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    Vapor based processing system with purge mode
    5.
    发明授权
    Vapor based processing system with purge mode 有权
    具有吹扫模式的蒸汽处理系统

    公开(公告)号：US08906160B2

    公开(公告)日：2014-12-09

    申请号：US12978403

    申请日：2010-12-23

    申请人： Richard Endo ,  Edward Haywood

    发明人： Richard Endo ,  Edward Haywood

    IPC分类号： C23C16/455 ,  C23C16/40 ,  C23C16/44

    CPC分类号： C23C16/45587 ,  C23C16/4401 ,  C23C16/4408 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/45544 ,  C23C16/45565 ,  C23C16/45574

    摘要： Embodiments of the present invention provide vapor deposition tools. In one example, a vapor deposition tool includes housing. A substrate support is positioned within the housing and configured to support a substrate. A backing plate is positioned above the substrate support. A showerhead is positioned between the substrate support and the backing plate and has a plurality of openings therethrough. A fluid trap member is positioned around a periphery of the showerhead. A fluid trap member actuator is coupled to the fluid trap member and configured to move the fluid trap member between first and second positions relative to the backing plate.

    摘要翻译： 本发明的实施例提供蒸镀工具。 在一个实例中，气相沉积工具包括壳体。 衬底支撑件定位在壳体内并且构造成支撑衬底。 衬板位于衬底支架上方。 喷头位于基板支撑件和背板之间，并且具有穿过其中的多个开口。 流体捕获构件围绕喷头的周边定位。 流体捕集器构件致动器联接到流体捕获构件并且构造成使流体捕获构件相对于背板在第一和第二位置之间移动。

    Method and system for isolated and discretized process sequence integration
    7.
    发明授权
    Method and system for isolated and discretized process sequence integration 失效
    用于离散和离散化过程序列整合的方法和系统

    公开(公告)号：US08283264B2

    公开(公告)日：2012-10-09

    申请号：US12954328

    申请日：2010-11-24

    申请人： Tony P. Chiang ,  Richard Endo ,  James Tsung

    发明人： Tony P. Chiang ,  Richard Endo ,  James Tsung

    IPC分类号： H01L21/31 ,  H01L21/469

    CPC分类号： C23C16/52 ,  C23C14/042 ,  C23C14/54 ,  C23C14/568 ,  H01L21/67184 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/67276 ,  H01L21/67745 ,  H01L21/67769

    摘要： A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.

    摘要翻译： 提供了一种用于处理半导体衬底的系统。 该系统包括具有附接到其上的多个模块的主机。 模块包括处理模块，存储模块和传输机制。 处理模块可以包括组合处理模块和常规处理模块，例如表面处理，热处理，蚀刻和沉积模块。 在一个实施例中，至少一个模块存储多个掩模。 多个掩模使得能够在另一个模块中要处理的衬底的一系列工艺和/或多个层的空间位置和几何形状的原位变化。 还提供了一种处理基板的方法。

    Vapor Based Processing System with Purge Mode
    8.
    发明申请
    Vapor Based Processing System with Purge Mode 有权
    具有吹扫模式的蒸汽处理系统

    公开(公告)号：US20120160173A1

    公开(公告)日：2012-06-28

    申请号：US12978403

    申请日：2010-12-23

    申请人： Richard Endo ,  Edward Haywood

    发明人： Richard Endo ,  Edward Haywood

    IPC分类号： C23C16/455 ,  C23C16/52 ,  C23C16/458

    CPC分类号： C23C16/45587 ,  C23C16/4401 ,  C23C16/4408 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/45544 ,  C23C16/45565 ,  C23C16/45574

    摘要： Embodiments of the present invention provide vapor deposition tools. In one example, a vapor deposition tool includes housing. A substrate support is positioned within the housing and configured to support a substrate. A backing plate is positioned above the substrate support. A showerhead is positioned between the substrate support and the backing plate and has a plurality of openings therethrough. A fluid trap member is positioned around a periphery of the showerhead. A fluid trap member actuator is coupled to the fluid trap member and configured to move the fluid trap member between first and second positions relative to the backing plate.

