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公开(公告)号：US20140144681A1
公开(公告)日：2014-05-29
申请号：US13686620
申请日：2012-11-27
发明人： Victor Louis Arockiaraj Pushparaj , Ravindra V. Shenoy , Jon Bradley Lasiter , Kwan-Yu Lai , Donald William Kidwell , Ana Rangelova Londergan
CPC分类号： H05K1/162 , B32B3/266 , B32B3/30 , B32B7/12 , C03C17/3435 , C03C17/3626 , C03C17/3639 , C03C17/3649 , C03C17/3655 , C03C17/3671 , C03C17/3697 , C23C16/045 , C23C16/34 , C23C16/45525 , C23C28/322 , C23C28/34 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L28/75 , H01L28/91 , H01L2924/0002 , Y10T428/24322 , Y10T428/24545 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for an adhesive metal nitride layer on glass. In one aspect, a glass substrate having a surface is provided. A via with a depth to width aspect ratio of 5 to 1 or greater extends at least partially through the glass substrate. An adhesive metal nitride layer is disposed on the surface of the glass substrate and on one or more interior surfaces of the via. The adhesive metal nitride layer includes at least one of titanium nitride and tantalum nitride.
摘要翻译： 本公开提供了用于玻璃上的粘合性金属氮化物层的系统，方法和装置。 一方面，提供具有表面的玻璃基板。 深度与宽度纵横比为5至1或更大的通孔至少部分延伸穿过玻璃基底。 粘合金属氮化物层设置在玻璃基板的表面上和通孔的一个或多个内表面上。 粘合性金属氮化物层包括氮化钛和氮化钽中的至少一种。
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公开(公告)号：US20140104284A1
公开(公告)日：2014-04-17
申请号：US13653132
申请日：2012-10-16
发明人： Ravindra V. Shenoy , Jitae Kim , Kwan-yu Lai , Jon Bradley Lasiter , Philip Jason Stephanou , Donald William Kidwell , Evgeni Petrovich Gousev
CPC分类号： H01F27/06 , G09G3/3466 , G09G5/00 , H01F17/0033 , H01F21/00 , H01F41/005 , H01F41/041 , H01F41/046 , Y10T29/49165 , Y10T156/1057
摘要： This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized.
摘要翻译： 本公开提供了用于通过基板通孔电感器的系统，方法和装置。 在一个方面，空腔被限定在玻璃基板中。 在空腔中至少有两个金属棒。 每个金属棒的第一端靠近衬底的第一表面，并且每个金属棒的第二端靠近衬底的第二表面。 金属迹线连接第一金属棒和第二金属棒。 在一些情况下，可以在衬底的表面上设置一个或多个电介质层。 在一些情况下，金属棒和金属迹线限定电感器。 电感器可以具有对应于可变电感的一定程度的灵活性。 金属线圈可以以螺线管或环形配置布置。 环形电感器可以具有锥形迹线和/或热接地平面。 可以实现变压器和谐振器电路。
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公开(公告)号：US09190208B2
公开(公告)日：2015-11-17
申请号：US14523258
申请日：2014-10-24
发明人： Jon Bradley Lasiter , Ravindra V. Shenoy , Donald William Kidwell , Victor Louis Arockiaraj Pushparaj , Kwan-yu Lai , Ana Rangelova Londergan
IPC分类号： G06F3/044 , H01G4/06 , H01L23/498 , H01L27/12 , H01L49/02 , H01L23/15 , H01G4/008 , H01G4/30 , H05K1/03 , H05K1/11 , H05K1/18 , G02B26/00 , H01L23/00
CPC分类号： H01G4/06 , G02B26/001 , H01G4/008 , H01G4/30 , H01L23/15 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L27/12 , H01L28/60 , H01L28/90 , H01L2224/131 , H01L2224/16225 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1461 , H01L2924/15311 , H05K1/0306 , H05K1/115 , H05K1/182 , Y10T29/49124 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods, and apparatus for metal-insulator-metal capacitors on glass substrates. In one aspect, an apparatus may include a glass substrate, with the glass substrate defining at least one via in the glass substrate. A first electrode layer may be disposed over surfaces of the glass substrate, including surfaces of the at least one via. A dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the dielectric layer, with the dielectric layer electrically isolating the first electrode layer from the second electrode layer.
摘要翻译： 本公开提供了用于玻璃基板上的金属 - 绝缘体 - 金属电容器的系统，方法和装置。 一方面，装置可以包括玻璃基板，玻璃基板在玻璃基板中限定至少一个通孔。 第一电极层可以设置在玻璃基板的表面上，包括至少一个通孔的表面。 电介质层可以设置在第一电极层上。 第二电极层可以设置在电介质层上，其中电介质层将第一电极层与第二电极层电隔离。
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公开(公告)号：US20150041189A1
公开(公告)日：2015-02-12
申请号：US14523258
申请日：2014-10-24
发明人： Jon Bradley Lasiter , Ravindra V. Shenoy , Donald William Kidwell , Victor Louis Arockiaraj Pushparaj , Kwan-yu Lai , Ana Rangelova Londergan
CPC分类号： H01G4/06 , G02B26/001 , H01G4/008 , H01G4/30 , H01L23/15 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L27/12 , H01L28/60 , H01L28/90 , H01L2224/131 , H01L2224/16225 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1461 , H01L2924/15311 , H05K1/0306 , H05K1/115 , H05K1/182 , Y10T29/49124 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods, and apparatus for metal-insulator-metal capacitors on glass substrates. In one aspect, an apparatus may include a glass substrate, with the glass substrate defining at least one via in the glass substrate. A first electrode layer may be disposed over surfaces of the glass substrate, including surfaces of the at least one via. A dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the dielectric layer, with the dielectric layer electrically isolating the first electrode layer from the second electrode layer.
摘要翻译： 本公开提供了用于玻璃基板上的金属 - 绝缘体 - 金属电容器的系统，方法和装置。 一方面，装置可以包括玻璃基板，玻璃基板在玻璃基板中限定至少一个通孔。 第一电极层可以设置在玻璃基板的表面上，包括至少一个通孔的表面。 电介质层可以设置在第一电极层上。 第二电极层可以设置在电介质层上，其中电介质层将第一电极层与第二电极层电隔离。
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公开(公告)号：US20140104288A1
公开(公告)日：2014-04-17
申请号：US13682337
申请日：2012-11-20
发明人： Ravindra V. Shenoy , Jitae Kim , Kwan-yu Lai , Jon Bradley Lasiter , Philip Jason Stephanou , Donald William Kidwell , Evgeni Petrovich Gousev
CPC分类号： H01F27/06 , G09G3/3466 , G09G5/00 , H01F17/0033 , H01F21/00 , H01F41/005 , H01F41/041 , H01F41/046 , Y10T29/49165 , Y10T156/1057
摘要： This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized.
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