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公开(公告)号:US20110315779A1
公开(公告)日:2011-12-29
申请号:US13171421
申请日:2011-06-28
申请人: Rahamat Bidin , Hao LIU
发明人: Rahamat Bidin , Hao LIU
IPC分类号: G06K19/077 , H01L21/56
CPC分类号: G06K19/07745 , H01L23/3121 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2223/6677 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2924/00014 , H01L2924/07802 , H01L2924/181 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A SIM card is presented. The SIM card includes a support carrier having a first and a second major surface. The support carrier includes a cavity which extends partially into the carrier from the first major surface. The SIM card further includes a chip package disposed within the cavity. The support carrier is sufficiently flexible to bend when the SIM card is being inserted into or removed from a SIM card holder.
摘要翻译: 提供SIM卡。 SIM卡包括具有第一和第二主表面的支撑载体。 支撑载体包括从第一主表面部分地延伸到载体中的空腔。 SIM卡还包括设置在腔内的芯片封装。 当SIM卡被插入或从SIM卡夹持器移除时,支撑托架足够弯曲。
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公开(公告)号:US20080150103A1
公开(公告)日:2008-06-26
申请号:US11662431
申请日:2005-09-09
申请人: Chuen Khiang Wang , Hao Liu , Hien Boon Tan , Clifton Teik Lyk Law , Rahamat Bidin , Anthony Yi Shen Sun
发明人: Chuen Khiang Wang , Hao Liu , Hien Boon Tan , Clifton Teik Lyk Law , Rahamat Bidin , Anthony Yi Shen Sun
IPC分类号: H01L23/495 , H01L21/58
CPC分类号: H01L23/49575 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49 , H01L2224/73215 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.
摘要翻译: 公开了一种用于制造集成电路封装的方法和一种多芯片集成电路封装。 根据该方法,将第一管芯附接到引线框架的一组引线的第一侧上,并且在与第一侧相对的第二侧将粘合剂施加到引线组上。 第二个模具附着在粘合剂上。 粘合剂填充到由一组引线限定的间隙中。 之后固化粘合剂。 在根据该方法制造的多芯片集成电路封装中,附着第二模具的粘合剂填充引线之间的间隙,从而避免形成封装的内部空腔。
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公开(公告)号:US08544755B2
公开(公告)日:2013-10-01
申请号:US13171421
申请日:2011-06-28
申请人: Rahamat Bidin , Hao Liu
发明人: Rahamat Bidin , Hao Liu
IPC分类号: G06K19/06
CPC分类号: G06K19/07745 , H01L23/3121 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2223/6677 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2924/00014 , H01L2924/07802 , H01L2924/181 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A SIM card is presented. The SIM card includes a support carrier having a first and a second major surface. The support carrier includes a cavity which extends partially into the carrier from the first major surface. The SIM card further includes a chip package disposed within the cavity. The support carrier is sufficiently flexible to bend when the SIM card is being inserted into or removed from a SIM card holder.
摘要翻译: 提供SIM卡。 SIM卡包括具有第一和第二主表面的支撑载体。 支撑载体包括从第一主表面部分地延伸到载体中的空腔。 SIM卡还包括设置在腔内的芯片封装。 当SIM卡被插入或从SIM卡夹持器移除时,支撑托架足够弯曲。
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公开(公告)号:US07816775B2
公开(公告)日:2010-10-19
申请号:US11662431
申请日:2005-09-09
申请人: Chuen Khiang Wang , Hao Liu , Hien Boon Tan , Clifton Teik Lyk Law , Rahamat Bidin , Anthony Yi Sheng Sun
发明人: Chuen Khiang Wang , Hao Liu , Hien Boon Tan , Clifton Teik Lyk Law , Rahamat Bidin , Anthony Yi Sheng Sun
IPC分类号: H01L23/02
CPC分类号: H01L23/49575 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49 , H01L2224/73215 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.
摘要翻译: 公开了一种用于制造集成电路封装的方法和一种多芯片集成电路封装。 根据该方法,将第一管芯附接到引线框架的一组引线的第一侧上,并且在与第一侧相对的第二侧将粘合剂施加到引线组上。 第二个模具附着在粘合剂上。 粘合剂填充到由一组引线限定的间隙中。 之后固化粘合剂。 在根据该方法制造的多芯片集成电路封装中,附着第二模具的粘合剂填充引线之间的间隙,从而避免形成封装的内部空腔。
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公开(公告)号:US20080290509A1
公开(公告)日:2008-11-27
申请号:US10581395
申请日:2004-12-02
申请人: Hien Boon Tan , Chuen Khiang Wang , Rahamat Bidin , Anthony Yi Sheng Sun , Desmond Yok Rue Chong , Ravi Kanth Kolan
发明人: Hien Boon Tan , Chuen Khiang Wang , Rahamat Bidin , Anthony Yi Sheng Sun , Desmond Yok Rue Chong , Ravi Kanth Kolan
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L23/3114 , H01L21/76897 , H01L23/49816 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/16225 , H01L2224/73204 , H01L2224/81024 , H01L2224/8191 , H01L2224/92125 , H01L2224/97 , H01L2924/00011 , H01L2924/01029 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2224/81 , H01L2924/00 , H01L2224/81805
摘要: A method of producing a chip scale package is disclosed. The method includes dicing a wafer into a plurality of chip arrays, each array including two or more integrated circuit chips. The method further includes mounting each array on a substrate and dicing each array, attached to the substrate, into individual chip scale packages, each individual chip scale package including only one integrated circuit chip.
摘要翻译: 公开了一种制造芯片级封装的方法。 该方法包括将晶片切割成多个芯片阵列,每个阵列包括两个或多个集成电路芯片。 该方法还包括将每个阵列安装在基板上并将附接到基板的每个阵列切割成单独的芯片级封装,每个单独的芯片级封装仅包括一个集成电路芯片。
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6.
公开(公告)号:US06420779B1
公开(公告)日:2002-07-16
申请号:US09395923
申请日:1999-09-14
申请人: Nirmal K. Sharma , Rahamat Bidin , Hien Boon Tan
发明人: Nirmal K. Sharma , Rahamat Bidin , Hien Boon Tan
IPC分类号: H01L23495
CPC分类号: H01L23/3114 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: An embodiment of the invention in a quad flat no-lead package is described. The package is produced by encapsulating an integrated circuit chip, a die pad to which the chip is affixed, and leads which are connected to the chip in a molding compound. Leads are positioned on all four sides of the package, the exposed (bottom) portions of the leads are coplanar with the bottom of the package, and the leads do not extend, or extend only slightly, beyond the area of the package. The package includes a die pad also having an exposed (bottom) portion that is coplanar with the bottom of the package. The top portions of the leads are coplanar with the top surface of the die pad, and are flat.
摘要翻译: 本发明的一个实施例描述在四平面无铅引线封装中。 该封装通过封装集成电路芯片,芯片固定到其上的芯片焊盘和在模制化合物中连接到芯片的引线来制造。 引线定位在封装的所有四个侧面上,引线的暴露(底部)部分与封装的底部共面,并且引线不会延伸或仅延伸超过封装区域。 封装包括还具有与封装的底部共面的暴露(底部)部分的管芯焊盘。 引线的顶部与管芯焊盘的顶表面共面,并且是平坦的。
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