Abstract:
Memory devices, modules, controllers, systems and associated methods are disclosed. In one embodiment, a dynamic random access memory (DRAM) device is disclosed. The DRAM device includes memory core circuitry including an array of DRAM storage cells organized into bank groups. Each bank group includes multiple banks, where each of the multiple banks includes addressable columns of DRAM storage cells. The DRAM device includes signal interface circuitry having dedicated write data path circuitry and dedicated read data path circuitry. Selector circuitry, for a first memory transaction, selectively couples at least one of the addressable columns of DRAM storage cells to the dedicated read data path circuitry or the dedicated write data path circuitry.
Abstract:
A nonvolatile memory device that uses pulsed control and rest periods to mitigate the formation of defect precursors. A first embodiment uses pulsed bitline control, where the coupling between a memory cell channel and a reference voltage is pulsed when it is desired to change state in the associated memory cell. Each pulse may be chosen to be less than about 20 nanoseconds, while a “rest period” between pulses can be on the order of about a hundred nanoseconds or greater. Because bitline control is used, very short rise times can be enabled, enabling generation of pulse durations of 50 nanoseconds or less. In other embodiments, these methods may also be more generally applied to other conductors (e.g., wordline or substrate well, for program or erase operations); segmented wordlines or bitlines may also be used, to minimize RC loading and enable sufficiently short rise times to make pulses robust.
Abstract:
A memory storage scheme specially adapted for wear leveling (or other reorganization of logical memory space). Memory space includes a logical memory space of M addressable blocks of data, stored as rows or pages, and N substitute rows or pages. Data is periodically shuffled by copying data from one of the M addressable blocks to a substitute row, with the donating row then becoming part of substitute memory space, available for ensuing wear leveling operations, using a stride address. The disclosed techniques enable equation-based address translation, obviating need for an address translation table. An embodiment performs address translation entirely in hardware, for example, integrated with a memory device to perform wear leveling or data scrambling, in a manner entirely transparent to a memory controller. In addition, the stride address can represent an offset greater than one (e.g., greater than one row) and can be dynamically varied.
Abstract:
A content addressable memory can include an array of memory cells having multiple memory elements, such as RRAM elements, to store data based on a plurality resistive states. A common switching device, such as a transistor, can electrically couple a plurality of the multiple memory elements with a matchline during read, write, erase, and search operations. In search operations, the memory cells can receive a search word and selectively discharge a voltage level on the matchline based on the data stored by the memory elements and the search word provided to the memory elements. The voltage level of the matchline can indicate whether the search word matched the data stored in the memory cells. The content addressable memory can potentially have an effective memory cell sizing under 0.5F2 depending on the number of layers of memory cells formed over the switching device.
Abstract:
A memory module includes one or more memory devices and a memory interface chip coupled to the one or more memory devices via one or more communication links. The memory module further includes a persistent memory storing one or more sets of training and calibration settings corresponding to communication over the one or more communication links, where the one or more sets of training and calibration settings are stored in the persistent memory before operation of the memory module and used to configure one or more components of the memory interface chip during the operation of the memory module.
Abstract:
A memory module includes one or more memory devices and a memory interface chip coupled to the one or more memory devices via one or more communication links. The memory module further includes a persistent memory storing one or more sets of training and calibration settings corresponding to communication over the one or more communication links, where the one or more sets of training and calibration settings are stored in the persistent memory before operation of the memory module and used to configure one or more components of the memory interface chip during the operation of the memory module.
Abstract:
A memory component includes a first memory bank. The first memory bank has a plurality of sub-arrays having sub-rows of memory elements. The memory component includes a write driver, coupled to the first memory bank, to perform a write operation of an entire sub-row of a sub-array. To perform the write operation, the write driver is to load a burst of write data to the memory bank. The memory bank may then activate a plurality of sense amplifiers associated with a plurality of memory elements of the entire sub-row to load the burst of write data to the plurality of sense amplifiers.
Abstract:
A method of operating a memory device that includes groups of memory cells is presented. The groups include a first group of memory cells. Each one of the groups has a respective physical address and is initially associated with a respective logical address. The device also includes an additional group of memory cells that has a physical address but is not initially associated with a logical address. In the method, a difference in the future endurance between the first group of memory cells and the additional group of memory cells is identified. When the difference in the future endurance between the first group and the additional group exceeds a predetermined threshold difference, the association between the first group and the logical address initially associated with the first group is ended and the additional group is associated with the logical address that was initially associated with the first group.
Abstract:
A ternary content-addressable memory (TCAM) array of cells features reduced area and improved matching functionality. 1T-3R and 2T-3R embodiments are disclosed as illustrative. A row or block of TCAM memory cells may include a serial string interconnecting the cells so as to provide reduced power consumption during matching operations. In other aspects, Pre-charge/Discharge logic configurations are described utilizing complementary resistive ram (cRRAM) storage for input data to form improved programmable logic circuits.
Abstract:
A resistive RAM device includes a bit line, a word line, an RRAM cell coupled to the word line and to the bit line, a write driver and a disable circuit. The write driver is coupled to the bit line. The disable circuit stops a write operation performed by the write driver on a respective RRAM cell when a predefined condition on the bit line is achieved. The predefined condition depends on a mode of operation of the RRAM cell.