公开(公告)号：US20250006621A1

公开(公告)日：2025-01-02

申请号：US18883587

申请日：2024-09-12

Applicant: Rohm Co., Ltd.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

Abstract: An electronic device includes: an electronic component; a sealing resin covering the electronic component; a first lead including a first inner portion and a first outer portion; a second lead including a second inner portion and a second outer portion; and a wire including a bonding segment secured to the first inner portion and a bonding segment secured to the second inner portion. The first inner portion is located inside a peripheral edge of the sealing resin as viewed in a thickness direction z, except at a first boundary with the first outer portion. The second inner portion is located inside the peripheral edge of the sealing resin as viewed in the thickness direction z, except at a second boundary with the second outer portion. As viewed in the thickness direction z, the wire has a length that is at least 25% of an average of a distance from the first boundary to the bonding segment secured to the first inner portion and a distance from the second boundary to the bonding segment secured to the second inner portion.

公开(公告)号：US20230170326A1

公开(公告)日：2023-06-01

申请号：US18159576

申请日：2023-01-25

Applicant: ROHM CO., LTD.

Inventor： Tomohira KIKUCHI

IPC: H01L25/065 ,  H01L23/495 ,  H01L23/522 ,  H01L23/544 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L23/49575 ,  H01L23/5227 ,  H01L23/544 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L23/3107

Abstract: A semiconductor device includes a conductive support member, a control element, an insulating element, a driver element and a sealing resin. The conductive support member includes a first lead and a second lead. The first lead has a first pad portion. The second lead has a second pad portion. The second pad portion is adjacent to the first pad portion in a first direction perpendicular to a thickness direction of the first pad portion. The control element is mounted on the first pad portion. The insulating element is mounted on the first pad portion and electrically connected to the control element. The driver element is mounted on the second pad portion and electrically connected to the insulating element. The sealing resin covers the first pad portion, the second pad portion, the control element, the insulating element and the driver element. As viewed in the thickness direction, the first pad portion has a first edge adjacent to the second pad portion in the first direction and extending in a second direction perpendicular to the thickness direction and the first direction. The first edge has a first end and a second end opposite in the second direction. As viewed in the thickness direction, the second pad portion has a second edge adjacent to the first edge in the first direction and extending in the second direction. The second edge has a third end and a fourth end opposite in the second direction. One of the third end and the fourth end is located between the first end and the second end in the second direction.

公开(公告)号：US20240047438A1

公开(公告)日：2024-02-08

申请号：US18267455

申请日：2021-11-22

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Taro NISHIOKA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI ,  Ryohei UMENO

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L23/3107 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/46 ,  H01L2224/48195 ,  H01L2224/48245 ,  H01L2224/48991 ,  H01L2224/48455 ,  H01L2924/19042 ,  H01L2924/3512

Abstract: A semiconductor device includes first and second semiconductor elements, and first and second circuits at different potentials. The second semiconductor element, electrically connected to the first semiconductor element, relays mutual signals between the first and the second circuits, while insulating them. The semiconductor device further includes a first terminal lead electrically connected to the first semiconductor element, a first wire connected to the first and the second semiconductor elements, and a second wire connected to the first semiconductor element and the first terminal lead. The first wire contains a first metal. The second wire includes a first core containing a second metal, and a first surface layer containing a third metal and covering the first core. The second metal has a smaller atomic number than that of the first metal. The third metal has a greater bonding strength with respect to the first terminal lead than the second metal.

公开(公告)号：US20230335529A1

公开(公告)日：2023-10-19

申请号：US18340346

申请日：2023-06-23

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Taro NISHIOKA ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/48 ,  H01L23/49562 ,  H01L23/4952 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/48137 ,  H01L2924/13091 ,  H01L2924/13055 ,  H01L2224/32245 ,  H01L2224/73265

Abstract: A semiconductor device includes: a semiconductor element; an island lead on which the semiconductor element is mounted; a terminal lead electrically connected to the semiconductor element; a wire connected to the semiconductor element and the terminal lead; and a sealing resin covering the semiconductor element, the island lead, the terminal lead, and the wire. The terminal lead includes a base member having an obverse surface facing in a thickness direction of the terminal lead, and a metal layer located between the obverse surface and the wire. The base member has a greater bonding strength with respect to the sealing resin than the metal layer. The obverse surface includes an opposing side facing the island lead. The obverse surface includes a first portion that includes at least a portion of the opposing side and that is exposed from the metal layer.

公开(公告)号：US20220068776A1

公开(公告)日：2022-03-03

申请号：US17454576

申请日：2021-11-11

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Taro NISHIOKA ,  Tomohira KIKUCHI ,  Tsunehisa ONO

IPC: H01L23/495 ,  H01L25/07 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor device includes a first semiconductor chip and a second semiconductor chip to which different power-supply voltages are supplied, connection bonding wires connecting the first semiconductor chip and the second semiconductor chip to each other, and a sealing resin provided to fill a gap between a first lead frame on which the first semiconductor chip is mounted and a second lead frame on which the second semiconductor chip is mounted so as to cover the respective circumferences of the first semiconductor chip and the second semiconductor chip. The respective surfaces of the first lead frame and the second lead frame in the regions opposed to each other are covered with an insulating protection film including a material having higher electrical breakdown voltage than a material included in the sealing resin.

