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公开(公告)号：US5275330A
公开(公告)日：1994-01-04
申请号：US46052
申请日：1993-04-12
CPC分类号： H01L24/81 , B23K1/0016 , H05K1/112 , H05K3/3436 , H05K3/3484 , B23K2201/42 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/14 , H05K2201/09572 , H05K2201/10234 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/043 , H05K2203/0455 , H05K3/429 , Y02P70/613
摘要： A technique for filling hollow, plated-through-hole vias in multi-layer printed circuit substrates with solder and then joining the solder filled via with a solder ball on a solder ball connectable electronic module is disclosed. The filling of the vias is accomplished by depositing solder paste on one end of the hollow via and reflowing the solder particles within the solder paste to at least partially fill the PTH via. The depositing of the solder paste and the reflowing operations may be repeated until such time as the via is substantially completely filled with solid solder. The importance of the prefilling of the vias with solder is that the reflowing operation of solder balls or solder paste when joining the multi-layer printed circuit board to the electronic module, will prevent undue wicking or pulling of molten solder from the electrical connection into the PTH via, thereby preventing the formation of solder starved or unreliable electrical connections.
摘要翻译： 公开了一种用于在具有焊料的多层印刷电路基板中填充中空的通孔通孔，然后将焊料填充的通孔与焊球接合在可焊锡可连接的电子模块上的技术。 通孔的填充是通过在中空通孔的一端上沉积焊膏并将焊锡膏中的焊料颗粒回流到至少部分地填充PTH通孔来实现的。 可以重复焊膏的沉积和回流操作，直到通孔基本上完全充满固体焊料的时间为止。 用焊料预通孔的重要性在于，当将多层印刷电路板接合到电子模块时，焊球或焊膏的回流操作将防止熔融焊料从电连接进入到 PTH通孔，从而防止形成焊料不足或不可靠的电连接。
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2.发明授权Flex cables with increased three-dimensional conformity and design flexibility 失效Flex电缆具有三维一致性和设计灵活性公开(公告)号：US06224395B1
公开(公告)日：2001-05-01
申请号：US08864313
申请日：1997-05-28
IPC分类号： H01R1208
CPC分类号： H05K1/028 , H05K2201/052 , H05K2201/09063 , H05K2201/09236
摘要： A flex cable is slit between conductor traces to provide conformable strips, at least one of which can be flipped to expose one of the conductor traces to the other side of the cable. This increases the design flexibility of the flex cable because the conductor traces can be exposed on both sides of the cable without laser ablation or etch operations to remove the substrate. Also, because the flex cable is slit along its length, it is more able to conform to different connector locations, thereby obviating the need for designing a different flex cable to accommodate changes in mating hardware.
摘要翻译： 柔性电缆在导体迹线之间切割以提供一致的条带，其中的至少一个可被翻转以将导体迹线中的一个暴露于电缆的另一侧。 这增加了柔性电缆的设计灵活性，因为导体迹线可以暴露在电缆的两侧而没有激光烧蚀或蚀刻操作以去除衬底。 而且，由于柔性电缆沿其长度被切开，所以它更能够符合不同的连接器位置，从而避免了设计不同柔性电缆以适应配合硬件的变化的需要。
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公开(公告)号：US5901263A
公开(公告)日：1999-05-04
申请号：US928389
申请日：1997-09-12
CPC分类号： G02B6/4246 , G02B6/4261 , G02B6/4284 , G02B6/3893 , G02B6/4292
摘要： The invention provides a locking bail that when in the locked position prevents the removal of an optical link module from a host system and when in the unlocked position provides a handle that facilitates the removal of an optical link module. By providing a locking bail, the packing density of modules in a host may be increased. The bail provides a handle which is accessible from the front of the module when the module is unlocked. The locking bail typically engages inclined planes on latch arms that secure an optical link module to the host system.
摘要翻译： 本发明提供了一种锁定保险杠，当处于锁定位置时，防止从主机系统移除光学连接模块，并且当处于解锁位置时提供便于去除光连接器模块的手柄。 通过提供锁定吊环，可以增加主机中的模块的堆积密度。 保释卡提供了一个手柄，当模块解锁时，可以从模块的前部进入。 锁定吊环通常接合锁定臂上的倾斜平面，将光链路模块固定到主机系统。
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公开(公告)号：US6058014A
公开(公告)日：2000-05-02
申请号：US170102
申请日：1998-10-13
申请人： Apurba Choudhury , Miles F. Swain
发明人： Apurba Choudhury , Miles F. Swain
CPC分类号： H05K3/325 , H05K7/1061
摘要： An enhanced electrical arrangement for a computer includes a circuit board, and a module arranged essentially parallel to the circuit board. An array connector is positioned between the circuit board and the module. The array connector causes the circuit board to be in electrical communication with the module. A clamping arrangement is provided for urging the circuit board and the module toward each other, by exerting a constant force against the module to cause an electrical connection between the circuit board, array connector and the module. The clamping arrangement includes an alignment assembly that is mounted to the circuit board to help align the module, and a load assembly to provide the force on the module. The alignment assembly and the load assembly are removably engageable with one another. When the load assembly is engaged with the alignment assembly, the load assembly can apply the force on the module which urges the module toward the array connector and the circuit board. Further, when the load assembly is disengaged from the alignment assembly, the force is removed from the module.
摘要翻译： 用于计算机的增强的电气布置包括电路板和基本上平行于电路板布置的模块。 阵列连接器位于电路板和模块之间。 阵列连接器使电路板与模块电连通。 提供了一种夹持装置，用于通过对模块施加恒定的力来使电路板和模块彼此相向，从而在电路板，阵列连接器和模块之间形成电连接。 夹紧装置包括安装到电路板以帮助对准模块的对准组件以及在模块上提供力的负载组件。 对准组件和负载组件可拆卸地彼此接合。 当负载组件与对准组件接合时，负载组件可以将模块上的力向阵列连接器和电路板施加。 此外，当负载组件与对准组件脱开时，力从模块中移除。
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公开(公告)号：US07160039B2
公开(公告)日：2007-01-09
申请号：US11042868
申请日：2005-01-25
申请人： Marian C. Hargis , David Peter Gaio , Roger T. Lindquist , William K. Hogan , James Walling , Sundeep Nangalia , Philip Deane , Miles F. Swain , Christopher M. Gabel
发明人： Marian C. Hargis , David Peter Gaio , Roger T. Lindquist , William K. Hogan , James Walling , Sundeep Nangalia , Philip Deane , Miles F. Swain , Christopher M. Gabel
CPC分类号： G02B6/4206 , G02B6/4292 , H01L2224/48091 , H01L2924/3011 , H05K1/189 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.
摘要翻译： 本发明涉及一种用于接收机光学子组件或发射器光学子组件中的光学子组件封装，其中，传感器芯片之间的电连接，例如， 光检测器或光源，并且设备印刷电路板由延伸穿过封装壁的单个柔性电路导体制成。 该包装包括外壳和加强板，其包围壳体的端部并且形成用于柔性电路导体的端部的机械支撑。
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