公开(公告)号：US10002857B2

公开(公告)日：2018-06-19

申请号：US15225910

申请日：2016-08-02

Applicant: QUALCOMM Incorporated

Inventor： Michael James Solimando ,  William Stone ,  John Holmes ,  Christopher Healy ,  Rajendra Pendse ,  Sun Yun

IPC: H01L23/367 ,  H01L23/02 ,  H01L25/065 ,  H01L21/54 ,  H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L25/105 ,  H01L21/4882 ,  H01L21/54 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18162

Abstract: A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.

公开(公告)号：US10410971B2

公开(公告)日：2019-09-10

申请号：US15689967

申请日：2017-08-29

Applicant: QUALCOMM Incorporated

Inventor： David Fraser Rae ,  Hong Bok We ,  Christopher Healy ,  Chin-Kwan Kim

IPC: H01L23/13 ,  H01L23/552 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L21/3205 ,  H01L23/373 ,  H01L23/498 ,  H01L23/367

Abstract: A package that includes an integrated device partially enclosed in a conductive material and embedded in a package substrate. The package includes a package substrate having a first cavity, the integrated device having a first active side and an inactive side embedded in the first cavity, and a structure partially enclosing the integrated device having a first layer and a second layer, wherein the first layer is coupled between the package substrate and the integrated device, and wherein the second layer is disposed over the inactive side of the integrated device.

公开(公告)号：US20170294422A1

公开(公告)日：2017-10-12

申请号：US15225910

申请日：2016-08-02

Applicant: QUALCOMM Incorporated

Inventor： Michael James Solimando ,  William Stone ,  John Holmes ,  Christopher Healy ,  Rajendra Pendse ,  Sun Yun

IPC: H01L25/10 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L21/4882 ,  H01L21/54 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18162

Abstract: A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.