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公开(公告)号：US20240321811A1
公开(公告)日：2024-09-26
申请号：US18671652
申请日：2024-05-22
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Kohei TANIKAWA , Ryosuke FUKUDA
IPC: H01L23/00 , H01L21/56 , H01L23/31 , H01L23/498 , H01L25/07
CPC classification number: H01L24/40 , H01L21/565 , H01L23/3121 , H01L23/49844 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29575 , H01L2224/32245 , H01L2224/40095 , H01L2224/40101 , H01L2224/40139 , H01L2224/40245 , H01L2224/73263 , H01L2224/8383 , H01L2924/13091 , H01L2924/30107 , H01L2924/35121
Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion. The semiconductor module further includes: a first conducting member connected to the first semiconductor elements and second conductive portion; and a second conducting member connected to the second semiconductor elements and second input terminal.
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公开(公告)号：US20240234380A9
公开(公告)日：2024-07-11
申请号：US18399105
申请日：2023-12-28
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Masashi HAYASHIGUCHI
CPC classification number: H01L25/07 , H01L23/36 , H01L23/488 , H01L24/06 , H01L24/49 , H01L25/18 , H02M7/48 , H01L2224/0603 , H01L2224/4903 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2924/13055
Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.
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公开(公告)号：US20240136335A1
公开(公告)日：2024-04-25
申请号：US18399105
申请日：2023-12-28
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Masashi HAYASHIGUCHI
CPC classification number: H01L25/07 , H01L23/36 , H01L23/488 , H01L24/06 , H01L24/49 , H01L25/18 , H02M7/48 , H01L2224/0603 , H01L2224/4903 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2924/13055
Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.
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公开(公告)号：US20230245959A1
公开(公告)日：2023-08-03
申请号：US18002592
申请日：2021-06-23
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Takumi KANDA , Noriaki KAWAMOTO
IPC: H01L23/495 , H01L23/31 , H01L23/00
CPC classification number: H01L23/49575 , H01L23/49513 , H01L23/3107 , H01L24/48 , H01L24/40 , H01L2224/48175 , H01L2224/40175
Abstract: A semiconductor device includes a first die pad having a main surface, a second die pad having a second main surface, a first switching element connected to the first main surface, a second switching element connected to the second main surface, a first connecting member connecting the first main surface electrode of the first switching element to the second die pad, an encapsulation resin encapsulating the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member, and leads projecting out of one of the resin side surfaces of the encapsulation resin.
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5.发明申请公开(公告)号：US20180286845A1
公开(公告)日：2018-10-04
申请号：US15997321
申请日：2018-06-04
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Akihiro SUZAKI
IPC: H01L25/18 , H01L25/07 , H01L23/31 , H01L23/36 , H01L29/739
Abstract: A semiconductor device according to the present invention incudes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.
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Patent Agency Ranking
公开(公告)号：US20170069613A1
公开(公告)日：2017-03-09
申请号：US15122590
申请日：2015-03-04
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Akihiro SUZAKI
IPC: H01L25/18 , H01L29/739 , H01L23/36
CPC classification number: H01L25/18 , H01L23/3107 , H01L23/3121 , H01L23/36 , H01L23/4334 , H01L23/495 , H01L24/75 , H01L24/83 , H01L25/07 , H01L29/7393 , H01L2224/04026 , H01L2224/04042 , H01L2224/06181 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/32245 , H01L2224/33 , H01L2224/33181 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/92247 , H01L2924/1203 , H01L2924/13055 , H01L2924/00012 , H01L2924/014 , H01L2924/00014
Abstract: A semiconductor device according to the present invention includes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.
Abstract translation: 根据本发明的半导体器件包括半导体芯片，用于支撑半导体芯片的导电构件，设置在导电构件和半导体芯片之间的接合材料，以及形成在导电构件的表面上的释放槽， 从半导体芯片分别与释放槽的一端和另一端连接到导电构件的周边边缘。
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公开(公告)号：US20230411339A1
公开(公告)日：2023-12-21
申请号：US18457856
申请日：2023-08-29
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Kohei TANIKAWA , Ryosuke FUKUDA
IPC: H01L23/00 , H01L25/07 , H01L21/56 , H01L23/498 , H01L23/31
CPC classification number: H01L24/40 , H01L25/072 , H01L24/29 , H01L21/565 , H01L23/49844 , H01L23/49861 , H01L24/83 , H01L24/32 , H01L23/3121 , H01L24/73 , H01L2224/40245 , H01L2224/32245 , H01L2224/73263 , H01L2224/40101 , H01L2224/29575 , H01L2224/8383 , H01L2924/13091 , H01L2224/40095 , H01L2924/35121 , H01L2224/40139 , H01L2924/30107
Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion. The semiconductor module further includes: a first conducting member connected to the first semiconductor elements and second conductive portion; and a second conducting member connected to the second semiconductor elements and second input terminal.
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公开(公告)号：US20230402421A1
公开(公告)日：2023-12-14
申请号：US18457841
申请日：2023-08-29
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Kohei TANIKAWA , Ryosuke FUKUDA
IPC: H01L23/00 , H01L25/07 , H01L21/56 , H01L23/498 , H01L23/31
CPC classification number: H01L24/40 , H01L25/072 , H01L24/29 , H01L21/565 , H01L23/49844 , H01L23/49861 , H01L24/83 , H01L24/32 , H01L23/3121 , H01L24/73 , H01L2224/40245 , H01L2224/32245 , H01L2224/73263 , H01L2224/40101 , H01L2224/29575 , H01L2224/8383 , H01L2924/13091 , H01L2224/40095 , H01L2924/35121 , H01L2224/40139 , H01L2924/30107
Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion. The semiconductor module further includes: a first conducting member connected to the first semiconductor elements and second conductive portion; and a second conducting member connected to the second semiconductor elements and second input terminal.
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公开(公告)号：US20230307411A1
公开(公告)日：2023-09-28
申请号：US18005048
申请日：2021-09-27
Applicant: ROHM CO., LTD.
Inventor： Kenji HAYASHI , Kohei TANIKAWA , Ryosuke FUKUDA
IPC: H01L23/00 , H01L23/31 , H01L21/56 , H01L25/07 , H01L23/498
CPC classification number: H01L24/40 , H01L21/565 , H01L23/3121 , H01L23/49844 , H01L23/49861 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29575 , H01L2224/32245 , H01L2224/40095 , H01L2224/40101 , H01L2224/40139 , H01L2224/40245 , H01L2224/73263 , H01L2224/8383 , H01L2924/13091 , H01L2924/30107 , H01L2924/35121
Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion. The semiconductor module further includes: a first conducting member connected to the first semiconductor elements and second conductive portion; and a second conducting member connected to the second semiconductor elements and second input terminal.
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公开(公告)号：US20230245961A1
公开(公告)日：2023-08-03
申请号：US18011798
申请日：2021-09-14
Applicant: ROHM CO., LTD.
Inventor： Kohei TANIKAWA , Kenji HAYASHI , Ryosuke FUKUDA
IPC: H01L23/495 , H01L23/00 , H01L23/31
CPC classification number: H01L23/49575 , H01L24/18 , H01L24/48 , H01L23/3121 , H01L2224/48247 , H01L2924/182
Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.
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