    摘要翻译： 本发明的实施例提供蒸镀工具。 在一个实例中，气相沉积工具包括壳体。 衬底支撑件定位在壳体内并且构造成支撑衬底。 衬板位于衬底支架上方。 喷头位于基板支撑件和背板之间，并且具有穿过其中的多个开口。 流体捕获构件围绕喷头的周边定位。 流体捕集器构件致动器联接到流体捕获构件并且构造成使流体捕获构件相对于背板在第一和第二位置之间移动。

    Apparatus for single-substrate processing with multiple chemicals and method of use
    9.
    发明申请
    Apparatus for single-substrate processing with multiple chemicals and method of use 审中-公开
    具有多种化学品的单基板处理装置和使用方法

    公开(公告)号：US20070254098A1

    公开(公告)日：2007-11-01

    申请号：US11413651

    申请日：2006-04-28

    申请人： Alexander Ko ,  Richard Endo ,  Brian Brown ,  Kent Child ,  Ralph Wadensweiller

    发明人： Alexander Ko ,  Richard Endo ,  Brian Brown ,  Kent Child ,  Ralph Wadensweiller

    IPC分类号： B05D3/12 ,  B05C13/02

    CPC分类号： H01L21/67051 ,  B05D1/005 ,  B05D7/56

    摘要： A single-substrate apparatus for wet chemical processing of one or multiple sides of a substrate is described. Embodiments of the present invention enable multiple chemicals to be applied to the substrate in succession and reclaimed substantially free of cross contamination between chemicals. In an embodiment of the present invention, a rotatable fluid diverter is positioned between a rotatable pedestal and a nonrotatable multi-level catch cup to funnel fluid shed from a substrate to a predetermined level of the catch cup. The rotatable fluid diverter is designed to expel fluid over a narrow spray angle and thereby enable the pitch of the levels in the catch cup to be reduced so that the chamber volume of the single-substrate apparatus is reduced. In another embodiment of the present invention, the rotatable pedestal is moveable so that the fluid shed from the substrate can be directed to away from the multi-level catch cup.

    摘要翻译： 描述了用于衬底的一个或多个侧面的湿化学处理的单衬底装置。 本发明的实施方案使多种化学品能够连续地应用于基材并且基本上没有化学品之间的交叉污染而被回收。 在本发明的一个实施例中，可转动的流体转向器位于可转动的底座和不可转动的多级夹紧杯之间，用于使流体从衬底排出到捕捉杯的预定水平。 可旋转流体转向器被设计成在窄的喷雾角度上排出流体，从而使得捕获杯中的液位的间距减小，使得单基底装置的腔体积减小。 在本发明的另一个实施例中，可旋转底座是可移动的，使得从衬底脱落的流体可以被引导离开多级抓杯。

    Wet Processing Tool with Site Isolation
    10.
    发明申请
    Wet Processing Tool with Site Isolation 审中-公开
    湿式加工工具与现场隔离

    公开(公告)号：US20120160264A1

    公开(公告)日：2012-06-28

    申请号：US12978177

    申请日：2010-12-23

    申请人： Richard Endo

    发明人： Richard Endo

    IPC分类号： B08B3/12

    CPC分类号： H01L21/67057 ,  H01L21/67086 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719

    摘要： Embodiments of the current invention describe a megasonic processing tool. A substrate support is positioned within a housing and is configured to support a substrate. A first liquid container is moveably coupled to the housing within the testing chamber to be positioned on a first location on the substrate and configured to hold a first body of liquid adjacent to the first location on the substrate. A second liquid container is moveably coupled to the housing within the testing chamber to be positioned on a second location on the substrate and configured to hold a second body of liquid adjacent to the second location on the substrate. The second body of liquid is isolated from the first body of liquid. At least one megasonic transducer is coupled to the housing and configured to perform at least one megasonic process on the first body of liquid and the second body of liquid.

    摘要翻译： 本发明的实施例描述了一种兆声波处理工具。 衬底支撑件定位在壳体内并且被构造成支撑衬底。 第一液体容器可移动地联接到测试室内的壳体，以被定位在衬底上的第一位置上，并被构造成将邻近第一位置的第一液体体保持在衬底上。 第二液体容器可移动地联接到测试室内的壳体，以被定位在衬底上的第二位置上，并被构造成将邻近第二位置的第二液体体保持在衬底上。 液体的第二体与第一液体隔离。 至少一个兆声传感器耦合到壳体并且被配置为在第一液体体和第二液体上执行至少一个兆声波处理。