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1.发明申请公开(公告)号：US20080224164A1
公开(公告)日：2008-09-18
申请号：US12126430
申请日：2008-05-23
CPC分类号： C23C16/30 , C23C16/401 , C23C16/402 , C23C16/505 , C23C16/56 , H01L21/02164 , H01L21/02274 , H01L21/31608 , H01L33/005 , H01L33/18 , H01L33/34
摘要： A light emitting device using a silicon (Si) nanocrystalline Si insulating film is presented with an associated fabrication method. The method provides a doped semiconductor or metal bottom electrode. Using a high density plasma-enhanced chemical vapor deposition (HDPECVD) process, a Si insulator film is deposited overlying the semiconductor electrode, having a thickness in a range of 30 to 200 nanometers (nm). For example, the film may be SiOx, where X is less than 2, Si3Nx, where X is less than 4, or SiCx, where X is less than 1. The Si insulating film is annealed, and as a result, Si nanocrystals are formed in the film. Then, a transparent metal electrode is formed overlying the Si insulator film. An annealed Si nanocrystalline SiOx film has a turn-on voltage of less than 20 volts, as defined with respect to a surface emission power of greater than 0.03 watt per square meter.
摘要翻译： 使用硅（Si）纳米晶体Si绝缘膜的发光器件具有相关的制造方法。 该方法提供掺杂半导体或金属底电极。 使用高密度等离子体增强化学气相沉积（HDPECVD）工艺，淀积厚度在30至200纳米（nm）范围内的半导体电极上的Si绝缘体膜。 例如，膜可以是SiO x，其中X小于2，Si 3 N x，其中X小于4，或SiC x，其中X小于1.Si绝缘膜退火，结果Si纳米晶体为 在电影中形成。 然后，形成覆盖Si绝缘膜的透明金属电极。 退火的Si纳米晶SiO x膜具有小于20伏特的导通电压，如关于大于0.03瓦/平方米的表面发射功率所限定的。
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2.发明授权公开(公告)号：US07998884B2
公开(公告)日：2011-08-16
申请号：US12126430
申请日：2008-05-23
IPC分类号： H01L21/469
CPC分类号： C23C16/30 , C23C16/401 , C23C16/402 , C23C16/505 , C23C16/56 , H01L21/02164 , H01L21/02274 , H01L21/31608 , H01L33/005 , H01L33/18 , H01L33/34
摘要： A light emitting device using a silicon (Si) nanocrystalline Si insulating film is presented with an associated fabrication method. The method provides a doped semiconductor or metal bottom electrode. Using a high density plasma-enhanced chemical vapor deposition (HDPECVD) process, a Si insulator film is deposited overlying the semiconductor electrode, having a thickness in a range of 30 to 200 nanometers (nm). For example, the film may be SiOx, where X is less than 2, Si3Nx, where X is less than 4, or SiCx, where X is less than 1. The Si insulating film is annealed, and as a result, Si nanocrystals are formed in the film. Then, a transparent metal electrode is formed overlying the Si insulator film. An annealed Si nanocrystalline SiOx film has a turn-on voltage of less than 20 volts, as defined with respect to a surface emission power of greater than 0.03 watt per square meter.
