公开(公告)号：US20190067205A1

公开(公告)日：2019-02-28

申请号：US15689967

申请日：2017-08-29

Applicant: QUALCOMM Incorporated

Inventor： David Fraser RAE ,  Hong Bok WE ,  Christopher HEALY ,  Chin-Kwan KIM

IPC: H01L23/552 ,  H01L23/13 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L21/3205 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/214 ,  H01L2924/00

Abstract: A package that includes an integrated device partially enclosed in a conductive material and embedded in a package substrate. The package includes a package substrate having a first cavity, the integrated device having a first active side and an inactive side embedded in the first cavity, and a structure partially enclosing the integrated device having a first layer and a second layer, wherein the first layer is coupled between the package substrate and the integrated device, and wherein the second layer is disposed over the inactive side of the integrated device.