Electronic writing systems and methods
    1.
    发明授权
    Electronic writing systems and methods 有权
    电子书写系统和方法

    公开(公告)号:US07342575B1

    公开(公告)日:2008-03-11

    申请号:US10818599

    申请日:2004-04-06

    IPC分类号: G09G5/00

    摘要: Electronic writing systems and methods are described. In one aspect, an electronic writing system includes an elongated housing, an inertial sensor, an optical sensor, and a tracking module. The elongated housing has an optical input. The inertial sensor is attached to the housing and is operable to generate data indicative of movement of the housing relative to an inertial reference frame. The optical sensor is attached to the housing and is operable to generate data from light received through the optical input. The tracking module is operable to compute relative displacement data from inertial movement data corresponding to data generated by the inertial sensor. The tracking module also is operable to detect at least one calibrated position from calibration data encoded in optical data generated from light received by the optical sensor.

    摘要翻译: 描述了电子书写系统和方法。 在一个方面,电子书写系统包括细长壳体,惯性传感器,光学传感器和跟踪模块。 细长壳体具有光学输入。 惯性传感器附接到壳体并且可操作以产生指示壳体相对于惯性参考系的运动的数据。 光学传感器附接到壳体并且可操作以从通过光学输入接收的光产生数据。 跟踪模块可操作以从对应于由惯性传感器产生的数据的惯性运动数据计算相对位移数据。 跟踪模块还可操作以从由光学传感器接收的光产生的光学数据中编码的校准数据中检测至少一个校准位置。

    Systems with high density packing of micromachines
    2.
    发明授权
    Systems with high density packing of micromachines 失效
    具有高机械密度的微机械系统

    公开(公告)号:US06600201B2

    公开(公告)日:2003-07-29

    申请号:US09923000

    申请日:2001-08-03

    IPC分类号: H01L2982

    CPC分类号: B81B7/04 B81B2201/038

    摘要: Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.

    摘要翻译: 提供微机系统。 这种微机械系统的一个实施例包括限定沟槽的衬底。 第一和第二微机电装置至少部分地布置在沟槽内。 每个微电子机械装置包括被构造成相对于基板移动的第一部分。 还提供了方法。

    Flexure coupling block for motion sensor

    公开(公告)号:US06509620B2

    公开(公告)日:2003-01-21

    申请号:US09867667

    申请日:2001-05-31

    IPC分类号: H01L2982

    CPC分类号: H02N1/006

    摘要: A microelectromechanical system (MEMS) device is disclosed for determining the position of a mover. The MEMS device has a bottom layer connected to a mover layer. The mover layer is connected to a mover by flexures. The mover moves relative to the mover layer and the bottom layer. The flexures urge the mover back to an initial position of mechanical equilibrium. The flexures include coupling blocks to control movement of the mover. The MEMS device determines the location of the mover by determining the capacitance between mover electrodes located on the coupling blocks of the flexures and counter electrodes located on an adjacent layer. The coupling block moves according to a determinable relationship with the mover. As the coupling block moves, the capacitance between the mover electrode and the counter electrode changes. A capacitance detector analyzes the capacitance between the electrodes and determines the position of the mover.

    OUT-OF-PLANE TRAVEL RESTRICTION STRUCTURES
    4.
    发明申请
    OUT-OF-PLANE TRAVEL RESTRICTION STRUCTURES 有权
    超平面旅行限制结构

    公开(公告)号:US20140042869A1

    公开(公告)日:2014-02-13

    申请号:US14112091

    申请日:2011-06-28

    IPC分类号: H02N1/00 B81C1/00

    摘要: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel. One example of forming such structures includes providing a first wafer 100, 220 comprising a bond layer of a particular thickness 101, 221 on a surface of a substrate material 105, 225, removing the bond layer 101, 221 in a first area 103-1, 103-2, 223 to expose the surface of the substrate material 105, 225, applying a mask to at least a portion of a remaining bond layer 109-1, 109-4, 229-1, 229-3 and a portion of the exposed surface of the substrate material in the first area 109-2, 109-3, 229-2 to form a second area exposed on the surface of the substrate material 105, 225, etching the second area to form a cavity 110, 230 in the substrate material 105, 225 and the bond layer 101, 221, and forming by the etching, in the cavity 110, 230, a structure 113-1, 113-2, 233 for restricting out-of-plane travel, where the structure 113-1, 113-2, 233 has a particular height from a bottom of the cavity 115, 235 determined by the particular thickness of the bond layer 101, 221.

    摘要翻译: 本公开包括形成用于限制飞机外行进的结构的结构和方法。 形成这种结构的一个实例包括提供第一晶片100,220,第一晶片100,220包括在衬底材料105,225的表面上的特定厚度101,221的接合层,在第一区域103-1-1中去除接合层101,221 ,103-2,223,以暴露衬底材料105,225的表面,将掩模施加到剩余结合层109-1,109-4,229-1,229-3的至少一部分,以及一部分 在第一区域109-2,103-3,229-2中的衬底材料的暴露表面,以形成暴露在衬底材料105,225的表面上的第二区域,蚀刻第二区域以形成空腔110,230 在衬底材料105,225和接合层101,221中,并且通过蚀刻形成在空腔110,230中的用于限制平面外行进的结构113-1,113-2,233,其中 结构113-1,113-2,233具有由空腔115,235的底部由结合层101,221的特定厚度确定的特定高度。

    Systems with high density packing of micromachines
    6.
    发明授权
    Systems with high density packing of micromachines 失效
    具有高机械密度的微机械系统

    公开(公告)号:US06953704B2

    公开(公告)日:2005-10-11

    申请号:US10446036

    申请日:2003-05-27

    IPC分类号: G11C11/42 H01L21/00 H01L21/98

    摘要: Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.

    摘要翻译: 提供微机系统。 这种微机械系统的一个实施例包括限定沟槽的衬底。 第一和第二微机电装置至少部分地布置在沟槽内。 每个微电子机械装置包括被构造成相对于基板移动的第一部分。 还提供了方法。

    Use of standoffs to protect atomic resolution storage mover for out-of-plane motion
    8.
    发明授权
    Use of standoffs to protect atomic resolution storage mover for out-of-plane motion 有权
    使用支架来保护原子分辨率存储移动器以进行平面外运动

    公开(公告)号:US06784592B2

    公开(公告)日:2004-08-31

    申请号:US09854599

    申请日:2001-05-15

    申请人: Peter G. Hartwell

    发明人: Peter G. Hartwell

    IPC分类号: H02N100

    CPC分类号: H02N1/006

    摘要: A micro-machined actuator for use in, among other things, sensors and data storage devices. The actuator includes a stator wafer and a micro-mover positioned adjacent to the stator wafer. Between the stator wafer and the micro-mover are electrodes that are set to specified voltages and that emanate electric fields that position the micro-mover relative to the stator wafer. Also between stator wafer and the micro-mover are bumpers that prevent the electrodes from coming into contact with each other.

    摘要翻译: 一种微加工的致动器,用于传感器和数据存储设备等。 致动器包括定子晶片和邻近定子晶片定位的微型移动器。 定子晶片和微动子之间的电极是被设定为指定电压的电极,并且发出相对于定子晶片定位微动子的电场。 另外,定子晶片和微型动子之间也是防止电极彼此接触的保险杠。