摘要翻译： 使用硅（Si）纳米晶体Si绝缘膜的发光器件具有相关的制造方法。 该方法提供掺杂半导体或金属底电极。 使用高密度等离子体增强化学气相沉积（HDPECVD）工艺，淀积厚度在30至200纳米（nm）范围内的半导体电极上的Si绝缘体膜。 例如，膜可以是SiO x，其中X小于2，Si 3 N x，其中X小于4，或SiC x，其中X小于1.Si绝缘膜退火，结果Si纳米晶体为 在电影中形成。 然后，形成覆盖Si绝缘膜的透明金属电极。 退火的Si纳米晶SiO x膜具有小于20伏特的导通电压，如关于大于0.03瓦/平方米的表面发射功率所限定的。
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3.发明申请Fabrication of a Semiconductor Nanoparticle Embedded Insulating Film Luminescence Device 失效半导体纳米颗粒嵌入式绝缘膜发光器件的制造公开(公告)号：US20090058266A1
公开(公告)日：2009-03-05
申请号：US12267698
申请日：2008-11-10
CPC分类号： C23C16/30 , C23C16/5096 , C23C16/56
摘要： A method is provided for fabricating a semiconductor nanoparticle embedded Si insulating film for short wavelength luminescence applications. The method provides a bottom electrode, and deposits a semiconductor nanoparticle embedded Si insulating film, including the element of N, O, or C, overlying the bottom electrode. After annealing, a semiconductor nanoparticle embedded Si insulating film has a peak photoluminescence (PL) at a wavelength in the range of 475 to 750 nanometers.
摘要翻译： 提供一种用于制造用于短波长发光应用的半导体纳米颗粒嵌入式Si绝缘膜的方法。 该方法提供底部电极，并沉积包含覆盖底部电极的N，O或C元素的半导体纳米颗粒嵌入的Si绝缘膜。 在退火之后，半导体纳米颗粒嵌入的Si绝缘膜在475至750纳米的波长范围内具有峰值光致发光（PL）。
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4.发明授权High quantum efficiency silicon nanoparticle embedded SiOXNY luminescence device 失效高量子效率硅纳米颗粒嵌入式SiOXNY发光器件公开(公告)号：US07902088B2
公开(公告)日：2011-03-08
申请号：US12249911
申请日：2008-10-11
IPC分类号： H01L21/31 , H01L21/469 , H01J1/62 , H01J63/04
CPC分类号： C23C16/308 , B82Y20/00 , C23C16/28 , C23C16/505 , H01L31/0352 , H01L31/035236
摘要： A method is provided for fabricating a high quantum efficiency silicon (Si) nanoparticle embedded SiOXNY film for luminescence (electroluminescence—EL and photoluminescence—PL) applications. The method provides a bottom electrode, and deposits a Si nanoparticle embedded non-stoichiometric SiOXNY film, where (X+Y 0), overlying the bottom electrode. The Si nanoparticle embedded SiOXNY film is annealed. The annealed Si nanoparticle embedded SiOXNY film has an extinction coefficient (k) of less than about 0.001 as measured at 632 nanometers (nm), and a PL quantum efficiency (PLQE) of greater than 20%.
摘要翻译： 提供了一种用于制造用于发光（电致发光 - EL和光致发光 - PL）应用的高量子效率硅（Si）纳米颗粒嵌入的SiOXNY膜的方法。 该方法提供底部电极，并沉积嵌入非化学计量的SiOXNY膜的Si纳米颗粒，其中（X + Y <2和Y> 0）覆盖在底部电极上。 Si纳米颗粒嵌入的SiOXNY膜退火。 退火的Si纳米颗粒嵌入的SiOXNY膜具有在632纳米（nm）下测量的小于约0.001的消光系数（k），并且PL量子效率（PLQE）大于20％。
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5.发明申请High Quantum Efficiency Silicon Nanoparticle Embedded SiOxNy Luminescence Device 失效高量子硅纳米颗粒嵌入式SiOxNy发光器件公开(公告)号：US20090033207A1
公开(公告)日：2009-02-05
申请号：US12249911
申请日：2008-10-11
CPC分类号： C23C16/308 , B82Y20/00 , C23C16/28 , C23C16/505 , H01L31/0352 , H01L31/035236
摘要： A method is provided for fabricating a high quantum efficiency silicon (Si) nanoparticle embedded SiOXNY film for luminescence (electroluminescence—EL and photoluminescence—PL) applications. The method provides a bottom electrode, and deposits a Si nanoparticle embedded non-stoichiometric SiOXNY film, where (X+Y 0), overlying the bottom electrode. The Si nanoparticle embedded SiOXNY film is annealed. The annealed Si nanoparticle embedded SiOXNY film has an extinction coefficient (k) of less than about 0.001 as measured at 632 nanometers (nm), and a PL quantum efficiency (PLQE) of greater than 20%.
