摘要:
Embodiments provide bandwidth efficient mechanisms for delivering rich media content, such as webpages, to receiver devices via a multimedia broadcast network. Content, such as selected webpages, is broadcast as disassembled content elements via the broadcast network. To enable reception, the disassembled content elements are broadcast according to a broadcast schedule that is communicated in an overhead content description flow, such as a catalog file. Receiver devices receive the catalog file and use the metadata information to selectively receive disassembled content and store the content elements in memory. When a user requests access to the content (e.g., a webpage via a web browser), an application operating in the receiver device assembles the requested content from the previously received and stored disassembled content elements, and passes the assembled webpage to a using or rendering application.
摘要:
The techniques of this disclosure are applicable to backlight display devices. For such devices, the backlight may have different backlight intensity settings in order to promote power conservation. The techniques of this disclosure may apply different adjustments to the display, depending on the backlight intensity setting. In one example, different color correction matrices may be applied for different backlight settings in order to achieve desirable adjustments in the device at the different backlight settings. The adjustments described herein may address chrominance shifts due to different backlight settings as well as cross-talk between color channels. The techniques may also be applicable to organic light emitting diode (OLED) displays that have different luminance settings, and some described techniques may be applicable to displays that have static or fixed luminance output.
摘要:
Scaled transistors with reduced parasitic capacitance are formed by replacing a high-k dielectric sidewall spacer with a SiO2 or low-k dielectric sidewall spacer. Embodiments include transistors comprising a trench silicide layer spaced apart from a replacement metal gate electrode, and a layer of SiO2 or low-k material on a side surface of the replacement metal gate electrode facing the trench silicide layer. Implementing methodologies may include forming an intermediate structure comprising a removable gate with nitride spacers, removing the removable gate, forming a layer of high-k material on the nitride spacers, forming a layer of metal nitride on the high-k material, filling the opening with insulating material and then removing a portion thereof to form a recess, removing the metal nitride layers and layers of high-k material, depositing a layer of SiO2 or low-k material, and forming a replacement metal gate in the remaining recess.
摘要:
A semiconductor device including a germanium containing substrate including a gate structure on a channel region of the semiconductor substrate. The gate structure may include a silicon oxide layer that is in direct contact with an upper surface of the germanium containing substrate, at least one high-k gate dielectric layer in direct contact with the silicon oxide layer, and at least one gate conductor in direct contact with the high-k gate dielectric layer. The interface between the silicon oxide layer and the upper surface of the germanium containing substrate is substantially free of germanium oxide. A source region and a drain region may be present on opposing sides of the channel region.
摘要:
A method of forming a semiconductor device is disclosed. The method includes: forming a dielectric region on a substrate; annealing the dielectric region in an environment including ammonia (NH3); monitoring a nitrogen peak of at least one of the substrate and the dielectric region during the annealing; and adjusting a parameter of the environment based on the monitoring of the nitrogen peak.
摘要:
A method of fabricating a silicon-containing oxide layer that includes providing a chemical oxide layer on a surface of a semiconductor substrate, removing the chemical oxide layer in an oxygen-free environment at a temperature of 1000° C. or greater to provide a bare surface of the semiconductor substrate, and introducing an oxygen-containing gas at a flow rate to the bare surface of the semiconductor substrate for a first time period at the temperature of 1000° C. The temperature is then reduced to room temperature during a second time period while maintaining the flow rate of the oxygen containing gas to provide a silicon-containing oxide layer having a thickness ranging from 0.5 Å to 10 Å.
摘要:
The techniques of this disclosure are applicable to backlight display devices. For such devices, the backlight may have different backlight intensity settings in order to promote power conservation. The techniques of this disclosure may apply different adjustments to the display, depending on the backlight intensity setting. In one example, different color correction matrices may be applied for different backlight settings in order to achieve desirable adjustments in the device at the different backlight settings. The adjustments described herein may address chrominance shifts due to different backlight settings as well as cross-talk between color channels. The techniques may also be applicable to organic light emitting diode (OLED) displays that have different luminance settings, and some described techniques may be applicable to displays that have static or fixed luminance output.
摘要:
A method of forming a semiconductor device is disclosed. The method includes: forming a dielectric region on a substrate; annealing the dielectric region in an environment including ammonia (NH3); monitoring a nitrogen peak of at least one of the substrate and the dielectric region during the annealing; and adjusting a parameter of the environment based on the monitoring of the nitrogen peak.
摘要:
A method for vertically grounding and leading down form a center of a composite pole tower includes the following steps: extending a ground down-leading wire from a center of a ground wire cross arm which is made of metal and is positioned on top of the pole tower, wherein the ground down-leading wire is vertically leaded down to the earth form the center of the composite pole tower, wherein when an lower portion of the tower body is a metal pipe, the ground down-leading wire is extended from the center of the composite material and is directly connected to the metal pipe. The method utilizes the advantage of the insulating intensity of the wall of the composite pole tower and enhances the insulating intensity of the transmission line on impact of lightning. The ground down-leading wires are prevented from short-circuiting with the tower body of the composite pole tower, so that advantage of the insulating property of the composite material of the pole towers is realized. Since the ground down-leading wire is penetrated through center of the pole tower, so that the ground down-leading wires are not exposed and are prevented from destroying by external force. And also the method is easy and simple for application.
摘要:
A method for vertically grounding and leading down form an inner side of a composite pole tower and pole tower thereof, wherein the method includes the following steps: extending an upper metal cross arm from an extended line of at least one side of a ground wire cross arm which is made of metal, vertically leading down a ground down-leading wire from a distal end of the upper metal cross arm, connecting the ground down-leading wire to the pole tower via a lower metal cross arm at a distance under a lower lead, and grounding the ground down-leading wire along a tower body of the pole tower, wherein when an lower portion of the tower body is a metal pipe, the ground down-leading wire is selectively directly connected to the metal pipe via the lower metal cross arm. The upper metal cross arm and the lower cross arm are able to provide a distance between the ground down-leading wire and the pole tower. The method enhances the ability of bearing lightning flashover, increases the insulating intensity to lightning impact, and prevents burning to composite insulator by power-flow current after lightning flash over. And also the method is easy and simple for application.