Perry A. Macdonald , Lawrence E. Larson , Michael G. Case , Mehran Matloubian , Mary Y. Chen , David B. Rensch
发明人： Perry A. Macdonald , Lawrence E. Larson , Michael G. Case , Mehran Matloubian , Mary Y. Chen , David B. Rensch
IPC分类号： H01L21/822 , H01L27/04 , H01L27/06 , H01L29/205 , H01P3/08 , H03F3/54 , H03H7/38 , H01P5/00
CPC分类号： H01L27/0605 , H01L2223/6627 , H01L2223/6644 , H01L2223/6683
摘要： A monolithic microwave integrated circuit is formed by positioning a distributed, transmission-line network over a microwave-device structure. The ground plane of the transmission-line network adjoins an interconnect system of the microwave-device structure and signal lines of the transmission-line network are adapted to communicate with the microwave-device structure through orifices of the ground plane. The invention facilitates the use of low-cost silicon-based transistors in monolithic microwave integrated circuits.
摘要翻译： 通过在微波器件结构上定位分布式传输线网络来形成单片微波集成电路。 传输线网络的接地平面与微波器件结构的互连系统相邻，并且传输线网络的信号线适于通过接地平面的孔与微波器件结构通信。 本发明有助于在单片微波集成电路中使用低成本硅基晶体管。
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4.发明授权Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same 失效具有分立倒装芯片安装元件的微波/毫米波电路结构及其制造方法
公开(公告)号：US5629241A
公开(公告)日：1997-05-13
申请号：US499800
申请日：1995-07-07
CPC分类号： H01L25/162 , H01L23/66 , H01L24/81 , H01Q23/00 , H05K3/3452 , H01L2223/6677 , H01L2224/13111 , H01L2224/16 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/1305 , H01L2924/13064 , H01L2924/14 , H01L2924/1423 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0237 , H05K2201/0175 , H05K2203/0315
摘要： A microwave/millimeter wave circuit structure supports discrete circuit elements by flip-chip mounting to an interconnection network on a low cost non-ceramic and non-semiconductor dielectric substrate, preferably Duroid. The necessary precise alignment of the circuit elements with contact pads on the substrate network required for the high operating frequencies is facilitated by oxidizing the interconnection network, but providing the contact pads from a non-oxidizable material to establish a preferential solder bump wetting for the pads. Alternately, the contact bumps on the flip-chips can be precisely positioned through corresponding openings in a passivation layer over the interconnection network. For thin circuit substrates that are too soft for successful flip-chip mounting, stiffening substrates are laminated to the circuit substrates. In a self-contained antenna application in which two of the circuit substrates are laminated together, with an antenna on one side and circuitry on the other side, a metallic ground plane between the substrates also serves a stiffening function.
摘要翻译： 微波/毫米波电路结构通过倒装芯片安装到低成本非陶瓷和非半导体电介质基底（优选为Duroid）上的互连网络来支持分立电路元件。 通过氧化互连网络来提供电路元件与高工作频率所需的基板网络上的接触焊盘的必要精确对准，但是提供来自不可氧化材料的接触焊盘以建立用于焊盘的优先焊料凸块润湿 。 或者，倒装芯片上的接触凸块可以通过互连网络上的钝化层中的相应开口精确定位。 对于对于成功倒装芯片安装来说太软的薄电路基板，加固基板被层压到电路基板上。 在其中两个电路基板层叠在一起的独立天线应用中，一侧的天线和另一侧的电路，在基板之间的金属接地平面也起增强作用。
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公开(公告)号：US5608413A
公开(公告)日：1997-03-04
申请号：US483360
申请日：1995-06-07
申请人： Perry A. Macdonald
发明人： Perry A. Macdonald
摘要： A slot radiator and a patch radiator are formed in a single antenna which is connected to a handheld, wireless telephone. The antenna can be pivoted to operational positions and excited to radiate linearly-polarized signals or circularly-polarized signals whose radiation patterns are respectively directed azimuthally and elevationally.