摘要翻译： 提供了一种用于制造用于发光（电致发光 - EL和光致发光 - PL）应用的高量子效率硅（Si）纳米颗粒嵌入的SiOXNY膜的方法。 该方法提供底部电极，并沉积嵌入非化学计量的SiOXNY膜的Si纳米颗粒，其中（X + Y <2和Y> 0）覆盖在底部电极上。 Si纳米颗粒嵌入的SiOXNY膜退火。 退火的Si纳米颗粒嵌入的SiOXNY膜具有在632纳米（nm）下测量的小于约0.001的消光系数（k），并且PL量子效率（PLQE）大于20％。
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6.发明申请Silicon Nanocrystal Embedded Silicon Oxide Electroluminescence Device with a Mid-Bandgap Transition Layer 有权具有中带隙过渡层的硅纳米晶体嵌入式硅氧化物电致发光器件公开(公告)号：US20080305566A1
公开(公告)日：2008-12-11
申请号：US12197045
申请日：2008-08-22
IPC分类号： H01L21/00
CPC分类号： C23C16/30 , C23C16/24 , C23C16/401 , C23C16/505 , C23C16/56 , H01L21/02164 , H01L21/0217 , H01L21/02274 , H01L21/02532 , H01L21/02601 , H01L21/0262 , H01L21/31608
摘要： A method is provided for forming a silicon (Si) nanocrystal embedded Si oxide electroluminescence (EL) device with a mid-bandgap transition layer. The method provides a highly doped Si bottom electrode, and forms a mid-bandgap electrically insulating dielectric film overlying the electrode. A Si nanocrystal embedded SiOx film layer is formed overlying the mid-bandgap electrically insulating dielectric film, where X is less than 2, and a transparent top electrode overlies the Si nanocrystal embedded SiOx film layer. The bandgap of the mid-bandgap dielectric film is about half that of the bandgap of the Si nanocrystal embedded SiOx film. In one aspect, the Si nanocrystal embedded SiOx film has a bandgap (Eg) of about 10 electronvolts (eV) and mid-bandgap electrically insulating dielectric film has a bandgap of about 5 eV. By dividing the high-energy tunneling processes into two lower energy tunneling steps, potential damage due to high power hot electrons is reduced.
摘要翻译： 提供了一种用于形成具有中间带隙过渡层的硅（Si）纳米晶体嵌入式Si氧化物电致发光（EL）器件的方法。 该方法提供高度掺杂的Si底部电极，并且形成覆盖电极的中带隙电绝缘膜。 在其中X小于2的中间带隙绝缘电介质膜上形成Si纳米晶体嵌入的SiOx膜层，并且透明顶部电极覆盖在Si纳米晶体嵌入的SiOx膜层上。 中间带隙电介质膜的带隙约为Si纳米晶体嵌入的SiOx膜的带隙的一半。 在一个方面，Si纳米晶体嵌入的SiO x膜具有约10电子伏特（eV）的带隙（Eg），并且中带隙绝缘电介质膜具有约5eV的带隙。 通过将高能隧道工艺分成两个较低能量的隧穿步骤，由于大功率热电子引起的潜在损害降低。
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7.发明授权Fabrication of a semiconductor nanoparticle embedded insulating film luminescence device 失效半导体纳米颗粒嵌入绝缘膜发光装置的制造公开(公告)号：US08349745B2
公开(公告)日：2013-01-08
申请号：US12267698
申请日：2008-11-10
IPC分类号： H01L21/31
CPC分类号： C23C16/30 , C23C16/5096 , C23C16/56
摘要： A method is provided for fabricating a semiconductor nanoparticle embedded Si insulating film for short wavelength luminescence applications. The method provides a bottom electrode, and deposits a semiconductor nanoparticle embedded Si insulating film, including the element of N, O, or C, overlying the bottom electrode. After annealing, a semiconductor nanoparticle embedded Si insulating film has a peak photoluminescence (PL) at a wavelength in the range of 475 to 750 nanometers.
