Apparatus utilizing a variably diffractive radiation element
    2.
    发明授权
    Apparatus utilizing a variably diffractive radiation element 失效
    利用可变衍射辐射元件的装置

    公开(公告)号:US5794023A

    公开(公告)日:1998-08-11

    申请号:US656627

    申请日:1996-05-31

    IPC分类号: G02B5/18 G02B26/08

    CPC分类号: G02B5/1828 G02B26/0808

    摘要: Apparatus suitable for transforming a radiation beam so that it can exit with a predetermined alteration. The apparatus includes a first variably diffractive radiation element for transforming a characteristic of the radiation beam from an original state; a second radiation element juxtaposed to the first radiation element for transforming the same characteristic in a complementary way; and, means for physically deforming the first variably diffractive radiation element so that its diffracting pattern can change in a known way.

    摘要翻译: 适用于变换辐射束以使其能够以预定改变退出的装置。 该装置包括用于将辐射束的特性从原始状态变换的第一可变衍射辐射元件; 与第一辐射元件并置的第二辐射元件,用于以相互补充的方式变换相同的特性; 以及用于使第一可变衍射辐射元件物理变形以使其衍射图案可以以已知方式改变的装置。

    Techniques for Data Center Cooling
    5.
    发明申请
    Techniques for Data Center Cooling 失效
    数据中心冷却技术

    公开(公告)号:US20110279967A1

    公开(公告)日:2011-11-17

    申请号:US13189515

    申请日:2011-07-24

    IPC分类号: H05K7/20

    摘要: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

    摘要翻译: 提供了数据中心冷却技术。 在一个方面,提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口; 以及一个或多个:安装到围绕至少一部分空气入口的计算机设备机架的进气管道,空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸和较小的长度 比计算机设备机架的长度以及安装到围绕至少一部分排气出口的计算机设备机架的排气管道,排气管道具有接近计算机设备机架的横向尺寸的横向尺寸和 长度小于计算机设备机架的长度。

    Techniques for data center cooling
    6.
    发明授权
    Techniques for data center cooling 有权
    数据中心冷却技术

    公开(公告)号:US08009430B2

    公开(公告)日:2011-08-30

    申请号:US11750322

    申请日:2007-05-17

    IPC分类号: H05K7/20 H05K5/00 A47B81/00

    摘要: Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

    摘要翻译: 提供了数据中心冷却技术。 在一个方面,提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口,以及一个或多个:安装到计算机设备机架上的空气入口管道,其围绕空气入口的至少一部分,空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸 并且长度小于计算机设备机架的长度,以及安装在围绕至少一部分排气出口的计算机设备机架上的排气管,排气管具有接近侧向尺寸的横向尺寸 计算机设备机架的长度小于计算机设备机架的长度。

    Techniques for Analyzing Data Center Energy Utilization Practices
    7.
    发明申请
    Techniques for Analyzing Data Center Energy Utilization Practices 审中-公开
    分析数据中心能源利用实践的技术

    公开(公告)号:US20080288193A1

    公开(公告)日:2008-11-20

    申请号:US11750325

    申请日:2007-05-17

    IPC分类号: G01R21/00

    CPC分类号: H05K7/20836

    摘要: Techniques for improving on data center best practices are provided. In one aspect, an exemplary methodology for analyzing energy efficiency of a data center having a raised-floor cooling system with at least one air conditioning unit is provided. The method comprises the following steps. An initial assessment is made of the energy efficiency of the data center based on one or more power consumption parameters of the data center. Physical parameter data obtained from one or more positions in the data center are compiled into one or more metrics, if the initial assessment indicates that the data center is energy inefficient. Recommendations are made to increase the energy efficiency of the data center based on one or more of the metrics.

    摘要翻译: 提供了改进数据中心最佳做法的技术。 一方面,提供了一种用于分析具有至少一个空调单元的具有高架地板冷却系统的数据中心的能量效率的示例性方法。 该方法包括以下步骤。 基于数据中心的一个或多个功耗参数,初步评估数据中心的能效。 如果初始评估指示数据中心是无效率的,则从数据中心中的一个或多个位置获取的物理参数数据被编译为一个或多个度量。 根据一个或多个指标,提出了提高数据中心能效的建议。

    Post CMP cleaning method using a brush cleaner with torque monitor
    8.
    发明授权
    Post CMP cleaning method using a brush cleaner with torque monitor 失效
    后CMP清洁方法使用带有扭矩监视器的清洁刷

    公开(公告)号:US06352596B2

    公开(公告)日:2002-03-05

    申请号:US09876583

    申请日:2001-06-07

    IPC分类号: A46B1304

    摘要: A method of detecting the presence of a brush used in a semiconductor wafer cleaner for post-CMP processing is described. Semiconductor wafers are loaded into the wet environment of the wafer cleaner, affixed to a rotatable fixture and rotated at high speed. The rotatable fixture is effectuated by a servo motor linked to a servo controller and a torque monitor. A first torque on the rotating wafer is calculated prior to the start of the brush cleaning cycle. During the brush cleaning cycle, as the brush within the brush cleaner contacts the rotating wafer, the torque on the wafer increases and a second torque is calculated. If, during the brush cleaning cycle, the second torque calculation is substantially equal to the first torque calculation, the brush cleaner is not contacting the wafer and cleaning has not progressed. A tool user can be notified to reaffix the brush within the cleaner. When the second torque calculation is greater than expected, the tool user can be notified that the brush downforce has been improperly set. Inadequate removal of CMP residue is detected before entire wafer lots have passed through an ineffective brush cleaning cycle prior to an inspection point.

    摘要翻译: 描述了用于后CMP处理的用于半导体晶片清洁器中的刷子的存在的方法。 将半导体晶片装载到晶片清洁器的湿润环境中,固定到可旋转夹具并以高速旋转。 可旋转夹具由连接到伺服控制器和扭矩监视器的伺服电机实现。 在刷清洁循环开始之前计算旋转晶片上的第一转矩。 在刷清洁循环期间,当刷子清洁器内的刷子接触旋转晶片时,晶片上的扭矩增加并且计算第二转矩。 如果在刷清洁循环期间,第二扭矩计算基本上等于第一扭矩计算,则刷清洁器不接触晶片,并且清洁没有进行。 可以通知工具用户以清理清洁剂中的刷子。 当第二扭矩计算大于预期时,可以通知工具用户刷子下压力未正确设置。 在整个晶片批次在检查点之前通过无效的刷子清洁循环之前,检测到不充分的CMP残留物的去除。