摘要翻译： 缝隙散热器和贴片辐射器形成在连接到手持式无线电话的单个天线中。 天线可以枢转到操作位置并被激发以辐射线性偏振信号或者其辐射图分别指向方位角和高程的圆偏振信号。
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公开(公告)号：US5695155A
公开(公告)日：1997-12-09
申请号：US531876
申请日：1995-09-21
CPC分类号： B64D15/20
摘要： A sensor is provided for detecting the presence of dielectric media, e.g., ice. The sensor includes a plurality of microstrip resonators which are positioned for electromagnetic coupling with a microstrip transmission line. The resonators produce amplitude minima in a radio-frequency signal that is carried over the transmission line. The resonance of the resonators changes in response to the addition of a dielectric coating. Each resonator can be configured with a different resonant frequency which serves as a signature that identifies the respective resonator's position. The sensor has a thin aerodynamic profile, can conform to nonplanar surfaces and its installation requires no intrusion into an aircraft skin.
摘要翻译： 提供了一种用于检测介质介质（例如冰）的存在的传感器。 传感器包括多个微带谐振器，其被定位成与微带传输线电磁耦合。 谐振器在传输线上承载的射频信号中产生幅度最小值。 谐振器的谐振响应于介电涂层的添加而改变。 每个谐振器可以配置有不同的谐振频率，其作为标识相应谐振器位置的签名。 传感器具有薄的空气动力学特性，可以符合非平面表面，其安装不需要侵入飞机皮肤。
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公开(公告)号：US08058935B2
公开(公告)日：2011-11-15
申请号：US12701005
申请日：2010-02-05
CPC分类号： H01Q21/064 , H01Q21/0006 , H01Q23/00 , H03F3/602
摘要： An apparatus comprises a structure, an array of oscillator units, a plurality of waveguides in the structure, and a synchronizing cavity located within the structure. The array of oscillator units has a plurality of rows and a plurality of columns associated with the structure. Oscillator units in a row within the array of oscillator units are directly coupled to each other. The plurality of waveguides is configured to couple the array of oscillator units to the synchronizing cavity. The synchronizing cavity is configured to cause the array of oscillator units to operate at substantially a common frequency.
摘要翻译： 一种装置包括结构，振荡器单元阵列，结构中的多个波导和位于该结构内的同步腔。 所述振荡器单元阵列具有与所述结构相关联的多个行和多个列。 在振荡器单元阵列内的一行中的振荡器单元彼此直接耦合。 多个波导被配置为将振荡器单元阵列耦合到同步腔。 同步腔被配置为使得振荡器单元阵列基本上以公共频率工作。
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公开(公告)号：US5581217A
公开(公告)日：1996-12-03
申请号：US531803
申请日：1995-09-21
申请人： Perry A. Macdonald
发明人： Perry A. Macdonald
CPC分类号： H05K9/0056 , H01L23/552 , H01L23/66 , H04B15/00 , H01L2924/1616 , H01L2924/3011 , H05K1/0218 , H05K1/0237 , H05K1/05
摘要： Shielding structures are provided for microwave circuits with substrate members and shield members which are formed from conventional substrates. The shield members are shaped and joined to the substrate members to form conductive compartments that substantially surround the microwave circuits and the compartments are closed with a conductive cover. The substrate members and shield members form parallel-plate waveguides which communicate between the compartments. The loss of these waveguides is increased with air-dielectric posts to obtain greater isolation between compartments.
摘要翻译： 为具有基板部件和由常规基板形成的屏蔽部件的微波电路提供屏蔽结构。 屏蔽构件成形并接合到基板构件以形成基本上围绕微波电路的导电隔室，并且隔室用导电盖封闭。 衬底构件和屏蔽构件形成在隔间之间连通的平行板波导。 这些波导的损耗随着空气 - 电介质柱而增加，以在隔室之间获得更大的隔离。
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