摘要翻译： 提供一种用于制造用于短波长发光应用的半导体纳米颗粒嵌入式Si绝缘膜的方法。 该方法提供底部电极，并沉积包含覆盖底部电极的N，O或C元素的半导体纳米颗粒嵌入的Si绝缘膜。 在退火之后，半导体纳米颗粒嵌入的Si绝缘膜在475至750纳米的波长范围内具有峰值光致发光（PL）。
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8.发明授权Fabrication of a semiconductor nanoparticle embedded insulating film electroluminescence device 有权半导体纳米颗粒嵌入式绝缘膜电致发光器件的制造公开(公告)号：US08007332B2
公开(公告)日：2011-08-30
申请号：US12187605
申请日：2008-08-07
IPC分类号： H01J9/24
CPC分类号： C23C16/30 , C23C16/24 , C23C16/401 , C23C16/402 , C23C16/505 , C23C16/56 , H01L21/0214 , H01L21/02274 , H01L21/02321 , H01L21/0234 , H01L21/02532 , H01L21/02601 , H01L21/0262 , H01L21/31608 , H01L33/18
摘要： A method is provided for fabricating a semiconductor nanoparticle embedded Si insulating film for electroluminescence (EL) applications. The method provides a bottom electrode, and deposits a semiconductor nanoparticle embedded Si insulating film, including an element selected from a group consisting of N and C, overlying the bottom electrode. After annealing, a semiconductor nanoparticle embedded Si insulating film is formed having an extinction coefficient (k) in a range of 0.01-1.0, as measured at about 632 nanometers (nm), and a current density (J) of greater than 1 Ampere per square centimeter (A/cm2) at an applied electric field lower than 3 MV/cm. In another aspect, the annealed semiconductor nanoparticle embedded Si insulating film has an index of refraction (n) in a range of 1.8-3.0, as measured at 632 nm, with a current density of greater than 1 A/cm2 at an applied electric field lower than 3 MV/cm.
摘要翻译： 提供了一种用于制造用于电致发光（EL）应用的半导体纳米颗粒嵌入的Si绝缘膜的方法。 该方法提供底部电极，并且沉积半导体纳米颗粒嵌入的Si绝缘膜，其包括选自N和C组成的组的元素，覆盖在底部电极上。 在退火之后，形成半导体纳米颗粒嵌入的Si绝缘膜，其消光系数（k）在0.01〜1.0的范围内，在大约632纳米（nm）测量，电流密度（J）大于1安培 在施加的电场低于3MV / cm下的平方厘米（A / cm 2）。 在另一方面，被退火的半导体纳米颗粒嵌入的Si绝缘膜的折射率（n）在632nm处测量的范围为1.8-3.0，在施加的电场下的电流密度大于1A / cm 2 低于3 MV / cm。
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9.发明申请Fabrication of a Semiconductor Nanoparticle Embedded Insulating Film Electroluminescence Device 有权半导体纳米颗粒嵌入式绝缘膜电致发光器件的制造公开(公告)号：US20090115311A1
公开(公告)日：2009-05-07
申请号：US12187605
申请日：2008-08-07
CPC分类号： C23C16/30 , C23C16/24 , C23C16/401 , C23C16/402 , C23C16/505 , C23C16/56 , H01L21/0214 , H01L21/02274 , H01L21/02321 , H01L21/0234 , H01L21/02532 , H01L21/02601 , H01L21/0262 , H01L21/31608 , H01L33/18
摘要： A method is provided for fabricating a semiconductor nanoparticle embedded Si insulating film for electroluminescence (EL) applications. The method provides a bottom electrode, and deposits a semiconductor nanoparticle embedded Si insulating film, including an element selected from a group consisting of N and C, overlying the bottom electrode. After annealing, a semiconductor nanoparticle embedded Si insulating film is formed having an extinction coefficient (k) in a range of 0.01-1.0, as measured at about 632 nanometers (nm), and a current density (J) of greater than 1 Ampere per square centimeter (A/cm2) at an applied electric field lower than 3 MV/cm. In another aspect, the annealed semiconductor nanoparticle embedded Si insulating film has an index of refraction (n) in a range of 1.8-3.0, as measured at 632 nm, with a current density of greater than 1 A/cm2 at an applied electric field lower than 3 MV/cm.
