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公开(公告)号：US11089687B2
公开(公告)日：2021-08-10
申请号：US16287260
申请日：2019-02-27
申请人： RAYTHEON COMPANY
发明人： Jonathan E. Nufio-Molina , Thomas V. Sikina , James E. Benedict , Andrew R. Southworth , Semira M. Azadzoi
摘要： A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.
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公开(公告)号：US20190269007A1
公开(公告)日：2019-08-29
申请号：US16287240
申请日：2019-02-27
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , James E. Benedict , John P. Haven , Andrew R. Southworth , Semira M. Azadzoi
摘要： A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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公开(公告)号：US20210059043A1
公开(公告)日：2021-02-25
申请号：US17091585
申请日：2020-11-06
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , James E. Benedict , John P. Haven , Andrew R. Southworth , Semira M. Azadzoi
摘要： A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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公开(公告)号：US11375609B2
公开(公告)日：2022-06-28
申请号：US17091585
申请日：2020-11-06
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , James E. Benedict , John P. Haven , Andrew R. Southworth , Semira M. Azadzoi
摘要： A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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公开(公告)号：US10813210B2
公开(公告)日：2020-10-20
申请号：US16184571
申请日：2018-11-08
申请人： RAYTHEON COMPANY
发明人： Semira M. Azadzoi , James E. Benedict , John P. Haven , Thomas V. Sikina , Andrew R. Southworth
摘要： A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
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公开(公告)号：US20190269021A1
公开(公告)日：2019-08-29
申请号：US16287260
申请日：2019-02-27
申请人： RAYTHEON COMPANY
发明人： Jonathan E. Nufio-Molina , Thomas V. Sikina , James E. Benedict , Andrew R. Southworth , Semira M. Azadzoi
摘要： A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.
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7.发明申请公开(公告)号：US20190150271A1
公开(公告)日：2019-05-16
申请号：US16184571
申请日：2018-11-08
申请人： RAYTHEON COMPANY
发明人： Semira M. Azadzoi , James E. Benedict , John P. Haven , Thomas V. Sikina , Andrew R. Southworth
CPC分类号： H05K1/0218 , H01P3/08 , H01P11/003 , H05K1/0219 , H05K1/0221 , H05K1/0251 , H05K1/112 , H05K3/0044 , H05K3/107 , H05K3/4007 , H05K3/4038 , H05K3/4611 , H05K2201/0707 , H05K2201/09036 , H05K2201/09545 , H05K2203/0228
摘要： A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
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