Abstract:
A wireless mobile communication device having NFC functionality that is designed to always be capable of NFC functionality, including secure NFC functionality by having a first and second energy source where charging of the second energy source may be achieved by the voltage induced by the received NFC signal.
Abstract:
The invention provides a method for ensuring a secure NFC functionality of a wireless mobile communication device comprising the steps of detecting the charge state of a first energy source (1) which supplies the voltage for operating the wireless mobile communication device (S1); switching off the first energy source and switching on a second energy source (2), if the detected charge state of the first energy source (1) falls below a threshold (S2); detecting the charge state of the second energy source (2), if an external NFC signal is received (S3); charging of the second energy source via voltage induced by a received NFC signal to allow at least one secure NFC transaction, if the detected charge state of the second energy source (2) is below a threshold (S4). Furthermore the invention provides a wireless mobile communication device having a secure NFC functionality, which is always ready for operation of at least the secure NFC functionality.
Abstract:
A calibration device is disclosed for hyper-frequency adjustment of the reference planes of an apparatus for measuring the dispersion parameters of elements of circuits integrated on a substrate. The device includes, integrated on the same substrate, standard patterns and accesses to these patterns which are compatible with the contacts of two test probes connected to the apparatus. Also provided on the substrate are at least two identical series of standard patterns which are formed by parallel lines of the same length, including a short-circuit line and/or an open line and/or a load line, whose accesses are aligned within each series, but opposed from one series to another with respect to the zone in which the second ends are situated. Their second ends are aligned within each series, defining the facing reference planes, separated by a given distance d. The second ends are also arranged in an offset manner from one series to the other in the plane of the substrate by translations parallel to the reference planes so that the distance between these offset ends is equal to or greater than twice the thickness of the substrate and the distance d separating the reference planes is approximately equal to or smaller than three times the thickness of the substrate.
Abstract:
A high-frequency circuit includes a field-effect transistor having a gate electrode for receiving a high-frequency input signal, a source electrode and a drain electrode. Substantial improvements in both maximum gain and high-frequency performance are achieved by providing an input or output terminal at one end of each electrode, and terminating at least one of the electrodes with an appropriate impedance at its second end.
Abstract:
An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S1) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ1) of a printed circuit board (PCB), and a passive integration substrate (S2) set on top of the digital and/or analog integrated circuit (S1) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to, be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.
Abstract:
A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate.
Abstract:
The invention provides a method for ensuring a secure NFC functionality of a wireless mobile communication device comprising the steps of detecting the charge state of a first energy source (1) which supplies the voltage for operating the wireless mobile communication device (S1); switching off the first energy source and switching on a second energy source (2), if the detected charge state of the first energy source (1) falls below a threshold (S2); detecting the charge state of the second energy source (2), if an external NFC signal is received (S3); charging of the second energy source via voltage induced by a received NFC signal to allow at least one secure NFC transaction, if the detected charge state of the second energy source (2) is below a threshold (S4). Furthermore the invention provides a wireless mobile communication device having a secure NFC functionality, which is always ready for operation of at least the secure NFC functionality.
Abstract:
An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S1) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ1) of a printed circuit board (PCB), and a passive integration substrate (S2) set on top of the digital and/or analog integrated circuit (S1) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.
Abstract:
The invention relates to a MEMS resonator having at least one mode shape comprising: a substrate (2) having a surface (12), and a resonator structure (1), wherein the resonator structure (1) is part of the substrate (2), characterized in that the resonator structure (1) is defined by a first closed trench (3) and a second closed trench (3), the first trench (3) being located inside the second trench (3) so as to form a tube structure (1) inside the substrate (2), and the resonator structure (1) being released from the substrate (2) only in directions parallel to the surface (12). The invention further relates to a method of manufacturing such a MEMS resonator.
Abstract:
The invention relates to a MEMS resonator having at least one mode shape comprising: a substrate (2) having a surface (12), and a resonator structure (1), wherein the resonator structure (1) is part of the substrate (2), characterized in that the resonator structure (1) is defined by a first closed trench (3) and a second closed trench (3), the first trench (3) being located inside the second trench (3) so as to form a tube structure (1) inside the substrate (2), and the resonator structure (1) being released from the substrate (2) only in directions parallel to the surface (12). The invention further relates to a method of manufacturing such a MEMS resonator.