摘要翻译： 提供了一种用于制造用于电致发光（EL）应用的半导体纳米颗粒嵌入的Si绝缘膜的方法。 该方法提供底部电极，并且沉积半导体纳米颗粒嵌入的Si绝缘膜，其包括选自N和C组成的组的元素，覆盖在底部电极上。 在退火之后，形成半导体纳米颗粒嵌入的Si绝缘膜，其消光系数（k）在0.01〜1.0的范围内，在大约632纳米（nm）测量，电流密度（J）大于1安培 在施加的电场低于3MV / cm下的平方厘米（A / cm 2）。 在另一方面，被退火的半导体纳米颗粒嵌入的Si绝缘膜的折射率（n）在632nm处测量的范围为1.8-3.0，在施加的电场下的电流密度大于1A / cm 2 低于3 MV / cm。
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10.发明授权Method of forming silicon nanocrystal embedded silicon oxide electroluminescence device with a mid-bandgap transition layer 有权形成具有中带隙过渡层的硅纳米晶体嵌入式氧化硅电致发光器件的方法公开(公告)号：US08133822B2
公开(公告)日：2012-03-13
申请号：US12197045
申请日：2008-08-22
IPC分类号： H01L21/324
CPC分类号： C23C16/30 , C23C16/24 , C23C16/401 , C23C16/505 , C23C16/56 , H01L21/02164 , H01L21/0217 , H01L21/02274 , H01L21/02532 , H01L21/02601 , H01L21/0262 , H01L21/31608
摘要： A method is provided for forming a silicon (Si) nanocrystal embedded Si oxide electroluminescence (EL) device with a mid-bandgap transition layer. The method provides a highly doped Si bottom electrode, and forms a mid-bandgap electrically insulating dielectric film overlying the electrode. A Si nanocrystal embedded SiOx film layer is formed overlying the mid-bandgap electrically insulating dielectric film, where X is less than 2, and a transparent top electrode overlies the Si nanocrystal embedded SiOx film layer. The bandgap of the mid-bandgap dielectric film is about half that of the bandgap of the Si nanocrystal embedded SiOx film. In one aspect, the Si nanocrystal embedded SiOx film has a bandgap (Eg) of about 10 electronvolts (eV) and mid-bandgap electrically insulating dielectric film has a bandgap of about 5 eV. By dividing the high-energy tunneling processes into two lower energy tunneling steps, potential damage due to high power hot electrons is reduced.
摘要翻译： 提供了一种用于形成具有中间带隙过渡层的硅（Si）纳米晶体嵌入式Si氧化物电致发光（EL）器件的方法。 该方法提供高度掺杂的Si底部电极，并且形成覆盖电极的中带隙电绝缘膜。 在其中X小于2的中间带隙绝缘电介质膜上形成Si纳米晶体嵌入的SiOx膜层，并且透明顶部电极覆盖在Si纳米晶体嵌入的SiOx膜层上。 中间带隙电介质膜的带隙约为Si纳米晶体嵌入的SiOx膜的带隙的一半。 在一个方面，Si纳米晶体嵌入的SiO x膜具有约10电子伏特（eV）的带隙（Eg），并且中带隙绝缘电介质膜具有约5eV的带隙。 通过将高能隧道工艺分成两个较低能量的隧穿步骤，由于大功率热电子引起的潜在损害降低。
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