公开(公告)号：US20240112995A1

公开(公告)日：2024-04-04

申请号：US18256150

申请日：2021-11-29

Applicant: ROHM CO., LTD.

Inventor： Moe YAMAGUCHI ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Ryohei UMENO ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49558 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/73265

Abstract: A semiconductor device includes a first die pad with a first obverse surface facing in z direction, a second die pad spaced from the first die pad and including a second obverse surface facing in z direction, a first semiconductor element on the first obverse surface, a second semiconductor element on the second obverse surface, an insulating element on the first or second obverse surface and located between the first and second semiconductor elements in x direction to relay signals between the first and second semiconductor elements while electrically insulating these semiconductor elements, and a wire bonded to the first semiconductor element and the first obverse surface. The first die pad includes a first bond portion bonded to the wire, and a first opening located between the first bond portion and the first semiconductor element in y direction and including an opening end in the first obverse surface.

公开(公告)号：US20240030212A1

公开(公告)日：2024-01-25

申请号：US18352759

申请日：2023-07-14

Applicant: ROHM CO., LTD.

Inventor： Tomohira KIKUCHI ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Moe YAMAGUCHI ,  Ryohei UMENO

IPC: H01L25/18 ,  H01L23/495 ,  H01L25/16 ,  H01L23/31

CPC classification number: H01L25/18 ,  H01L23/49575 ,  H01L25/16 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/48

Abstract: A semiconductor device includes a semiconductor control element, a first drive element, a second drive element and a first insulating element. The first drive element is spaced apart from the semiconductor control element in a first direction orthogonal to a thickness direction of the semiconductor control element and receives a signal transmitted from the semiconductor control element. The second drive element is spaced apart from the first drive element in a second direction orthogonal to the thickness direction and the first direction and receives a signal transmitted from the semiconductor control element. The first insulating element is located between the semiconductor control element and the first drive element in the first direction. The first insulating element relays a signal transmitted from the semiconductor control element to the first drive element and provides electrical insulation between the semiconductor control element and the first drive element.

公开(公告)号：US20220102252A1

公开(公告)日：2022-03-31

申请号：US17468111

申请日：2021-09-07

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

Abstract: There is provided a semiconductor device including: a conductive support including a first die pad and a second die pad having a potential different from a potential of the first die pad; a first semiconductor element mounted on the first die pad; a second semiconductor element mounted on the second die pad; and a sealing resin that covers the first semiconductor element, the second semiconductor element, and at least a portion of the conductive support.

公开(公告)号：US20240282748A1

公开(公告)日：2024-08-22

申请号：US18651159

申请日：2024-04-30

Applicant: ROHM CO., LTD.

Inventor： Tomohira KIKUCHI

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/522 ,  H01L23/544

CPC classification number: H01L25/0655 ,  H01L23/49575 ,  H01L23/5227 ,  H01L23/544 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L23/3107 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/73265

Abstract: A semiconductor device includes a conductive support member, a control element, an insulating element, a driver element and a sealing resin. The conductive support member includes a first lead and a second lead. The first lead has a first pad portion. The second lead has a second pad portion. The second pad portion is adjacent to the first pad portion in a first direction perpendicular to a thickness direction of the first pad portion. The control element is mounted on the first pad portion. The insulating element is mounted on the first pad portion and electrically connected to the control element. The driver element is mounted on the second pad portion and electrically connected to the insulating element. The sealing resin covers the first pad portion, the second pad portion, the control element, the insulating element and the driver element. As viewed in the thickness direction, the first pad portion has a first edge adjacent to the second pad portion in the first direction and extending in a second direction perpendicular to the thickness direction and the first direction. The first edge has a first end and a second end opposite in the second direction. As viewed in the thickness direction, the second pad portion has a second edge adjacent to the first edge in the first direction and extending in the second direction. The second edge has a third end and a fourth end opposite in the second direction. One of the third end and the fourth end is located between the first end and the second end in the second direction.

公开(公告)号：US20240030105A1

公开(公告)日：2024-01-25

申请号：US18480233

申请日：2023-10-03

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Yasushi HAMAZAWA ,  Tomohira KIKUCHI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49503 ,  H01L23/49575 ,  H01L23/3135 ,  H01L24/48 ,  H01L23/49541 ,  H01L2224/48175

Abstract: A semiconductor device includes: a first die pad; a second die pad; a first semiconductor element on the first die pad; a second semiconductor element on the second die pad; an insulating element electrically connected to the first semiconductor element and the second semiconductor element and electrically insulating the first and second semiconductor elements from each other; a sealing resin covering the first semiconductor element, the second semiconductor element and the insulating element; and a support member on which the insulating element is mounted, where the support member includes an insulating portion containing a resin. The first die pad and the second die pad are spaced apart from each other in a first direction orthogonal to a thickness direction of the first semiconductor element. The support member is supported by at least one of the first die pad, the second die pad and the sealing resin.